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Электронный компонент: AD9975ABSTEB

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REV. 0
a
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
Analog Devices, Inc., 2002
AD9975
Broadband Modem
Mixed-Signal Front End
FEATURES
Low Cost, 3.3 V-CMOS, Mixed Signal, Front End
Converter for Broadband Modems
10-Bit D/A Converter (TxDAC+
)
50 MSPS Input Word Rate
2 Interpolating Low-Pass Transmit Filter
100 MSPS DAC Output Update Rate
Wide (21 MHz) Transmit Bandwidth
Power-Down Modes
10-Bit, 50 MSPS A/D Converter
Fourth Order LPF with Selectable Cutoff Frequency
Dual Mode Programmable Gain Amplifier
Internal Clock Multiplier (PLL)
Two Auxiliary Clock Outputs
48-Lead LQFP Package
APPLICATIONS
Powerline Networking
Home Phone Networking
FUNCTIONAL BLOCK DIAGRAM
TXEN
RXEN
TXCLK
RXCLK
ADIO[9:0]
SPORT
OSCIN
XTAL
AD9975
PGA
LPF
PGA
ADC
REGISTER
CONTROL
3
3
10
CLK-GEN
TxDAC+
K
10
10
AGC[2:0]
TX+
TX
CLK1
CLK2
RX+
RX
GENERAL DESCRIPTION
The AD9975 is a single-supply, broadband modem, mixed
signal, front end (MxFETM) IC. The device contains a transmit
path interpolation filter and DAC and a receive path PGA,
LPF, and ADC required for a variety of broadband modem
applications. Also on-chip is a PLL clock multiplier that pro-
vides all required clocks from a single crystal or clock input.
The TxDAC+ uses a digital 2
interpolation low-pass filter to
oversample the transmit data and ease the complexity of analog
reconstruction filtering. The transmit path bandwidth is 21 MHz
when sampled at 100 MSPS. The 10-bit DAC provides differen-
tial current outputs. The DAC full-scale current can be adjusted
from 2 to 20 mA by a single resistor, providing 20 dB of additional
gain range.
The receive path consists of a PGA, LPF, and ADC. The program-
mable gain amplifier (PGA) has two modes of operation. One
mode allows programming through the serial port and provides a
gain range from 6 dB to +36 dB in 2 dB steps. The other mode
allows the gain to be controlled through an asynchronous 3-pin
port and offers a gain range from 0 dB to 48 dB in 8 dB steps
with the use of an external gain stage. The receive path LPF
cutoff frequency can be selected to either 12 MHz or 26 MHz.
The filter cutoff frequency can also be tuned or bypassed where
filter requirements differ. The 10-bit ADC uses a multistage
differential pipeline architecture to achieve excellent dynamic
performance with low power consumption.
The digital transmit and receive ports are multiplexed onto a
10-bit databus and have individual TX/RX clocks and TX/RX
enable lines. This interface connects directly to Homelug 1.0
PHY/MAC chips from Intellon and Conexant.
The AD9975 is available in a space-saving 48-lead LQFP pack-
age. The device is specified over the commercial (40
C to
+85
C) temperature range.
TxDAC+ is a registered trademark and MxFE is a trademark of Analog Devices, Inc.
REV. 0
2
AD9975SPECIFICATIONS
Test
Parameter
Temp
Level
Min
Typ
Max
Unit
OSC IN CHARACTERISTICS
Frequency Range
Full
I
10
50
MHz
Duty Cycle
25
C
II
40
50
60
%
Input Capacitance
25
C
III
3
pF
Input Impedance
25
C
III
100
M
CLOCK OUTPUT CHARACTERISTICS
CLKA Jitter (F
CLKA
Derived from PLL)
25
C
II
14
ps rms
CLKA Duty Cycle
25
C
III
50
5
%
TX CHARACTERISTICS
2
Interpolation Filter Characteristics
TX Path Latency, 2
Interpolation
Full
II
30
F
DAC
Cycles
Pass-Band Flatness 0 MHz to 20.7 MHz
Full
II
0.8
dB
Stop-Band Rejection @ 29.3 MHz
Full
II
35
dB
TxDAC
Resolution
Full
II
10
Bits
Conversion Rate
Full
II
10
100
MHz
Full-Scale Output Current
Full
II
2
10
20
mA
Voltage Compliance Range (TX+ or TX AVSS) Full
II
0.5
+1.5
V
Gain Error
25
C
II
5.5
2
+5.0
%FS
Output Offset
25
C
II
0
2
TBD
A
Differential Nonlinearity
25
C
III
0.5
LSB
Integral Nonlinearity
25
C
II
1
LSB
Output Capacitance
25
C
III
5
pF
Phase Noise @ 1 kHz Offset, 10 MHz Signal
25
C
III
100
dBc/Hz
Signal-to-Noise and Distortion (SINAD)
5 MHz Analog Out (20 MHz BW)
25
C
II
60.6
dB
Wideband SFDR (to Nyquist, 50 MHz max)
25
C
III
5 MHz Analog Out
25
C
III
76.2
dBc
Narrowband SFDR (3 MHz Window)
5 MHz Analog Out
25
C
III
77.9
dBc
IMD (f1 = 6.25 MHz, f2 = 7.8125 MHz)
25
C
III
77
dBFS
RX PATH CHARACTERISTICS (LFP Bypassed)
Resolution
N/A
N/A
10
Bits
Conversion Rate
Full
II
10
50
MHz
Pipeline Delay, ADC Clock Cycles
N/A
N/A
5.5
Cycles
Dynamic Performance (A
IN
= 0.5 dBFS, f = 5 MHz)
@ F
OSCIN
= 50 MHz, RX LPF Bypassed
Signal-to-Noise and Distortion Ratio (SINAD)
Full
III
56.6
dB
Effective Number of Bits (ENOB)
Full
III
9.1
Bits
Signal-to-Noise Ratio (SNR)
Full
III
59.2
dB
Total Harmonic Distortion (THD)
Full
III
60.1
dB
Spurious-Free Dynamic Range (SFDR)
Full
III
66
dB
RX PATH GAIN/OFFSET
Minimum Programmable Gain
25
C
I
6
dB
Maximum Programmable Gain
Narrow Band Rx LPF or Rx LPF Bypassed
25
C
I
+36
dB
Wideband Rx LPF
25
C
I
+30
dB
Gain Step Size
25
C
I
2
dB
Gain Step Accuracy
25
C
II
0.4
dB
Gain Range Error
Full
II
1.0
dB
Absolute Gain Error, PGA Gain = 0 dB
Full
II
0.8
dB
RX PATH INPUT CHARACTERISTICS
Input Voltage Range (Gain = 6 dB)
Full
III
4
Vppd
Input Capacitance
25
C
III
4
pF
Differential Input Resistance
25
C
III
270
Input Bandwidth (3 dB) (Rx LPF Bypassed)
25
C
III
50
MHz
Input Referred Noise (at +36 dB Gain with Filter)
25C
III
16
V rms
Input Referred Noise (at 6 dB Gain with Filter)
25C
III
684
V rms
Common-Mode Rejection
25C
III
40
dB
(V
S
= 3.3 V 10%, F
OSCIN
= 50 MHz, F
DAC
= 100 MHz, Gain = 6 dB,
R
SET
= 4.02 k
, 100
DAC Load.)
REV. 0
AD9975
3
Test
Parameter
Temp
Level
Min
Typ
Max
Unit
RX PATH LPF (Low Cutoff Frequency)
Cutoff Frequency
Full
III
12
MHz
Cutoff Frequency Variation
Full
III
7
%
Attenuation @ 22 MHz
Full
III
20
dB
Pass-Band Ripple
Full
II
1.0
dB
Group Delay Variation
Full
II
30
ns
Settling Time (to 1% FS, Min to Max Gain Change)
25
C
II
150
ns
Total Harmonic Distortion at Max Gain (THD)
Full
I
61
dBc
RX PATH LPF (High Cutoff Frequency)
Cutoff Frequency
Full
III
26
MHz
Cutoff Frequency Variation
Full
III
7
%
Attenuation @ 35 MHz
Full
III
20
dB
Pass-Band Ripple
Full
II
1.2
dB
Group Delay Variation
Full
II
15
ns
Settling Time (to 1% FS, Min to Max Gain Change)
25
C
II
80
ns
Total Harmonic Distortion at Max Gain (THD)
Full
I
61
dBc
RX PATH DIGITAL HPF
Latency (ADC Clock Source Cycles)
1
Cycle
Roll-Off in Stop Band
6
dB/Octave
3 dB Frequency
f
ADC
/400
Hz
POWER-DOWN/DISABLE TIMING
Power-Down Delay (Active-to-Power-Down)
DAC
25
C
II
200
ns
Interpolator
25
C
II
200
ns
Power-Up Delay (Power-Down-to-Active)
DAC
25
C
II
10
s
PLL
25
C
II
10
s
ADC
25
C
II
1000
s
PGA
25
C
II
1
s
LPF
25
C
II
1
s
Interpolator
25
C
II
200
ns
Minimum RESET Pulsewidth Low (t
RL
)
Full
III
5
f
OSCIN
Cycles
ADIO PORT INTERFACE
Maximum Input Word Rate
25
C
I
100
MHz
TX-Data Setup Time (t
SU
)
25
C
II
3.0
ns
TX-Hold Hold Time (t
HD
)
25
C
II
0
ns
RX-Data Valid Time(t
VT
)
25
C
II
3.0
ns
RX-Data Hold Time (t
HT
)
25
C
II
1.5
ns
REV. 0
4
AD9975
SPECIFICATIONS
(continued)
Test
Parameter
Temp
Level
Min
Typ
Max
Unit
SERIAL CONTROL BUS
Maximum SCLK Frequency (f
SCLK
)
Full
II
25
MHz
Clock Pulsewidth High (t
PWH
)
Full
II
18
ns
Clock Pulsewidth Low (t
PWL
)
Full
II
18
ns
Clock Rise/Fall Time
Full
II
10
s
Data/Chip-Select Setup Time (t
DS
)
Full
II
25
ns
Data Hold Time (t
DH
)
Full
II
0
ns
Data Valid Time (t
DV
)
Full
II
20
ns
CMOS LOGIC INPUTS
Logic "1" Voltage
25
C
II
V
DRVDD
0.7
V
Logic "0" Voltage
25
C
II
0.4
V
Logic "1" Current
25
C
II
12
A
Logic "0" Current
25
C
II
12
A
Input Capacitance
25
C
III
3
pF
CMOS LOGIC OUTPUTS (1 mA Load)
Logic "1" Voltage
Full
II
V
DRVDD
0.6
V
Logic "0" Voltage
25
C
II
0.4
V
Digital Output Rise/Fall Time
Full
II
1.5
2.5
ns
POWER SUPPLY
All Blocks Powered Up
I
S_TOTAL
(Total Supply Current)
25
C
I
210
227
mA
Digital Supply Current (I
DRVDD
+ I
DVDD
)
25
C
III
22.5
mA
Clock Supply Current (I
CLKVDD
)
25
C
III
5.5
mA
Analog Supply Current (I
AVDD
)
25
C
III
182
mA
Power Consumption of Functional Blocks
Rx LPF
25
C
III
110
mA
ADC and SPGA
25
C
III
55
mA
Rx Reference
25
C
III
2
mA
Interpolator
25
C
III
20
mA
DAC
25
C
III
18
mA
PLL-A
25
C
III
22
All Blocks Powered Down
I
S_TOTAL
(Total Supply Current)
25
C
I
21
27
mA
Digital Supply Current (I
DRVDD
+ I
DVDD
)
25
C
III
10
mA
Clock Supply Current (I
CLKVDD
)
25
C
III
0
mA
Analog Supply Current (I
AVDD
)
25
C
III
11
mA
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
*
Power Supply (V
S
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9 V
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA
Digital Inputs . . . . . . . . . . . . . . . . 0.3 V to DRVDD + 0.3 V
Analog Inputs . . . . . . . . . . . . . . . . . 0.3 V to AVDD + 0.3 V
Operating Temperature . . . . . . . . . . . . . . . . . . 40
C to +85C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150
C
Storage Temperature . . . . . . . . . . . . . . . . . . 65
C to +150C
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . . . 300
C
*Absolute Maximum Ratings are limiting values to be applied individually and
beyond which the serviceability of the circuit may be impaired. Functional
operability under any of these conditions is not necessarily implied. Exposure to
absolute maximum rating conditions for extended periods of time may affect
device reliability.
EXPLANATION OF TEST LEVELS
I.
Devices are 100% production tested at 25
C and guaranteed
by design and characterization testing for the commercial
operating temperature range (40
C to +85C).
II. Parameter is guaranteed by design and/or characterization
testing.
III. Parameter is a typical value only.
THERMAL CHARACTERISTICS
Thermal Resistance
48-Lead LQFP
JA
= 57C/W
JC
= 28C/W
REV. 0
AD9975
5
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD9975 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
PIN CONFIGURATION
1
OSC IN
2
SENABLE
3
SCLK
4
SDATA
5
AVDD
6
AVSS
7
TX+
8
TX
9
AVSS
10
FS ADJ
11
REFIO
12
CLKVDD
36
DRVSS
35
DRVDD
34
RXBOOST/SDO
33
CLKOUT2
32
RXCLK
31
TXCLK
30
TXEN
29
RXEN
28
ADIO0
27
ADIO1
26
ADIO2
25
ADIO3
13
D
VSS
14
DV
D
D
15
A
GC2
16
A
GC1
17
A
GC0
18
CLK
OUT1
19
ADIO9
20
ADIO8
21
ADIO7
22
ADIO6
23
ADIO5
24
ADIO4
48
XT
AL
47
AV
D
D
46
A
VSS
45
RX
44
RX+
43
A
VSS
42
A
VSS
41
REFT
40
REFB
39
A
VSS
38
AV
D
D
37
RESET
AD9975
48-PIN LQFP
TOP VIEW
(Not to Scale)
PIN FUNCTION DESCRIPTION
Pin No.
Mnemonic
Function
1
OSC IN
Crystal Oscillator Inverter Input
2
SENABLE
Serial Bus Enable Input
3
SCLK
Serial Bus Clock Input
4
SDATA
Serial Bus Data I/O
5, 38, 47
AVDD
Analog 3.3 V Power Supply
6, 9, 39, 42,
AVSS
Analog Ground
43, 46
7
Tx+
Transmit DAC + Output
8
Tx
Transmit DAC Output
10
FS ADJ
DAC Full-Scale Output Current
Adjust with External Resistor
11
REFIO
DAC Band Gap Decoupling Node
12
CLKVDD
Power Supply for CLKOUT1
13
DVSS
Digital Ground
14
DVDD
Digital 3.3 V Power Supply
1517
AGC[2:0]
AGC Control Inputs
18
CLKOUT1
Auxiliary Clock Output
1928
ADIO[9:0]
Digital Data I/O Port
29
RXEN
ADIO Direction Control Input
30
TXEN
TX Path Enable
31
TXCLK
ADIO Sample Clock Input
32
RXCLK
ADIO Request Clock Input
33
CLKOUT2
Auxiliary Clock Output
34
RXBOOST/
External Gain Control Output/
SDO
Serial Data Output
35
DRVDD
Digital I/O 3.3 V Power Supply
36
DRVSS
Digital I/O Ground
37
RESET
Reset Input
40, 41
REFB, REFT ADC Reference Decoupling Node
44
Rx+
Receive Path + Input
45
Rx
Receive Path Input
48
XTAL
Crystal Oscillator Inverter Output
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD9975ABST
40C to +85C
48-Lead LQFP
ST-48
AD9975ABSTEB
40C to +85C
AD9975 EVAL Board
AD9975ABSTRL
40C to +85C
AD9975ABST Reel
REV. 0
6
AD9975
DEFINITIONS OF SPECIFICATIONS
Clock Jitter
The clock jitter is a measure of the intrinsic jitter of the PLL
generated clocks. It is a measure of the jitter from one rising
edge of the clock with respect to another edge of the clock nine
cycles later.
Differential Nonlinearity Error (DNL, No Missing Codes)
An ideal converter exhibits code transitions that are exactly 1 LSB
apart. DNL is the deviation from this ideal value. Guaranteed no
missing codes to 10-bit resolution indicate that all 1024 codes,
respectively, must be present over all operating ranges.
Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code from
a line drawn from "negative full scale" through "positive full
scale." The point used as negative full scale occurs 1/2 LSB
before the first code transition. Positive full scale is defined as a
level 1 1/2 LSB beyond the last code transition. The deviation is
measured from the middle of each particular code to the true
straight line.
Phase Noise
Single-sideband phase noise power density is specified relative
to the carrier (dBc/Hz) at a given frequency offset (1 kHz) from
the carrier. Phase noise can be measured directly on a generated
single tone with a spectrum analyzer that supports noise marker
measurements. It detects the relative power between the carrier
and the offset (1 kHz) sideband noise and takes the resolution
bandwidth (rbw) into account by subtracting 10 log(rbw). It also
adds a correction factor that compensates for the implementation
of the resolution bandwidth, log display, and detector characteristic.
Output Compliance Range
The range of allowable voltage at the output of a current-output
DAC. Operation beyond the maximum compliance limits may
cause either output stage saturation, resulting in nonlinear per-
formance, or breakdown.
Spurious-Free Dynamic Range (SFDR)
The difference, in dB, between the rms amplitude of the DAC's
output signal (or ADC's input signal) and the peak spurious
signal over the specified bandwidth (Nyquist bandwidth, unless
otherwise noted).
Pipeline Delay (Latency)
The number of clock cycles between conversion initiation and
the associated output data being made available.
Offset Error
First transition should occur for an analog value 1/2 LSB above
negative full scale. Offset error is defined as the deviation of the
actual transition from that point.
Gain Error
The first code transition should occur at an analog value 1/2 LSB
above negative full scale. The last transition should occur for an
analog value 1 1/2 LSB below the nominal full scale. Gain error
is the deviation of the actual difference between first and last
code transitions and the ideal difference between first and last
code transitions.
Input Referred Noise
The rms output noise is measured using histogram techniques.
The ADC output code's standard deviation is calculated in LSB
and converted to an equivalent voltage. This results in a
noise figure that can directly be referred to the RX input of
the AD9975.
Signal-to-Noise and Distortion Ratio (SINAD)
SINAD is the ratio of the rms value of the measured input signal
to the rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
SINAD is expressed in decibels.
Effective Number of Bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number
of bits. Using the following formula,
N
SINAD
dB
= (
.
)
/ .
1 76
6 02
it is possible to get a measure of performance expressed as N,
the effective number of bits.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured input signal to
the rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic com-
ponents to the rms value of the measured input signal and is
expressed as a percentage or in decibels.
Power Supply Rejection
Power supply rejection specifies the converter's maximum
full-scale change when the supplies are varied from nominal to
minimum and maximum specified voltages.
REV. 0
Typical Performance CharacteristicsAD9975
7
F
SAMPLE
10
0
0.2
0.4
0.6
0.8
1.0
MA
GNITUDE dB
20
60
80
100
0
10
40
70
90
0.1
0.3
0.5
0.7
0.9
50
30
INTERPOLATION FILTER
INCLUDING
SIN(X)/X
TPC 1. 2
Low-Pass Interpolation Filter
F
S
MHz
10
0
0.2
0.4
0.6
0.8
1.0
MA
GNITUDE dB
20
60
80
100
0
10
40
70
90
0.1
0.3
0.5
0.7
0.9
50
30
INTERPOLATION FILTER
INCLUDING
SIN(X)/X
TPC 2. 2
Band-Pass Interpolation Filter, F
S
/2
Modulation, Adjacent Image Preserved
FREQUENCY MHz
0
10
20
30
40
MA
GNITUDE dBc
20
60
80
100
0
10
40
70
90
5
15
25
35
45
50
30
TPC 3. Single Tone Spectral Plot @ f
DATA
= 50 MSPS,
f
OUT
= 5 MHz, 2
LPF
FREQUENCY MHz
0
10
20
30
40
MA
GNITUDE dBc
20
60
80
100
0
10
40
70
90
5
15
25
35
45
50
30
TPC 4. Single Tone Spectral Plot @ f
DATA
= 50 MSPS,
f
OUT
= 11 MHz, 2
LPF
FREQUENCY MHz
10
10.0
10.4
10.8
11.2
11.6
12.0
dBc
20
60
80
100
0
10
40
70
90
1.02
10.6
11.0
11.4
11.8
50
30
TPC 5. Dual Tone Spectral Plot @ f
DATA
= 50 MSPS,
f
OUT
= 6.7 MHz and 7.3 MHz, 2
LPF
FREQUENCY MHz
70
0
MA
GNITUDE dBc
74
76
72
4
1
2
3
5
6
7
8
9
11 12 13 14 15 16 17 18 19 20
10
78
80
82
84
86
88
90
THIRD ORDER
HARMONIC
SECOND ORDER
HARMONIC
TPC 6. Harmonic Distortion vs. f
OUT
@f
DATA
= 50 MSPS
REV. 0
8
AD9975
FREQUENCY MHz
10
10.003
10.005
10.007
10.009
10.011
10.013
dBc
20
60
80
100
0
10
40
70
90
10.004
10.006
10.008
10.010
10.012
50
30
TPC 7. Phase Noise Plot @f
DATA
50 MSPS,
f
OUT
= 10 MHz, 2
LPF
FREQUENCY MHz
10
3
dBc
30
50
70
10
40
60
20
0
5
7
9
11
13
15
17
19
21
23
TPC 8. "In-Band" Multitone Spectral Plot
@f
DATA
= 50 MSPS, f
OUT
= k
195 kHz, 2 LPF
FREQUENCY MHz
10
1
dBc
30
50
70
10
40
60
20
0
11
21
31
41
51
61
71
81
91
101
TPC 9. "Wide-Band" Multitone Spectral Plot
@f
DATA
= 50 MSPS, f
OUT
= k
195 kHz, 2 LPF
TUNING TARGET Decimal
35
FREQ
UENCY MHz
30
192
25
20
208
224
240
255
TPC 10. F
C
vs. Tuning Target, F
ADC
= 50 MHz,
LPF = Wideband Rx Filter
TUNING TARGET Decimal
20
FREQ
UENCY MHz
18
192
12
10
208
224
240
255
16
14
TPC 11. F
C
vs. Tuning Target, F
ADC
= 50 MHz,
LPF = Narrowband Rx Filter
0.60
6
0.20
0.80
0.20
0.60
0
0.40
0.40
36
GAIN A
CCURA
CY dB
VGA GAIN dB
4 2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
TPC 12. PGA Gain Error vs. Gain
REV. 0
AD9975
9
2.5
6
1.8
1.5
2.1
1.6
1.9
2.3
1.7
36
OFFSET LSBs
VGA GAIN dB
4 2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
2.4
2.0
2.2
TPC 13. PGA Gain Step vs. Gain
1MHz
10MHz
100MHz
12.1MHz
0
LOG MAG
5dB/Div
3.0dB
REF 0dB
TPC 14. Rx LPF Frequency Response, LPF =
Narrowband Rx Filter, F
ADC
= 50 MHz,
Tuning Target = 255
9.9MHz
1MHz
10MHz
100MHz
0
DELAY
10ns/Div
70.1ns
REF 0s
TPC 15. Rx LPF Frequency Response, LPF =
Wideband Rx Filter, F
ADC
= 50 MHz,
Tuning Target = 255
24.1MHz
1MHz
10MHz
100MHz
0
LOG MAG
REF 0dB
3.0dB
5dB/Div
TPC 16. Rx LPF Group Delay, LPF = Narrowband
Rx Filter, F
ADC
= 50 MHz, Tuning Target = 255
22.1MHz
1MHz
10MHz
100MHz
0
DELAY
5 ns/Div REF 0s
33.9ns
TPC 17. Rx LPF Group Delay, LPF = Wideband Rx
Filter, F
ADC
= 50 MHz, Tuning Target = 255
123.5 kHz
0
LOG MAG
5dB/Div
REF 0dB
3.00dB
10kHz
100kHz
1MHz
TPC 18. Rx HPF Frequency Response, F
ADC
= 50 MHz
REV. 0
10
AD9975
4000
1
3000
2400
3600
2600
3200
2800
ADC OUTPUT CODE
ADC CLOCK CYCLES
3400
3800
5
9
13
17
21
25
29
33
37
TPC 19. Rx Path Settling, 1/2 Scale Rising Step with
Gain Change, LPF F
C
= 26 MHz, F
ADC
= 50 MHz
4000
1
3000
2400
3600
2600
3200
2800
ADC OUTPUT CODE
ADC CLOCK CYCLES
3400
3800
5
9
13
17
21
25
29
33
37
TPC 20. Rx Path Settling, 1/2 Scale Falling Step with
Gain Change, LPF F
C
= 26 MHz, F
ADC
= 50 MHz
20
8.75
9.50
9.00
8.50
ENOBs
F
S
MHz
9.25
25
30
40
50
35
45
TPC 21. Rx Path ENOB vs. F
ADC
,
F
IN
= 5 MHz,
Gain = 6 dB, Rx LPF Bypassed
20
56
59
57
55
MA
GNITUDE dB
F
S
MHz
58
25
30
40
50
35
45
60
TPC 22. Rx Path SNR vs. F
ADC
,
F
IN
= 5 MHz,
Gain = 6 dB, Rx LPF Bypassed
20
60
65
MA
GNITUDE dB
F
S
MHz
25
30
40
50
35
45
55
TPC 23. Rx Path THD vs. F
ADC
,
F
IN
= 5 MHz,
Gain = 6 dB, Rx LPF Bypassed
0
8.7
9.3
8.9
8.5
ENOBs
F
IN
MHz
9.1
2
6
14
18
10
16
9.5
4
8
12
20
TPC 24. Rx Path ENOB vs. F
IN
, F
ADC
= 50 MHz,
Gain = 6 dB, Rx LPF Bypassed
REV. 0
AD9975
11
0
51
54
52
50
MA
GNITUDE dB
F
IN
MHz
53
2
6
14
18
10
16
55
4
8
12
20
56
57
58
TPC 25. Rx Path SNR vs. F
IN
,
F
ADC
=
50 MHz,
Gain = 6 dB, Rx LPF Bypassed
0
70
55
65
75
MA
GNITUDE dB
F
IN
MHz
60
2
6
14
18
10
16
50
4
8
12
20
TPC 26. Rx Path THD vs. F
IN
,
F
ADC
= 50 MHz,
Gain = 6 dB, Rx LPF Bypassed
REV. 0
12
AD9975
TRANSMIT PATH
The AD9975 transmit path consists of a digital interface port,
a bypassable 2
interpolation filter, and a transmit DAC. The
clock signals required by these blocks are generated by the inter-
nal PLL. The block diagram below shows the interconnection
between the major functional components of the transmit path.
INTERPOLATION FILTER
The interpolation filter can be programmed to run at a 2
upsampling ratio in either a low-pass filter or band-pass filter
mode. The transfer functions of these two modes are shown in
TPC 1 and TPC 2, respectively. The y-axes of the figures show
the magnitude response of the filters in dB, and the x-axes show
the frequency normalized to F
DAC
. The top trace of the plot shows
the discrete time transfer function of the interpolation filter. The
bottom trace shows the TX path transfer function including the
sin(x)/x transfer function of the DAC. In addition to the two
upsampling modes, the interpolation filter can be programmed
into a pass-through mode if no interpolation filtering is desired.
The table below shows the following parameters as a function of
the mode in which it is programmed.
Latency The number of clock cycles from the time a digital
impulse is written to the DAC until the peak value is output at
the TX+ and TX Pins.
Flush The number of clock cycles from the time a digital
impulse is written to the DAC until the output at the TX+ and
TX Pins settles to zero.
F
PASS
The frequency band over which the pass-band ripple is
less than the stated magnitude (i.e., 0.1 dB or 1.0 dB).
F
STOP
The frequency band over which the stop-band attenuation
is greater than the stated magnitude (i.e., 40 dB or 50 dB).
Table I. Interpolation Filters vs. Mode
Register 7[7:4]
0x1
0x5
Mode
2
LPF
2
BPF, Adj. Image
Latency, F
DAC
Clock Cycles
30
30
Flush, F
DAC
Clock Cycles
48
48
F
PASS
, 0.1 dB
<0.204
>0.296, <0.704
F
PASS
, 1.0 dB
<0.207
>0.293, <0.707
F
STOP
, 40 dB
<0.296
>0.204, <0.796
F
STOP
, 50 dB
<0.302
<0.198, >0.802
DPLL-A CLOCK DISTRIBUTION
Figure 1 shows the clock signals used in the transmit path. The
DAC sampling clock, f
DAC
, is generated by DPLL-A. f
DAC
has a
frequency equal to L
f
OSCIN
, where L is the PLL clock multiplier
value and f
OSCIN
is the frequency of the input to PLL-A. The value
of L is programmed through the serial interface port and can be
set to 1, 2, 4, or 8. The transmit path expects a new input sample
at the ADIO interface at a rate of f
DAC
/2 if the interpolation
filter is being used. If the interpolation filter is bypassed, the
transmit path expects a new input sample at the ADIO interface
at a rate of f
DAC.
D/A CONVERTER
The AD9975 DAC provides differential output current on the
TX+ and TX pins. The values of the output currents are comple-
mentary, meaning they will always sum to I
FS
, the full-scale
current of the DAC. For example, when the current from TX+
is at full scale, the current from TX is zero. The two currents
will typically drive a resistive load that will convert the output
currents to a voltage. The TX+ and TX output currents are
inherently ground seeking and should each be connected to
matching resistors, R
L
, that are tied directly to AGND.
The full-scale output current of the DAC is set by the value of
the resistor placed from the FS ADJ pin to AGND. The rela-
tionship between the resistor, R
SET
, and the full-scale output
current is governed by the following equation:
I
R
FS
SET
= 39 4
. /
The full-scale current can be set from 2 to 20 mA. Generally, there
is a trade-off between DAC performance and power consumption.
The best DAC performance will be realized at an I
FS
of 20 mA.
However, the value of I
FS
adds directly to the overall current
consumption of the device.
The single-ended voltage outputs appearing at the TX+ and
TX nodes are:
V
I
R
TX
TX
L
+
+
=
V
I
R
TX
TX
L
=
Note that the full-scale voltage of V
TX+
and V
TX
should not
exceed the maximum output compliance range of 1.5 V to pre-
vent signal compression. To maintain optimum distortion and
linearity performance, the maximum voltages at V
TX+
and V
TX
should not exceed
0.5 V.
The single-ended full-scale voltage at either output node will be:
V
I
R
FS
FS
L
=
The differential voltage, V
DIFF
, appearing across V
TX+
and V
TX
is:
V
I
I
R
DIFF
TX
TX
L
=
+
(
)
and
V
I
R
DIFF
FS
FS
L
_
=
It should be noted that the differential output impedance of the
DAC is 2
R
L
and any load connected across the two output
resistors will load down the output voltage accordingly.
REV. 0
AD9975
13
RECEIVE PATH DESCRIPTION
The receive path consists of a two stage PGA, a continuous
time, 4-pole LPF, an ADC, and a digital HPF. Also working
in conjunction with the receive path is an offset correction
circuit and a digital phase-locked loop. Each of these blocks
will be discussed in detail in the following sections.
PROGRAMMABLE GAIN AMPLIFIER
The PGA has a programmable gain range from 6 dB to +36 dB
if the narrower (approximately 12 MHz) LPF bandwidth is selected,
or if the LPF is bypassed. If the wider (approximately 29 MHz)
LPF bandwidth is selected, the gain range is 6 dB to +30 dB.
The PGA is comprised of two sections, a continuous time PGA
(CPGA), and a switched capacitor PGA (SPGA). The CPGA
has possible gain settings of 0, 6, 12, 18, 24 and 30. The SPGA
has possible gain settings of 6 dB, 4 dB, 2 dB, 0 dB, +2 dB,
+4 dB, and +6 dB. Table II shows how the gain is distributed
for each programmed gain setting.
The CPGA input appears at the device RX+ and RX input pins.
The input impedance of this stage is nominally 270
differential
and is not gain dependent. It is best to ac-couple the input signal
to this stage and let the inputs self-bias. This will lower the
offset voltage of the input signal, which is important at higher
gains, since any offset will lower the output compliance range of
the CPGA output. When the inputs are driven by direct coupling,
the dc level should be AVDD/2. However, this could lead to
larger dc offsets and reduce the dynamic range of the RX path.
There are two modes for selecting the RX path gain. The first
mode is to program the PGA through the serial port. A 5-bit
word determines the gain with a resolution of 2 dB per step.
More detailed information about this mode is included in the
Register Programming Definitions section of this data sheet.
The second mode sets the gain through the asynchronous
AGC[2:0] pins. These three pins set the PGA gain and state of
the RXBOOST pin according to Table II.
Table II. AGC[2:0] Gain Mapping
Rx
AGC
Path
CPGA
SPGA
[2:0]
Gain
Gain
Gain
RXBOOST
0x00
6
6
0
0
0x01
6
6
0
0
0x02
2
6
8
0
0x03
10
0
10
0
0x04
2
6
8
1
0x05
10
0
10
1
0x06
18
12
6
1
0x07
26
18
8
1
LOW-PASS FILTER
The low-pass filter (LPF) is a programmable, three-stage, fourth
order low-pass filter. The first real pole is implemented within
the CPGA. The second filter stage implements a complex pair
of poles. The last real pole is implemented in a buffer stage that
drives the SPGA.
There are two pass band settings for the LPF. Within each pass
band, the filters are tunable over about a
15% frequency range.
The formula for the cutoff frequency is:
F
F
Target
C
ADC
=
+
64
64
/ (
)
Where Target is the decimal value programmed as the tuning
target in Register 5.
This filter may also be bypassed. In this case, the bandwidth of
the RX path will be gain dependent and will be around 50 MHz
at the highest gain settings.
ADC
The AD9975's analog-to-digital converter implements pipelined
multistage architecture to achieve high sample rates while consum-
ing low power. The ADC distributes the conversion over several
smaller A/D subblocks, refining the conversion with progressively
higher accuracy as it passes the results from stage to stage. As a
consequence of the distributed conversion, ADCs require a small
fraction of the 2
n
comparators used in a traditional n-bit flash-
type A/D. A sample-and-hold function within each of the stages
permits the first stage to operate on a new input sample while the
remaining stages operate on preceding samples. Each stage of
the pipeline, excluding the last, consists of a low resolution
Flash A/D connected to a switched capacitor DAC and interstage
residue amplifier (MDAC). The residue amplifier amplifies the
difference between the reconstructed DAC output and the flash
input for the next stage in the pipeline. One bit of redundancy is
used in each one of the stages to facilitate digital correction of
flash errors. The last stage simply consists of a Flash A/D.
SHA
GAIN
A/D
D/A
AINP
AINN
SHA
GAIN
A/D
D/A
A/D
CORRECTION LOGIC
Figure 1. ADC Theory of Operation
The digital data outputs of the ADC are represented in straight
binary format. They saturate to full scale or zero when the input
signal exceeds the input voltage range.
The maximum value will be output from the ADC when the
RX+ input is 1 V or more greater than the RX input. The mini-
mum value will be output from the ADC when the RX input is
1 V or more greater than the RX+ input. This results in a full-scale
ADC voltage of 2 Vppd.
The data can be translated to straight binary data format by
simply inverting the most significant bit.
The timing of the interface is fully described in the Digital Inter-
face Port Timing section.
REV. 0
14
AD9975
DIGITAL HPF
Following the ADC, there is a bypassable digital HPF. The
response is a single pole IIR HPF. The transfer function is
approximately:
H z
Z
Z
( )
(
.
) / (
.
)
=
0 99994
0 98466
where the sampling period is equal to the ADC clock period.
This results in a 3 dB frequency approximately 1/400th of the
ADC sampling rate. The transfer function of the digital HPF with
an ADC sample rate of 50 MSPS is plotted in TPC 23.
The digital HPF introduces a 1 ADC clock cycle latency. If the
HPF function is not desired, the HPF can be bypassed and the
latency will not be incurred.
CLOCK AND OSCILLATOR CIRCUITRY
The AD9975 generates all internally required clocks from a single
clock source. This source can be supplied in one of two ways.
The first method uses the on-chip oscillator by connecting a
fundamental frequency quartz crystal between the OSC IN (Pin 1)
and XTAL (Pin 48) with parallel resonant load capacitors as
specified by the crystal manufacturer. Alternatively, a TTL-level
clock applied to OCS IN with the XTAL pin left unconnected
can overdrive the internal oscillator circuit.
The PLL has a frequency capture range between 10 MHz and
50 MHz.
AGC TIMING CONSIDERATIONS
When implementing the AGC timing loop, it is important to
consider the delay and settling time of the RX path in response
to a change in gain. Figure 2 shows the delay the receive signal
experiences through the blocks of the RX path. Whether the gain
is programmed through the serial port or via the AGC[2:0] pins,
the gain takes effect immediately with the delays shown in Figure 2.
When gain changes do not involve the CPGA, the new gain will
be evident in samples after about 7 ADC clock cycles. When the
gain change does involve the CPGA, it takes an additional 45 ns
to 70 ns due to the propagation delays of the buffer, LPF and PGA.
Table VI in the Register Programming section details the PGA
programming map.
PGA
DIGITAL HPF
SHA
A/D
BUFFER
LPF
DECODE LOGIC
5ns
1 CLK CYCLE
5 CLK CYCLE 1/2 CLK CYCLE
10ns
25ns OR 50ns
10ns
GAIN REGISTER
Figure 2. AGC Loop Timing
AGC PROGRAMMING
The gain in the receive path can be programmed in two ways.
The default method is through the AGC[2:0] pins. In this mode,
the gain is achieved using a combination of internal and external
gain. The external gain is controlled by the RXBOOST output
pin, which is determined by the decode of the 3-bit AGC gain value.
DIGITAL INTERFACE PORT OPERATION
The digital interface port is a 10-bit bidirectional bus shared in
burst fashion between the transmit path and receive path. The
MxFE acts as a slave to the digital ASIC, accepting two input
enable signals, TXEN and RXEN, as well as two input clock
signals, TXCLK and RXCLK. Because the sampling clocks for
the DAC and ADC are derived internally from the OSC IN
signal, it is required that the TXCLK and RXCLK signals are
exactly the same frequency as the OSC IN signal. The phase
relationships between the TXCLK, RXCLK, and OSC IN signal
are arbitrary.
In order to add flexibility to the digital interface port, there are
several programming options available. The data input format is
straight binary by default. It is possible to independently change
the data format of the transmit path and receive path to twos
complement. Also, the clock timing can be independently changed
on the transmit and receive paths by selecting either the rising
or falling clock edge as the validating/sampling edge of the clock.
The digital interface port can also be programmed into a three-
state output mode allowing it to be connected onto a shared bus.
The timing of the interface is fully described in the Digital Inter-
face Port Timing section.
CLOCK DISTRIBUTION
The DAC sampling clock, f
DAC
, is generated by the internal
digital phase-locked loop (DPLL). f
DAC
has a frequency equal to
L
f
OSCIN
, where f
OSCIN
is the internal signal generated either by
the crystal oscillator when a crystal is connected between the
OSC IN and XTAL pins or by the clock that is fed into the
OSC IN pin, and L is the multiplier programmed through the
serial port. L can have the values of 1, 2, 4, or 8.
When the interpolation filter is enabled (either 2
LPF or 2 BPF
is selected), the data rate is upsampled by a factor of two. In this
case, the transmit path expects a new data input word at the rate
of f
DAC
/2. When the interpolation filter is bypassed, the transmit
path expects a new input word at the same frequency as DAC
sampling clock, f
DAC
.
Therefore, in terms of f
OSCIN
, the TXCLK
frequency should be:

f
L
f
K
TXCLK
OSCIN
=
/
where K is the interpolation factor. The interpolation factor, K, is
equal to 2 when the interpolator is enabled and is equal to 1 when
the interpolator is bypassed.
The ADC sampling clock is derived from f
OSCIN
and a new
output sample is available every f
OSCIN
clock cycle. The ADC
sampling lock can be programmed to be equal to f
OSCIN
if desired.
The timing of the digital interface port is illustrated in the
Figures 3 and 4.
REV. 0
AD9975
15
DIGITAL INTERFACE PORT TIMING
The ADIO[9:0] bus accepts input data-words into the transmit
path when the TXEN pin is high, the RXEN pin is low, and a
clock is present on the TXCLK pin. Figure 3 illustrates the
transmit path input timing.
TXCLK
TXEN
ADIO[9:0]
RXEN
TX0
TX1
TX2
TX3
TX4
t
HD
t
SU
Figure 3. Transmit Data Input Timing Diagram
It should be noted that to clear the transmit path input buffers,
an additional six clock cycles on the TXCLK input are required
after TXEN goes low. The interpolation filters will be "flushed"
with zeros if the clock signal into the TXCLK pin is present for
48 clock cycles after TXEN goes low (the data on the ADIO
bus being irrelevant over this interval).
The output from the receive path will be driven onto the
ADIO[9:0] bus when the RXEN pin is high, and a clock is present
on the RXCLK pin. When both TXEN and RXEN are low, the
ADIO[9:0] bus is three-stated. Figure 4 illustrates the receive
path output timing.
RXCLK
RXEN
ADIO[9:0]
t
VT
RX0
RX1
RX2
RX3
t
HT
Figure 4. Receive Data Output Timing Diagram
SERIAL INTERFACE FOR REGISTER CONTROL
The serial port is a 3-wire serial communications port consisting
of a clock (SCLK), chip select (
SENABLE), and a bidirectional
data (SDATA) signal. The interface allows read/write access to
all registers that configure the AD9975 internal parameters.
Single or multiple byte transfers are supported as well as MSB
first or LSB first transfer formats.
General Operation of the Serial Interface
Serial communication over the serial interface can be from 1 byte
to 5 bytes in length. The first byte is always the instruction byte.
The instruction byte establishes whether the communication is
going to be a read or write access, the number of data bytes to be
transferred, and the address of the first register to be accessed.
The instruction byte transfer is complete immediately upon the
eighth rising edge of SCLK after
SENABLE is asserted. Likewise,
the data registers change immediately upon writing to the eighth
bit of each data byte.
Instruction Byte
The instruction byte contains the information shown in Table III.
Table III. Instruction Byte Bit Definitions
MSB
LSB
I7
I6
I5
I4
I3
I2
I1
I0
R/W
N1
N0
A4
A3
A2
A1
A0
Bit I7 R/W
This bit determines whether a read or a write data transfer will
occur after the instruction byte write. Logic high indicates a read
operation, and Logic 0 indicates a write operation.
Bits I6:I5 N1:N0
These two bits determine the number of bytes to be transferred
during the data transfer cycle. The bit decodes are shown in
Table IV.
Table IV. N1:N0 Bit Map
N1:N0
Description
0:0
Transfer 1 Byte
0:1
Transfer 2 Bytes
1:0
Transfer 3 Bytes
1:1
Transfer 4 Bytes
Bits I4:I0 - A4:A0
These bits determine which register is accessed during the data
transfer portion of the communications cycle. For multibyte
transfers, this address is the starting byte address. The remaining
register addresses are generated by the AD9975.
Serial Interface Port Pin Description
SCLK--Serial Clock
The serial clock pin is used to synchronize data transfers to and
from the AD9975 and to run the internal state machines. SCLK
maximum frequency is 25 MHz. All data transmitted to the
AD9975 is sampled on the rising edge of SCLK. All data read
from the AD9975 is validated on the rising edge of SCLK and is
updated on the falling edge.
SENABLE--Serial Interface Enable
The
SENABLE Pin is active low. It enables the serial communi-
cation to the device.
SENABLE select should stay low during
the entire communication cycle. All input on the serial port is
ignored when
SENABLE is inactive.
SDATA--Serial Data I/O
The signal on this line is sampled on the first eight rising edges
of SCLK after
SENABLE goes active. Data is then read from or
written to the AD9975 depending on what was read.
Figures 5 and 6 show the timing relationships between the three
SPI signals.
INSTRUCTION BIT 7
INSTRUCTION BIT 6
t
DS
SENABLE
t
DS
t
SCLK
t
PWL
t
PWH
t
HT
SCLK
SDATA
Figure 5. Timing Diagram Register Write to AD9975
REV. 0
16
AD9975
INSTRUCTION BIT n
INSTRUCTION BIT n1
SCLK
SDATA
t
DV
Figure 6. Timing Diagram Register Read from AD9975
MSB/LSB Transfers
The AD9975 serial port can support both most significant bit
(MSB) first or least significant bit (LSB) first data formats. The
bit order is controlled by the SPI LSB First Bit (Register 0, Bit 6).
The default value is 0, MSB first. Multibyte data transfers in
MSB format can be completed by writing an instruction byte
that includes the register address of the last address to be accessed.
The AD9975 will automatically decrement the address for each
successive byte required for the multibyte communication cycle.
When the SPI LSB First Bit (Register 0, Bit 6) is set high, the
serial port interprets both instruction and data bytes LSB first.
Multibyte data transfers in LSB format can be completed by
writing an instruction byte that includes the register address of
the first address to be accessed. The AD9975 will automatically
increment the address for each successive byte required for the
multibyte communication cycle.
Figures 7a and 7b show how the serial port words are built for
each of these modes.
SCLK
SDATA
SENABLE
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
R/W
I6(n) I5(n) I4
I3
I2
I1
I0
D7n D6n
D6n D7n
Figure 7a. Serial Register Interface Timing MSB First
SCLK
SDATA
SENABLE
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
I0
I1
I2
I3
I4
I5(n) I6(n)
D00 D10 D20
D6n D7n
R/W
Figure 7b. Serial Register Interface Timing LSB First
Notes on Serial Port Operation
The serial port is disabled and all registers are set to their default
values during a hardware reset. During a software reset, all regis-
ters except Register 0 are set to their default values. Register 0
will remain at the last value sent, with the exception that the
Software Reset Bit will be set to 0.
Table V. Register Layout
Address
Default
(hex)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
(hex)
Type
00
Select 4-Wire LSB/MSB
Software
00
R/W
SPORT
First
Reset
01
Power-
Power-
Power-Down Power-Down Power-
Power-Down 00
R/W
Down
Down
Interpolators RX Reference Down ADC Receive Filter
PLL-A
DAC
and SPGA
and CPGA
02
00
R/W
03
ADC Clock
PLL-A (xL)
01
R/W
Source
Multiplier [1:0]
OSC IN/2
04
RX LPF
RX LPF
RX Path
RX Digital Fast ADC
Wideband RX Enable
RX LPF
01
R/W
Tuning
Tuning
DC Offset HPF
Sampling
LPF
1-Pole
Bypass
Update
Update in
Correction Bypass
RX LPF
Disable
Progress
05
RX LPF Filter Tuning Target [7:0]
80
R/W
06
RXBOOST
RXBOOST PGA Gain
RX PGA Gain [4:0]
00
R/W
Active Low
Setting
through
Register
07
TX Interpolation Filter Select
Sample TX TX Data
10
R/W
on Falling
Input Twos
TXCLKIN Complement
08
CLK-B Equal CLK-A
CLK-B
CLK-A
Three-State
ADC Output RX Data
00
R/W
to OSC IN/4
Equal
Output
Output
RX Port
on Falling
Output Twos
to OSC IN Disable
Disable
RXCLK
Complement
0F
Version [3:0]
00
R
REV. 0
AD9975
17
The serial port is operated by an internal state machine and is
dependent on the number of SCLK cycles since the last time
SENABLE went active. On every eighth rising edge of SCLK, a
byte is transferred over the SPI. During a multibyte write cycle,
this means the registers of the AD9975 are not simultaneously
updated but occur sequentially. For this reason, it is recom-
mended that single byte transfers be used when changing the
SPI configuration or performing a software reset.
REGISTER PROGRAMMING DEFINITIONS
Register 0, RESET/SPI Configuration
Bit 5: Software Reset
Setting this bit high resets the chip. The PLLs will relock to the
input clock and all registers (except Register 0x0, Bit 6) revert
to their default values. Upon completion of the reset, Bit 5 is
reset to 0.
The content of the interpolator stage is not cleared by software
or hardware resets. It is recommended to "flush" the transmit
path with zeros before transmitting data.
Bit 6: LSB/MSB First
Setting this bit high causes the serial port to send and receive
data least significant bit (LSB) first. The default low state con-
figures the serial port to send and receive data most significant
bit (MSB) first.
Bit 7: Select 4-Wire SPORT
Setting this bit high puts the serial port into a four-line mode.
The SCLK and
SENABLE retain their normal functions,
SDATA becomes an input only line, and the RXBOOST/SDO
pin becomes the serial port output. When in 4-wire mode, the
data on the RXBOOST/SDO pin will change on the falling edge
of SCLK and should be sampled on the rising edge of SCLK.
Register 1, Power-Down
Bit 0: Power-Down Receive Filter and CPGA
Setting this bit high powers down and bypasses the RX LPF
and continuous time programmable gain amplifier.
Bit 1: Power-Down ADC and SPGA
Setting this bit high powers down the ADC and the switched
capacitor programmable gain amplifier (SPGA).
Bit 2: Power-Down RX Reference
Setting this bit high powers down the ADC reference. This bit
should be set if an external reference is applied.
Bit 3: Power-Down Interpolators
Setting this bit high powers down the transmit digital interpolator.
It does not clear the content of the data path.
Bit 4: Power-Down DAC
Setting this bit high powers down the transmit DAC.
Bit 5: Power-Down PLL-A
Setting this bit high powers down the on-chip phase-locked loop
that generates the transmit path clocks and the auxiliary clock
CLK-A. When powered down, the CLK-A output goes to a high
impedance state.
Register 3, Clock Source Configuration
The AD9975 contains a programmable PLL referred to as PLL-A.
The output of the PLL is used to generate the internal clocks for
the TX path and the auxiliary clock, CLK-A.
Bit 1,0: PLL-A Multiplier
Bits 1 and 0 determine the multiplication factor (L) for PLL-A
and the DAC sampling clock frequency, F
DAC
.
F
DAC
= L
F
CLKIN
.
Bit 1,0
0,0: L = 1
0,1: L = 2
1,0: L = 4
1,1: L = 8
Bit 6: ADC Clock Source OSC IN/2
Setting Bit 6 high selects the the OSC IN clock signal divided by
2 as the ADC sampling clock source. Setting Bit 6 low selects
the OSC IN clock to be used directly as the ADC sampling
clock source. The best ADC performance is achieved by using
an external crystal or by driving the OSC IN pin with a low jitter
clock source.
Register 4, Receive Filter Selection
The AD9975 receive path has a continuous time 4-pole LPF
and a 1-pole digital HPF. The 4-pole LPF has two selectable
cutoff frequencies. Additionally, the filter can be tuned around
those two cutoff frequencies. These filters can also be bypassed
to different degrees as described below.
The continuous time 4-pole low-pass filter is automatically
calibrated to one of two selectable cutoff frequencies. The cutoff
frequency, F
cutoff
, is described as a function of the ADC sampling
frequency F
ADC
and can be influenced
15% by the RX filter
tuning target word in Register 5.
F
F
Target
cutoff low
ADC
_
/
=
+
(
)
64
64
F
F
Target
cutoff high
ADC
_
/
=
+
(
)
158
64
Bit 0: RX LPF Bypass
Setting this bit high bypasses the 4-pole LPF. The filter is auto-
matically powered down when this bit is set.
Bit 1: Enable 1-Pole RX LPF
The AD9975 can be configured with a 1-pole filter when the
4-pole receive low-pass filter is bypassed. The 1-pole filter is
untrimmed and subject to cutoff frequency variations of
20%.
Bit 2: Wideband RX LPF
This bit selects the nominal cutoff frequency of the 4-pole LPF.
Setting this bit high selects a nominal cutoff frequency of 28.8 MHz.
When the wideband filter is selected, the RX path gain is limited
to 30 dB.
Bit 3: Fast ADC Sampling
Setting this bit increases the quiescent current in the SVGA block.
This may provide some performance improvement when the ADC
sampling frequency is greater than 40 MSPS.
Bit 4: RX Digital HPF Bypass
Setting this bit high bypasses the 1-pole digital HPF that follows
the ADC. The digital filter must be bypassed for ADC sampling
above 50 MSPS.
Bit 5: RX Path DC Offset Correction
Writing a 1 to this bit triggers an immediate receive path offset
correction and reads back 0 after the completion of the offset
correction.
Bit 6: RX LPF Tuning Update in Progress
This bit indicates when receive filter calibration is in progress.
The duration of a receive filter calibration is about 500
s.
Writing to this bit has no effect.
REV. 0
18
AD9975
Bit 7: RX LPF Tuning Update Disable
Setting this bit high disables the automatic background receive
filter calibration. The AD9975 automatically calibrates the
receive filter on reset and every few (~2) seconds thereafter to
compensate for process and temperature variation, power supply,
and long term drift. Programming a 1 to this bit disables this
function. Programming a 0 triggers an immediate first calibration
and enables the periodic update.
Register 5, Receive Filter Tuning Target
This register sets the filter tuning target as a function of F
OSCIN
.
See Register 4 description.
Register 6, RX Path Gain Adjust
The AD9975 uses a combination of a continuous time PGA
(CPGA) and a switched capacitor PGA (SPGA) for a gain range
of 6 dB to +36 dB with a resolution of 2 dB. The RX path gain
can be programmed over the serial interface by writing to the
RX path Gain Adjust Register or directly using the GAIN and
MSB aligned TX[5:1] Bits. The register default value is 0x00 for
the lowest gain setting (6 dB). The register always reads back the
actual gain setting irrespective of which of the two programming
modes was used.
Bits [4:0]: RX PGA Gain
Table VI describes the gains and how they are achieved as a
function of the RX path adjust bits. It should be noted that the
value of these bits will read back the actual gain value to which
the PGA is set. If Bit 5 of this register is low, then the value read
back will be that set by the AGC[2:0] Pins.
Bit 5: PGA Gain Set through Register
Setting this bit high will result in the RX path gain being set by
writing to the PGA Gain Control Register. Default is zero, which
selects writing the gain through the AGC[2:0] pins in conjunction
with the RXBOOST pin.
Bit 6: RXBOOST
This bit is read-only. It reflects the level of the RXBOOST pin.
Bit 7: RXBOOST Active Low
Setting this bit high results in the value mapped to the RXBOOST
pin by the AGC inputs being inverted.
Table VI. PGA Programming Map
RX Path
RX Path
CPGA
SPGA
Gain [4:0]
Gain
Gain
Gain
0x00
6
0
6
0x01
4
0
4
0x02
2
0
2
0x03
0
0
0
0x04
2
0
2
0x05
4
0
4
0x06
6
6
0
0x07
8
6
2
0x08
10
6
4
0x09
12
12
0
0x0A
14
12
2
0x0B
16
12
4
0x0C
18
18
0
0x0D
20
18
2
0x0E
22
18
4
0x0F
24
24
0
0x10
26
24
2
0x11
28
24
4
0x12
*
30/30
24/30
6/0
0x13
*
30/32
24/30
6/2
0x14
*
30/34
24/30
6/4
0x15
*
30/36
24/30
6/6
*When the wideband RX filter bit is set high, the RX path gain is limited to 30 dB.
The first of the two values refers to the mode when the lower RX LPF cutoff
frequency is chosen, or when the RX LPF filter is bypassed.
Register 7, Transmit Path Settings
Bit 0: TX Data Input Twos Complement
Setting this bit high changes the TX path input data format to
twos complement. When this bit is low, the TX data format is
straight binary.
Bit 1: Sample TX Data on Falling TXCLKIN
If Bit 1 is set high, the TX path data will be sampled on the
falling edge of TXCLKIN. When this bit is low, the data will be
sampled on the rising edge of TXCLKIN.
Bit 4 to Bit 7: Interpolation Filter Select
Bits 4 to 7 define the interpolation filter characteristic and inter-
polation rate.
Bits 7:4;
0x1; see TPC 1. 2 Interpolation, LPF.
0x2; Interpolation Bypass.
0x5; see TPC 2. 2 Interpolation, BPF, Adj image.
The interpolation factor has a direct influence on the rate at
which the TX path will read the input data-words from the input
buffer. When the interpolation filter has been bypassed, the data
will be read out of the buffer at a rate of F
OSCIN
L. When the
interpolator is configured to run in either of the 2 interpola-
tion modes, the data will be read out of the buffer at a rate of
0.5 F
OSCIN
L.
Register 8, Receiver and Clock Output Settings
Bit 0: Rx Data Output Twos Complement
Setting this bit high changes the RX path input data format to
twos complement. When this bit is low, the RX data format is
straight binary.
REV. 0
AD9975
19
Bit 1: ADC Output on Falling RXCLK
If Bit 1 is set high, the TX path data will be sampled on the falling
edge of RXCLK. When this bit is low, the data will be sampled on
the rising edge of RXCLK.
Bit 3: Three-State RX Port
This bit sets the receive output RX[5:0] into a high impedance
three-state mode. It allows for sharing the bus with other devices.
Bit 4: CLK-A Output Disable
Setting Bit 4 high fixes the CLK-A output to a Logic 0 output level.
Bit 5: CLK-B Output Disable
Setting Bit 5 high fixes the CLK-A output to a Logic 0 output level.
Bit 6: CLK-A Equal to OSC IN
Setting Bit 6 high sets the CLK-A output signal frequency equal
to the OSC IN signal frequency. Otherwise, the CLK-A output
frequency is equal to F
OSCIN
L.
Bit 7: CLK-B Equal to OSC IN/4
Setting Bit 7 high sets the CLKB output signal frequency equal
to the OSC IN/4 signal frequency. Otherwise, the CLKB output
frequency is equal to OSC IN/2.
Register F, Die Revision
This register stores the die revision of the chip. It is a read-only
register.
PCB DESIGN CONSIDERATIONS
Although the AD9975 is a mixed signal device, the part should
be treated as an analog component. The digital circuitry on-chip
has been specially designed to minimize the impact that the
digital switching noise will have on the operation of the analog
circuits. Following the power, grounding, and layout recom-
mendations in this section will help you get the best performance
from the MxFE.
Component Placement
If the three following guidelines of component placement are
followed, chances for getting the best performance from the
MxFE
are greatly increased. First, manage the path of return cur-
rents flowing in the ground plane so that high frequency switching
currents from the digital circuits do not flow on the ground plane
under the MxFE or analog circuits. Second, keep noisy digital
signal paths and sensitive receive signal paths as short as possible.
Third, keep digital (noise generating) and analog (noise suscep-
tible) circuits as far away from each other as possible.
In order to best manage the return currents, pure digital circuits
that generate high switching currents should be closest to the
power supply entry. This will keep the highest frequency return
current paths short and prevent them from traveling over the
sensitive MxFE and analog portions of the ground plane. Also,
these circuits should be generously bypassed at each device that
will further reduce the high frequency ground currents. The
MxFE should be placed adjacent to the digital circuits such that
the ground return currents from the digital sections will not flow
in the ground plane under the MxFE. The analog circuits should
be placed furthest from the power supply.
The AD9975 has several pins that are used to decouple sensitive
internal nodes. These pins are REFIO, REFB, and REFT. The decou-
pling capacitors connected to these points should have low ESR
and ESL. These capacitors should be placed as close to the MxFE
as possible and be connected directly to the analog ground plane.
The resistor connected to the FS ADJ pin should also be placed
close to the device and connected directly to the analog ground plane.
Power Planes and Decoupling
The AD9975 evaluation board demonstrates a good power supply
distribution and decoupling strategy. The board has four layers;
two signal layers, one ground plane, and one power plane. The
power plane is split into a 3VDD section, which is used for the
3 V digital logic circuits; a DVDD section, which is used to supply
the digital supply pins of the AD9975; an AVDD section, which
is used to supply the analog supply pins of the AD9975; and a
VANLG section, which supplies the higher voltage analog com-
ponents on the board. The 3VDD section will typically have the
highest frequency currents on the power plane and should be
kept the furthest from the MxFE and analog sections of the board.
The DVDD portion of the plane brings the current used to power
the digital portion of the MxFE to the device. This should be
treated similar to the 3VDD power plane and be kept from
going underneath the MxFE or analog components. The MxFE
should largely sit on the AVDD portion of the power plane.
The AVDD and DVDD power planes may be fed from the same
low noise voltage source; however, they should be decoupled
from each other to prevent the noise generated in the DVDD
portion of the MxFE from corrupting the AVDD supply. This
can be done by using ferrite beads between the voltage source and
DVDD and between the source and AVDD. Both DVDD and
AVDD should have a low ESR, bulk decoupling capacitor on the
MxFE side of the ferrite as well as a low ESR, ESL decoupling
capacitors on each supply pin (i.e., the AD9975 requires five
power supply decoupling caps, one each on Pins 5, 38, 47, 14, and
35). The decoupling caps should be placed as close to the MxFE
supply pins as possible. An example of the proper decoupling is
shown in the AD9975 evaluation board schematic.
Ground Planes
In general, if the component placing guidelines discussed earlier
can be implemented, it is best to have at least one continuous
ground plane for the entire board. All ground connections should
be made as short as possible. This will result in the lowest imped-
ance return paths and the quietest ground connections.
If the components cannot be placed in a manner that would keep
the high frequency ground currents from traversing under the
MxFE and analog components, it may be necessary to put current
steering channels into the ground plane to route the high frequency
currents around these sensitive areas. These current steering
channels should be made only when and where necessary.
Signal Routing
The digital RX and TX signal paths should be kept as short as
possible. Also, the impedance of these traces should have a con-
trolled impedance of about 50
. This will prevent poor signal
integrity and the high currents that can occur during undershoot
or overshoot caused by ringing. If the signal traces cannot be kept
shorter than about 1.5 inches, then series termination resistors
(33
to 47 ) should be placed close to all signal sources. It is
a good idea to series terminate all clock signals at their source
regardless of trace length.
The receive RX+/RX signals are the most sensitive signals on the
entire board. Careful routing of these signals is essential for good
receive path performance. The RX+/RX signals form a differential
pair and should be routed together as a pair. By keeping the traces
adjacent to each other, noise coupled onto the signals will appear
as common mode and will be largely rejected by the MxFE receive
input. Keeping the driving point impedance of the receive signal low
and placing any low-pass filtering of the signals close to the MxFE
will further reduce the possibility of noise corrupting these signals.
REV. 0
C0306108/02(0)
PRINTED IN U.S.A.
20
AD9975
OUTLINE DIMENSIONS
48-Lead Plastic Quad Flatpack [LQFP]
1.4 mm Thick
(ST-48)
Dimensions shown in millimeters
TOP VIEW
(PINS DOWN)
1
12
13
25
24
36
37
48
0.27
0.22
0.17
0.50
BSC
7.00
BSC
SEATING
PLANE
1.60 MAX
0.75
0.60
0.45
VIEW A
7
3.5
0
0.20
0.09
1.45
1.40
1.35
0.15
0.05
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90 CCW
PIN 1
INDICATOR
9.00 BSC
COMPLIANT TO JEDEC STANDARDS MS-026BBC
SEATING
PLANE