Advanced Power
N-CHANNEL ENHANCEMENT MODE
Electronics Corp.
POWER MOSFET
Low Gate Charge
BV
DSS
600V
Repetitive Avalanche Rated
R
DS(ON)
8
Fast Switching
I
D
1.6A
Simple Drive Requirement
RoHS Compliant
Description
Absolute Maximum Ratings
Symbol
Units
V
DS
Drain-Source Voltage
V
V
GS
Gate-Source Voltage
V
I
D
@T
C
=25
Continuous Drain Current, V
GS
@ 10V
A
I
D
@T
C
=100
Continuous Drain Current, V
GS
@ 10V
A
I
DM
Pulsed Drain Current
1
A
P
D
@T
C
=25
Total Power Dissipation
W
W/
E
AS
Single Pulse Avalanche Energy
2
mJ
I
AR
Avalanche Current
A
E
AR
Repetitive Avalanche Energy
mJ
T
STG
T
J
Operating Junction Temperature Range
Thermal Data
Symbol
Value
Units
Rthj-c
Thermal Resistance Junction-case
Max.
3.2
/W
Rthj-a
Thermal Resistance Junction-ambient
Max.
110
/W
Data & specifications subject to change without notice
200705051-1/4
AP02N60H/J
64
-55 to 150
Parameter
1.6
30
1.6
1
Parameter
Rating
600
Pb Free Plating Product
Storage Temperature Range
-55 to 150
6
39
Linear Derating Factor
0.31
0.5
The TO-252 package is universally preferred for all commercial-
industrial surface mount applications and suited for AC/DC converters.
The through-hole version (AP02N60J) is available for low-profile
applications.
G
D S
TO-251(J)
G D
S
TO-252(H)
G
D
S
Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ. Max. Units
BV
DSS
Drain-Source Breakdown Voltage
V
GS
=0V, I
D
=250uA
600
-
-
V
B
V
DSS
/T
j
Breakdown Voltage Temperature Coefficient
Reference to 25
, I
D
=1mA
-
0.6
-
V/
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=1A
-
-
8
V
GS(th)
Gate Threshold Voltage
V
DS
=V
GS
, I
D
=250uA
2
-
4
V
g
fs
Forward Transconductance
V
DS
=10V, I
D
=1A
-
0.2
-
S
I
DSS
Drain-Source Leakage Current (T
j
=25
o
C)
V
DS
=600V, V
GS
=0V
-
-
10
uA
Drain-Source Leakage Current (T
j
=150
o
C)
V
DS
=480V
,
V
GS
=0V
-
-
100
uA
I
GSS
Gate-Source Leakage
V
GS
=30V
-
-
100
nA
Q
g
Total Gate Charge
3
I
D
=1.6A
-
14
20
nC
Q
gs
Gate-Source Charge
V
DS
=480V
-
2
-
nC
Q
gd
Gate-Drain ("Miller") Charge
V
GS
=10V
-
8.5
-
nC
t
d(on)
Turn-on Delay Time
3
V
DD
=300V
-
9.5
-
ns
t
r
Rise Time
I
D
=1.6A
-
12
-
ns
t
d(off)
Turn-off Delay Time
R
G
=10
,
V
GS
=10V
-
21
-
ns
t
f
Fall Time
R
D
=150
-
9
-
ns
C
iss
Input Capacitance
V
GS
=0V
-
155
240
pF
C
oss
Output Capacitance
V
DS
=25V
-
27
-
pF
C
rss
Reverse Transfer Capacitance
f=1.0MHz
-
14
-
pF
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min.
Typ. Max. Units
V
SD
Forward On Voltage
3
I
S
=1.6A, V
GS
=0V
-
-
1.5
V
t
rr
Reverse Recovery Time
I
S
=1.6A, V
GS
=0V,
-
360
-
ns
Q
rr
Reverse Recovery Charge
dI/dt=100A/s
-
1970
-
nC
Notes:
1.Pulse width limited by safe operating area.
2.Starting T
j
=25
o
C , V
DD
=50V , L=50mH , R
G
=25
, I
AS
=1.6A.
3.Pulse width <300us , duty cycle <2%.
AP02N60H/J
2/4
AP02N60H/J
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Normalized BV
DSS
v.s. Junction
Fig 4. Normalized On-Resistance
Temperature
v.s. Junction Temperature
Fig 5. Forward Characteristic of
Fig 6. Gate Threshold Voltage v.s.
Reverse Diode
Junction Temperature
3/4
0.8
0.9
1
1.1
1.2
-50
0
50
100
150
T
j
, Junction Temperature (
o
C)
N
o
rmalize
d
BV
DSS
(V
)
0
1
2
3
-50
0
50
100
150
T
j
, Junction Temperature (
o
C )
N
o
rmalize
d
R
DS(ON)
I
D
=1A
V
G
=10V
0
0.5
1
1.5
0
5
10
15
20
V
DS
, Drain-to-Source Voltage (V)
I
D
, Dr
a
i
n C
u
r
r
e
nt
(A
)
T
C
=25
o
C
10V
6.0V
5.5V
5.0V
V
G
= 4.5 V
0
0.3
0.6
0.9
0
5
10
15
20
V
DS
, Drain-to-Source Voltage (V)
I
D
, Dr
a
i
n C
u
r
r
e
nt
(A
)
T
C
=150
o
C
10V
6.0V
5.5V
5.0V
V
G
= 4.5 V
0.1
1
10
100
0
0.2
0.4
0.6
0.8
1
1.2
V
SD
, Source-to-Drain Voltage (V)
I
S
(A
)
T
j
= 150
o
C
T
j
= 25
o
C
1
2
3
4
5
-50
0
50
100
150
T
j
, Junction Temperature (
o
C )
V
GS(t
h)
(V
)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
4/4
AP02N60H/J
t
d(on)
t
r
t
d(off)
t
f
V
DS
V
GS
10%
90%
Q
V
G
10V
Q
GS
Q
GD
Q
G
Charge
10
100
1000
1
5
9
13
17
21
25
29
V
DS
, Drain-to-Source Voltage (V)
C (
p
F)
f=1.0MHz
C
iss
C
oss
C
rss
0
4
8
12
16
0
4
8
12
16
20
Q
G
, Total Gate Charge (nC)
V
GS
,
G
a
te
to S
o
u
r
c
e
Voltage
(
V
)
I
D
=1.6A
V
DS
=320V
V
DS
=400V
V
DS
=480V
0.01
0.1
1
0.00001
0.0001
0.001
0.01
0.1
1
t , Pulse Width (s)
N
o
rmalize
d
T
h
e
r
mal Re
spon
se
(
R
th
jc
)
P
DM
Duty factor = t/T
Peak T
j
= P
DM
x R
thjc
+ T
C
t
T
0.02
0.01
0.05
0.1
0.2
Duty factor=0.5
Single Pulse
0.01
0.1
1
10
1
10
100
1000
10000
V
DS
, Drain-to-Source Voltage (V)
I
D
(A
)
T
c
=25
o
C
Single Pulse
1ms
10ms
100ms
1s
DC
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