Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Features

Small size/surface-mount packaging

Monolithic IC reliability

Low impulse noise

Make-before-break, break-before-make operation

Clean, bounce-free switching

Low, matched ON-resistance

Built-in current limiting, thermal shutdown, and
SLIC protection

5 V only operation, very low power consumption

Battery monitor, all OFF state upon loss of battery

No EMI

Latched logic level inputs, no driver circuitry

Only one external protector required

Applications

Central office

DLC

PBX

DAML

HFC/FITL

Description

The L7583A/B/C/D Line Card Access Switch is a
monolithic solid-state device providing the equivalent
switching functionality of three 2 form C switches.
The L7583 is designed to provide power ringing
access, line test access (test out), and SLIC test
access (test in) to tip and ring in central office, digital
loop carrier, private branch exchange, digitally added
main line, and hybrid fiber coax/fiber-in-the-loop ana-
log line card applications. An additional pair of solid-
state contacts are also available to provide access
for testing of the ringing generator.

The L7583A/B has seven states: the idle talk state
(line break switches closed, all other switches open),
the power ringing state (ringing access switches
closed, all other switches open), loop access state
(loop access switches closed, all switches open),
SLIC test state (test in switches closed, all other
switches open), simultaneous loop and SLIC
access state (loop and test in switches closed, all
others open), ringing generator test state (ring test
switches closed, all others open), and an all OFF
state. The seven states in the L7583A/B are also in
the L7583C/D, with an additional simultaneous test-
out and ring-test state, making the L7583C/D appro-
priate for digital loop carrier and other Bellcore TR-57
applications.

The L7583 offers break-before-make or make-
before-break switching, with simple logic level input
control. Because of the solid-state construction, volt-
age transients generated when switching into an
inductive ringing lead during ring cadence or ring trip
are minimized, possibly eliminating the need for
external zero cross switching circuitry. State control
is via logic level inputs, so no additional driver cir-
cuitry is required.

The line break switch is a linear switch that has
exceptionally low ON-resistance and an excellent
ON-resistance matching characteristic. The ringing
access switch has a breakdown voltage rating
>480 V which is sufficiently high, with proper protec-
tion, to prevent breakdown in the presence of a tran-
sient fault condition (i.e., passing the transient on to
the ringing generator).

Incorporated into the L7583Axx and L7583Cxx is a
diode bridge/SCR clamping circuit, current-limiting
circuitry, and a thermal shutdown mechanism to pro-
vide protection to the SLIC device and subsequent
circuitry during fault conditions. This is shown in Fig-
ure 1 as version A. Positive and negative lightning is
reduced by the current-limiting circuitry and steered
to ground via diodes and the integrated SCR. Power
cross is also reduced

the current-limiting and ther-

mal shutdown circuits.

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Description

(continued)

The L7583Bxx and L7583Dxx versions provide only an
integrated diode bridge along with current limiting and
thermal shutdown (see Figure 2 for version B). This will
cause positive faults to be directed to ground and neg-
ative faults to battery. In either polarity, faults are
reduced by the current-limit and/or thermal shutdown
mechanisms.

To protect the L7583 from an overvoltage fault condi-
tion, use of a secondary protector is required. The sec-
ondary protector must limit the voltage seen at the tip/
ring terminals to prevent the breakdown voltage of the
switches from being exceeded. To minimize stress on
the solid-state contacts, use of a foldback- or crowbar-
type secondary protector is recommended. With proper
choice of secondary protection, a line card using the
L7583 will meet all relevant ITU-T, LSSGR, FCC, or

* protection requirements.

The L7583 operates off of a 5 V supply only. This gives
the device extremely low idle and active power dissipa-
tion and allows use with virtually any range of battery
voltage. This makes the L7583 especially appropriate
for remote power applications such as DAML or FOC/
FITL or other Bellcore TA 909 applications where
power dissipation is particularly critical.

A battery voltage is also used by the L7583, only as a
reference for the integrated protection circuit. The
L7583 will enter an all OFF state upon loss of battery.

During power ringing, to turn on and maintain the ON
state, the ring access switch and ring test switch will
draw a nominal 2 mA or 4 mA from the ring generator.

The L7583A/B/C/D device is packaged in a 24-pin,
plastic DIP (L7583AF/BF/CF/DF) and in a 28-pin,
plastic SOG (L7583AAJ/BAJ/CAJ/DAJ).

is a registered trademark of Underwriters Laboratories, Inc.

Pin Information

12-2364.a (F)

Note: Shown with A/C version protection. The 24-pin DIP is avail-

able with either A/C or B/D version protection.

Figure 1. 24-Pin, Plastic DIP (600 mil)

12-2365.d (F)

Note: Shown with B/D version protection. The 28-pin SOG is avail-

able with either A/C or B/D version protection.

Figure 2. 28-Pin, Plastic SOG

BAT

LINE

GND

LINE

SW1

LATCH

RINGING

TESTout

SW2

SW3

SW4

SW5

SW7

SW9

SW8

SW10

SW6

TESTin

BAT

RINGING

TESTin

TESTout

TESTin

RING

GND

TESTout

CONTROL

LOGIC

SCR
AND

TRIP

CKT

BAT

LINE

GND

LINE

SW1

LATCH

RINGING

SW2

SW3

SW4

SW5

SW7

SW9

SW8

SW10

SW6

TESTin

BAT

RINGING

TESTout

TESTin

TESTout

TESTin

RING

GND

TESTout

CONTROL

LOGIC

Lucent Technologies Inc.

Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Pin Information

(continued)

Table 1. Pin Descriptions

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.

Table 2. Absolute Maximum Ratings

DIP SOG Symbol

Description

DIP

SOG

Symbol

Description

GND

Fault ground.

BAT

Battery voltage. Used as a ref-
erence for protection circuit.

No connection.

27, 26

No connection.

3, 4

No connection.

25, 21

No connection.

TESTin

Test (in) access on TIP.

TESTin

Test (in) access on RING.

BAT

Connect to TIP on SLIC side.

BAT

Connect to RING on SLIC
side.

LINE

Connect to TIP on line side.

LINE

Connect to RING on line side.

RINGING

Connect to return ground for ring-
ing generator.

RINGING

Connect to ringing generator.

TESTout

Test (out) access on TIP.

TESTout

Test (out) access on RING.

9, 11

No connection.

LATCH

Data input control, active-high,
transparent low.

5 V supply.

TESTin

Logic level switch input control.

Temperature shutdown pin. Can
be used as a logic level input or an
output. See Tables 16 and 17,
Truth Tables, and the Switching
Behavior section of this data sheet
for input pin description. As an
output flag, will read 5 V when the
device is in its operational mode
and 0 V in the thermal shutdown
mode. To disable the thermal shut-
down mechanism, tie this pin to
5 V (not recommended).

RING

Logic level switch input control.

GND

Digital ground.

TESTout

Logic level switch input control.

Parameter

Min

Max

Unit

Operating Temperature Range

110

°C

Storage Temperature Range

150

°C

Relative Humidity Range

Pin Soldering Temperature (t = 10 s max)

260

°C

5 V Power Supply

Battery Supply

Logic Input Voltage

Input-to-output Isolation

330

Pole-to-pole Isolation

330

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Handling Precautions

Although protection circuitry has been designed into this device, proper precautions should be taken to avoid expo-
sure to electrostatic discharge (ESD) during handling and mounting. Lucent Technologies Microelectronics Group
employs a human-body model (HBM) and a charged-device model (CDM) for ESD-susceptibility testing and pro-
tection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used to define the
model. No industry-wide standard has been adopted for CDM. However, a standard HBM (resistance = 1500

capacitance = 100 pF) is widely used and therefore can be used for comparison purposes. The HBM ESD thresh-
old presented here was obtained by using these circuit parameters.

Table 3. HBM ESD Threshold Voltage

Electrical Characteristics

= 40 °C to +85 °C, unless otherwise specified.

Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information purposes only and are not part of the test-
ing requirements.

Table 4. Power Supply Specifications

* V

BAT

is used only as a reference for internal protection circuitry. If V

BAT

rises above 10 V, the device will enter an all OFF state and remain in

this state until the battery voltage drops below 15 V.

Table 5. Test In Switches, 1 and 2

* Applied voltage is 100 Vp-p square wave at 100 Hz.

Device

Rating

L7583

1000 V

Supply

Min

Typ

Max

Unit

Supply

Min

Typ

Max

Unit

4.5

5.5

BAT

19 --

Parameter

Test Condition

Measure

Min Typ Max

Unit

OFF-state Leakage Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 320 V to Gnd

Vswitch (differential) = 60 V to +260 V

Vswitch (differential) = 330 V to Gnd

Vswitch (differential) = 60 V to +270 V

Vswitch (differential) = 310 V to Gnd

Vswitch (differential) = 60 V to +250 V

Iswitch

µA

ON-resistance:

+25 °C
+85 °C
40 °C

Iswitch (on) = ±5 mA, ±10 mA
Iswitch (on) = ±5 mA, ±10 mA
Iswitch (on) = ±5 mA, ±10 mA

--
--
--

Isolation:

+25 °C

+85 °C

40 °C

Vswitch (both poles) = ±320 V,

Logic inputs = Gnd

Vswitch (both poles) = ±330 V,

Logic inputs = Gnd

Vswitch (both poles) = ±310 V,

Logic inputs = Gnd

Iswitch

µA

dV/dt Sensitivity*

200

V/µs

Lucent Technologies Inc.

Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Electrical Characteristics

(continued)

Table 6. Break Switches, 3 and 4

* This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded.
Applied voltage is 100 Vp-p square wave at 100 Hz.

Parameter

Test Condition

Measure

Min Typ Max Unit

OFF-state Leakage

Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 320 V to Gnd

Vswitch (differential) = 60 V to +260 V

Vswitch (differential) = 330 V to Gnd

Vswitch (differential) = 60 V to +270 V

Vswitch (differential) = 310 V to Gnd

Vswitch (differential) = 60 V to +250 V

Iswitch

µA

ON-resistance:

+25 °C
+85 °C
40 °C

LINE

= ±10 mA, ±40 mA, T

BAT

= 2 V

LINE

= ±10 mA, ±40 mA, T

BAT

= 2 V

LINE

= ±10 mA, ±40 mA, T

BAT

= 2 V

--
--
--

19.5

14.5

ON-resistance Match

Per ON-resistance test

condition of SW3, SW4

Magnitude

SW3 R

SW4

0.2

1.0

ON-state Voltage*

Iswitch = I

LIMIT

@ 50 Hz/60 Hz

220

dc Current Limit:

+85 °C
40 °C

Vswitch (on) = ±10 V
Vswitch (on) = ±10 V

Iswitch
Iswitch

--
--

250

mA
mA

Dynamic Current Limit
(t = <0.5 µs)

Break switches in ON state; ringing

access switches OFF; apply ±1000 V at

10/1000 µs pulse; appropriate second-

ary protection in place

Iswitch

2.5

Isolation:

+25 °C

+85 °C

40 °C

Vswitch (both poles) = ±320 V,

Logic inputs = Gnd

Vswitch (both poles) = ±330 V,

Logic inputs = Gnd

Vswitch (both poles) = ±310 V,

Logic inputs = Gnd

Iswitch

µA

dV/dt Sensitivity

200

V/µs

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Electrical Characteristics

(continued)

Table 7. Ring Test Return Switch, 5

* Applied voltage is 100 Vp-p square wave at 100 Hz.

Table 8. Ringing Test Switch, 6

* Choice of secondary protector and series current-limit resistor should ensure these ratings are not exceeded.
Applied voltage is 100 Vp-p square wave at 100 Hz.

Parameter

Test Condition

Measure

Min

Typ Max Unit

OFF-state Leakage Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 320 V to Gnd

Vswitch (differential) = 60 V to +260 V

Vswitch (differential) = 330 V to Gnd

Vswitch (differential) = 60 V to +270 V

Vswitch (differential) = 310 V to Gnd

Vswitch (differential) = 60 V to +250 V

Iswitch

µA

ON-resistance

Iswitch (on) = ±0 mA, ±10 mA

100

Isolation:

+25 °C

+85 °C

40 °C

Vswitch (both poles) = ±320 V,

Logic inputs = Gnd

Vswitch (both poles) = ±330 V,

Logic inputs = Gnd

Vswitch (both poles) = ±310 V,

Logic inputs = Gnd

Iswitch

µA

dV/dt Sensitivity*

200

V/µs

Parameter

Test Condition

Measure

Min

Typ Max Unit

OFF-state Leakage Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 60 V to +190 V
Vswitch (differential) = +60 V to 190 V
Vswitch (differential) = 60 V to +200 V
Vswitch (differential) = +60 V to 200 V
Vswitch (differential) = 60 V to +180 V
Vswitch (differential) = +60 V to 180 V

Iswitch

µA

ON-resistance

Iswitch (on) = ±70 mA, ±80 mA

ON Voltage

Iswitch (on) = ±1 mA

1.5

Steady-state Current*

100

Release Current

500

µA

Isolation:

+25 °C

+85 °C

40 °C

Vswitch (both poles) = ±320 V,

Logic inputs = Gnd

Vswitch (both poles) = ±330 V,

Logic inputs = Gnd

Vswitch (both poles) = ±310 V,

Logic inputs = Gnd

Iswitch

µA

dV/dt Sensitivity

200

V/µs

Lucent Technologies Inc.

Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Electrical Characteristics

(continued)

Table 9. Ring Return Switch, 7

* This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded.
Applied voltage is 100 Vp-p square wave at 100 Hz.

Table 10. Ringing Access Switch, 8

* At the time of publication of this data sheet, the current device design will be a nominal 4 mA. Devices are being redesigned to reduce this

current to less than 2 mA nominally. Consult your Lucent Technologies Microelectronics Group account executive for additional details.

Choice of secondary protector and series current-limit resistor should ensure these ratings are not exceeded.
Applied voltage is 100 Vp-p square wave at 100 Hz.

Parameter

Test Condition

Measure Min Typ Max Unit

OFF-state Leakage

Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 320 V to Gnd

Vswitch (differential) = 60 V to +260 V

Vswitch (differential) = 330 V to Gnd

Vswitch (differential) = 60 V to +270 V

Vswitch (differential) = 310 V to Gnd

Vswitch (differential) = 60 V to +250 V

Iswitch

µA

dc Current Limit

Vswitch (on) = ±10 V

Iswitch

200

Dynamic Current Limit
(t = <0.5 µs)

Break and loop switches in OFF state; ring return

switch ON; apply ±1000 V at 10/1000 µs pulse;

appropriate secondary protection in place

Iswitch

2.5

ON-resistance

Iswitch (on) = ±0 mA, ±10 mA

100

ON-state Voltage*

Iswitch = I

LIMIT

@ 50 Hz/60 Hz

130

Isolation:

+25 °C
+85 °C
40 °C

Vswitch (both poles) = ±320 V, Logic inputs = Gnd
Vswitch (both poles) = ±330 V, Logic inputs = Gnd
Vswitch (both poles) = ±310 V, Logic inputs = Gnd

Iswitch
Iswitch
Iswitch

--
--
--

1
1
1

µA
µA
µA

dV/dt Sensitivity

200

V/µs

Parameter

Test Condition

Measure Min

Typ Max Unit

OFF-state Leakage

Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 255 V to +210 V
Vswitch (differential) = +255 V to 210 V
Vswitch (differential) = 270 V to +210 V
Vswitch (differential) = +270 V to 210 V
Vswitch (differential) = 245 V to +210 V
Vswitch (differential) = +245 V to 210 V

Iswitch

µA

ON Voltage

Iswitch (on) = ±1 mA

Ring Generator Cur-

rent During Ring

= 5 V

RING

= 1

TESTin

= 0

TESTout

= 0

RING-

SOURCE

Steady-state Current

150

Surge Current

Release Current

500

µA

ON-resistance

Iswitch (on) = ±70 mA, ±80 mA

Isolation:

+25 °C
+85 °C
40 °C

Vswitch (both poles) = ±320 V, Logic inputs = Gnd
Vswitch (both poles) = ±330 V, Logic inputs = Gnd
Vswitch (both poles) = ±310 V, Logic inputs = Gnd

Iswitch
Iswitch
Iswitch

--
--
--

1
1
1

µA
µA
µA

dV/dt Sensitivity

200

V/µs

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Electrical Characteristics

(continued)

Table 11. Loop Access Switches, 9 and 10

* This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded.
Applied voltage is 100 Vp-p square wave at 100 Hz.

Parameter

Test Condition

Measure

Min Typ Max

Unit

OFF-state Leakage

Current:

+25 °C

+85 °C

40 °C

Vswitch (differential) = 320 V to Gnd

Vswitch (differential) = 60 V to +260 V

Vswitch (differential) = 330 V to Gnd

Vswitch (differential) = 60 V to +270 V

Vswitch (differential) = 310 V to Gnd

Vswitch (differential) = 60 V to +250 V

Iswitch

µA

ON-resistance:

+25 °C
+85 °C
40 °C

Iswitch (on) = ±5 mA, ±10 mA
Iswitch (on) = ±5 mA, ±10 mA
Iswitch (on) = ±5 mA, ±10 mA

Von

--
--
--

ON-state Voltage*

Iswitch = I

LIMIT

@ 50 Hz/60 Hz

130

dc Current Limit:

+85 °C
40 °C

Vswitch (on) = ±10 V
Vswitch (on) = ±10 V

Iswitch
Iswitch

--
--

250

mA
mA

Dynamic Current Limit
(t = <0.5 µs)

Break switches in ON state; ringing access

switches OFF; apply ±1000 V at 10/1000 µs pulse;

appropriate secondary protection in place

Iswitch

2.5

Isolation:

+25 °C
+85 °C
40 °C

Vswitch (both poles) = ±320 V, Logic inputs = Gnd
Vswitch (both poles) = ±330 V, Logic inputs = Gnd
Vswitch (both poles) = ±310 V, Logic inputs = Gnd

Iswitch
Iswitch
Iswitch

--
--
--

1
1
1

µA
µA
µA

dV/dt Sensitivity

200

V/µs

Lucent Technologies Inc.

Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Electrical Characteristics

(continued)

Table 12. Additional Electrical Characteristics

* Temperature shutdown flag (T

) will be high during normal operation and low during temperature shutdown state.

Zero Cross Current Turn Off

The ring access switch (SW8) is designed to turn off on the next zero current crossing after application of the
appropriate logic input control. This switch requires a current zero cross to turn off. Switch 8, once on, will remain
in the ON state (regardless of logic input) until a current zero cross. Therefore, to ensure proper operation of switch
8, this switch should be connected, via proper impedance, to the ringing generator or some other ac source. Do
not attempt to switch pure dc with switch 8. The ringing test access switch, SW6, also has similar characteristics to
switch 8 and should also only be used to switch signals with zero current crossings. For a detailed explanation of
the operation of switches 6 and 8, please refer to the

An Introduction to L758X Series of Line Card Access

Switches

Application Note.

Parameter

Test Condition

Measure

Min

Typ

Max Unit

Digital Input Characteristics:

Input Low Voltage

1.5

Input High Voltage

3.5

Input Leakage Current (high)

= 5.5 V, V

BAT

= 75 V,

Vlogicin = 5 V

llogicin

µA

Input Leakage Current (low)

= 5.5 V, V

BAT

= 75 V,

Vlogicin = 0 V

llogicin

µA

Power Requirements:

Power Dissipation

= 5 V, V

BAT

= 48 V,

idle/talk state or all OFF state,

ringing state or access state

, I

BAT

--
--

3
6

mW
mW

Current

= 5 V,

idle/talk state or all OFF state,

ringing state or access state

--
--

560

0.750

900

1.9

µA

BAT

Current

BAT

= 48 V,

idle/talk state or all OFF state,

ringing state or access state

BAT

--
--

4
4

10
10

µA
µA

Digital Input Characteristics:

Input Low Voltage

1.5

Input High Voltage

3.5

Input Leakage Current (high)

= 5.5 V, V

BAT

= 58 V,

Vlogicin = 5 V

llogicin

µA

Input Leakage Current (low)

= 5.5 V, V

BAT

= 58 V,

Vlogicin = 0 V

llogicin

µA

Temperature Shutdown Requirements*:

Shutdown Activation Temperature

110

125

150

°C

Shutdown Circuit Hysteresis

°C

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Switching Behavior

When switching from the power ringing state to the
idle/talk state, via simple logic level input control, the
L7583 is able to provide control with respect to the tim-
ing when the ringing access contacts are released rela-
tive to the state of the line break contacts.

Make-before-break operation occurs when the line
break switch contacts are closed (or made) before the
ringing access switch contact is opened (or broken).
Break-before-make operation occurs when the ringing
access contact is opened before the line break switch
contacts are closed.

Using the logic level input pins RING, TESTin, and
TESTout, either make-before-break or break-before-
make operation of the L7583 is easily achieved. The
logic sequences for either mode of operation are given
in Table 13 and Table 14. See the Truth Tables (Table
16 and Table 17) for an explanation of logic states.

When using an L758X in the make-before-break mode,
during the ring-to-idle transition, for a period of up to
one-half the ringing frequency, the ring break switch
and the pnpn-type ring access switch can both be in
the ON state. This is the maximum time after the logic
signal at IN

RING

has transitioned that the ring access

switch is waiting for the next zero current cross, so it
can close. During this interval, current that is limited to
the dc break switch current-limit value will be source
from the ring node of the SLIC.

This current is presented to the internal protection cir-
cuit. If the SCR-type protector is used (A or C codes), if
by random probability the ring-to-idle transition occurs
during a portion of the ring cycle when the ringing volt-
age exceeds the protection circuit SCR turn-on volt-
age, and if current in excess of the SCR's turn-on
current is also available, the SCR may turn on. Once
the SCR is triggered on, if the SLIC is capable of sup-
plying current in excess of the holding current, the SCR
may be latched on by the SLIC.

The probability of this event depends on the character-
istics of the given SLIC and of the holding current of the
L7583 A or C device. The SCR hold current distribution
is designed to be safely away from the test limit of
80 mA. The higher the distribution, the lower the proba-
bility of the latch.

If this situation is of concern for a given board design,
either use the A or C series device in the break-before-
make mode (eliminates the original 25 ms current
pulse) or use a B or D series device (eliminates the
SCR).

Table 13. Make-Before-Break Operation

RING TESTin TESTout

State

Timing

Break

Switches

3 & 4

Ring

Return

Switch 7

Ring

Access

Switch 8

All Other

Access

Switches

5 V

0 V

Float

Power
Ringing

Open

Closed

Open

0 V

Float

Make-
before-
break

SW8 waiting for next
zero current crossing
to turn off maximum
time--one-half of
ringing. In this transi-
tion state, current
that is limited to the
dc break switch cur-
rent-limit value will be
sourced from the ring
node of the SLIC.

Closed

Open

Closed

Open

0 V

Float

Idle/Talk Zero cross current

has occurred.

Closed

Open

Data Sheet
February 2001

Lucent Technologies Inc.

L7583A/B/C/D Line Card Access Switch

Switching Behavior

(continued)

Table 14. Break-Before-Make Operation

Notes:

Break-before-make operation can be achieved using T

as an input. In lines two and three of Table 14, instead of using the logic input pins to

force the all OFF state, force T

to ground. This will override the logic inputs and also force the all OFF state. Hold this state for 25 ms. During

this 25 ms all OFF state, toggle the inputs from 10 (ringing state) to 00 (idle/talk state). After 25 ms, release T

to return switch control to the

input pins which will set the idle talk state.

When using the L7583A/B/C/D in this mode, forcing T

to ground will override the INPUT pins and force an all OFF state. Setting T

5 V will allow switch control via the logic INPUT pins. However, setting T

to 5 V will also disable the thermal shutdown mechanism. This is not

recommended. Therefore, to allow switch control via the logic INPUT pins, allow T

to float.

Thus, when using T

as an input, the two recommended states are 0 (overrides logic input pins and forces all OFF state) and float (allows

switch control via logic input pins and thermal shutdown mechanism is active). This may require use of an open-collector buffer.

Also note that T

operation in L7583 is different than T

operation of the L7581, where application of 5 V does not disable the thermal shut-

down mechanism.

INPUT TESTin TESTout

State

Timing

Break

Switches

3 & 4

Ring

Return
Switch

Ring

Access

Switch

All Other

Switches

5 V

0 V

Float

Power

Ringing

Open

Closed

Open

5 V

0 V

5 V

Float

All Off

Hold this state for

25 ms. SW8 waiting

for zero current to turn
off.

Open

Closed

Open

5 V

0 V

5 V

Float

All Off

Zero current has
occurred and SW8 has
opened.

Open

0 V

Float

Idle/Talk

Release break
switches.

Closed

Open

Power Supplies

Both the 5 V and battery supply are brought onto the
L7583. The L7583 requires only the 5 V supply for
switch operation; that is, state control is powered exclu-
sively off of the 5 V supply. Because of this, the L7583
offers extremely low power dissipation, both in the idle
and active states.

The battery voltage is not used for switch state control.
The battery is used as a reference voltage by the inte-
grated secondary protection circuit. When the voltage
at T

BAT

or R

BAT

drops 2 V to 4 V below the battery, the

integrated SCR will trigger, thus preventing fault-
induced overvoltage situations at the T

BAT

nodes.

Loss of Battery Voltage

As an additional protection feature, the L7583 monitors
the battery voltage. Upon loss of battery voltage, the
L7583 will automatically enter an all OFF state and
remain in that state until the battery voltage is restored.

The L7583 is designed such that the device will enter
the all OFF state if the battery rises above 10 V and
will remain off until the battery drops below 15 V.

Monitoring the battery for the automatic shutdown fea-
ture will draw a small current from the battery, typically
4 µA. This will add slightly to the overall power dissipa-
tion of the device.

Impulse Noise

Using the L7583 will minimize and possibly eliminate
the contribution to the overall system impulse noise
that is associated with ringing access switches.
Because of this characteristic of the L7583, it may not
be necessary to incorporate a zero cross switching
scheme. This ultimately depends upon the characteris-
tics of the individual system and is best evaluated at
the board level.

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Protection

Integrated SLIC Protection

Diode Bridge/SCR

In the L7583Axx and the L7583Cxx versions, protec-
tion to the SLIC device or other subsequent circuitry is
provided by a combination of current-limited break
switches, a diode bridge/SCR clamping circuit, and a
thermal shutdown mechanism. In the L7583Bxx and
the L7583Dxx versions, protection to the SLIC device
or other subsequent circuitry is provided by a combina-
tion of current-limited break switches, a diode bridge,
and a thermal shutdown mechanism.

In both protection versions, during a positive lightning
event, fault current is directed to ground via steering
diodes in the diode bridge. Voltage is clamped to a
diode drop above ground. In the A version, negative
lightning causes the SCR to conduct when the voltage
goes 2 V to 4 V more negative than the battery. Fault
currents are then directed to ground via the SCR and
steering diodes in the diode bridge.

Note that for the SCR to foldback or crowbar, the ON
voltage (see Table 14) of the SCR must be less nega-
tive than the battery reference voltage. If the battery
voltage is less negative than the SCR ON voltage, the
SCR will conduct fault currents to ground; however, it
will not crowbar.

In the B/D version, negative lightning is directed to bat-
tery via steering diodes in the diode bridge.

For power cross and power induction faults, in both
protection versions, the positive cycle of the fault is
clamped a diode drop above ground and fault currents
steered to ground. In the A/C version, the negative
cycle will cause the SCR to trigger when the voltage
exceeds the battery reference voltage by 2 V to 4 V.
When the SCR triggers, fault current is steered to
ground. In the B/D version, the negative cycle of the
power cross is steered to battery.

Current Limiting

During a lightning event, the current that is passed
through the break switches and presented to the inte-
grated protection circuit and subsequent circuitry is lim-
ited by the dynamic current-limit response of the break
switches (assuming idle/talk state). When the voltage
seen at the T

LINE

nodes is properly clamped by

an external secondary protector, upon application of a
1000 V, 10 x 1000 pulse (LSSGR lightning), the current
seen at the T

BAT

nodes will typically be a pulse of

magnitude 2.5 A and duration less than 0.5 µs.

During a power cross event, the current that is passed
through the break switches and presented to the inte-
grated protection circuit and subsequent circuitry is lim-
ited by the dc current-limit response of the break
switches (assuming idle/talk state). The dc current limit
is specified over temperature between 100 mA and
250 mA. Note that the current-limit circuitry has a nega-
tive temperature coefficient. Thus, if the device is sub-
jected to an extended power cross, the value of current
seen at T

BAT

will decrease as the device heats

due to the fault current. If sufficient heating occurs, the
temperature shutdown mechanism will activate and the
device will enter an all off mode.

Temperature Shutdown Mechanism

When the device temperature reaches a minimum of
110 °C, the thermal shutdown mechanism will activate
and force the device into an all OFF state, regardless
of the logic input pins. Pin T

, when used as an out-

put, will read 0 V when the device is in the thermal
shutdown mode and +V

during normal operation.

During a lightning event, due to the relatively short
duration, the thermal shutdown will not typically acti-
vate.

During an extended power cross, the device tempera-
ture will rise and cause the device to enter the thermal
shutdown mode. This forces an all off mode, and the
current seen at T

BAT

drops to zero. Once in the

thermal shutdown mode, the device will cool and exit
the thermal shutdown mode, thus reentering the state it
was in prior to thermal shutdown. Current, limited to the
dc current-limit value, will again begin to flow and
device heating will begin again. This cycle of entering
and exiting thermal shutdown will last as long as the
power cross fault is present. The frequency of entering
and exiting thermal shutdown will depend on the mag-
nitude of the power cross. If the magnitude of the
power cross is great enough, the external secondary
protector may trigger shunting all current to ground.

In the L7583, the thermal shutdown mechanism can be
disabled by forcing the T

pin to +V

. This functional-

ity is different from the L7581, whose thermal shutdown
mechanism cannot be disabled.

Electrical specifications relating to the integrated over-
voltage clamping circuit are outlined in Table 15.

Lucent Technologies Inc.

Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Protection

(continued)

Integrated SLIC Protection

(continued)

External Secondary Protector

With the above integrated protection features, only one
overvoltage secondary protection device on the loop
side of the L7583 is required. The purpose of this
device is to limit fault voltages seen by the L7583 so as
not to exceed the breakdown voltage or input-output
isolation rating of the device. To minimize stress on the
L7583, use of a foldback- or crowbar-type device is rec-
ommended. A detailed explanation and design equa-
tions on the choice of the external secondary protection
device are given in the

An Introduction to L758X Series

of Line Card Access Switches

Application Note. Basic

design equations governing the choice of external sec-
ondary protector are given below.

BATmax

| +

breakovermax

breakdownmin(break)

ringingpeakmax

BATmax

breakovermax

breakdownmin(ring)

ringingpeakmax

BATmax

breakovermin

where:

BATmax

--Maximum magnitude of battery voltage.

breakovermax

--Maximum magnitude breakover voltage

of external secondary protector.

breakovermin

--Minimum magnitude breakover voltage

of external secondary protector.

breakdownmin(break)

--Minimum magnitude breakdown

voltage of L7583 break switch.

breakdownmin(ring)

--Minimum magnitude breakdown

voltage of L7583 ring access switch.

ringingpeakmax

--Maximum magnitude peak voltage of

ringing signal.

Series current-limiting fused resistors or PTCs should
be chosen so as not to exceed the current rating of the
external secondary protector. Refer to the manufac-
turer's data sheet for requirements.

Table 15. Electrical Specifications, Protection Circuitry

* Previous versions of this data sheet specified a Trigger Current of 50 mA minimum. Trigger Current is defined as the minimum current drawn

from tip and ring to turn on the SCR. The specification in this data sheet is Gate Trigger Current, which is defined as the maximum current
that can flow into the battery before the SCR turns on.

Typical at 25 °C.
Twice ± dynamic current limit of break switches.
§ In some instances, the typical ON-state voltage can range as low as 25 V.

Parameters Related to Diodes (in Diode Bridge)

Parameter

Test Condition

Measure

Min

Typ

Max

Unit

Voltage Drop @ Continuous Cur-

rent (50 Hz/60 Hz)

Apply ±dc current limit

of break switches

Forward

Voltage

Voltage Drop @ Surge

Current

Apply ±dynamic cur-

rent limit of break

switches

Forward

Voltage

Parameters Related to Protection SCR

Surge Current

Gate Trigger Current*

Gate Trigger Current

Tempera-

ture Coefficient

0.5

%/°C

Hold Current

Gate Trigger Voltage

Trigger current

BAT

Reverse Leakage Current

BAT

1.0

µA

ON-State Voltage

0.5 A, t = 0.5 µs
2.0 A, t = 0.5 µs

--
--

3
5

--
--

V
V

Lucent Technologies Inc.

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Application

(continued)

Table 16. Truth Table for L7583A/B

1. If T

= 5 V, the thermal shutdown mechanism is disabled. If T

is floating, the thermal shutdown mechanism is active.

2. Forcing T

to ground overrides the logic input pins and forces an all OFF state.

3. Idle/Talk state.
4. TESTout state.
5. TESTin state
6. Power ringing state.
7. Ringing generator test state.
8. Simultaneous TESTout and TESTin state.
9. All OFF state.

A parallel in/parallel out data latch is integrated into the L7583A/B. Operation of the data latch is controlled by the
logic level input pin LATCH. The data input to the latch is the INPUT pin of the L7583A/B, and the output of the data
latch is an internal node used for state control.

When the LATCH control pin is at logic 0, the data latch is transparent and data control signals flow directly from
INPUT, through the data latch to state control. Any changes in INPUT will be reflected in the state of the switches.

When the LATCH control pin is at logic 1, the data latch is active--the L7583A/B will no longer react to changes at
the INPUT control pin. The state of the switches is now latched; that is, the state of the switches will remain as they
were when the LATCH input transitioned from logic 0 to logic 1. The switches will not respond to changes in INPUT
as long as LATCH is held high.

Note that the T

input is not tied to the data latch. T

is not affected by the LATCH input. T

input will override

state control via INPUT and LATCH.

RING

TESTin

TESTout

TESTin

Switches

Break

Switches

Ring Test

Switches

Ring

Switches

TESTout

Switches

0 V

5 V/Float

Off

0 V

5 V

5 V/Float

Off

0 V

5 V

0 V

5 V/Float

Off

5 V

0 V

5 V/Float

Off

5 V

0 V

5 V/Float

Off

0 V

5 V

5 V/Float

Off

5 V

0 V

5 V

5 V/Float

Off

5 V

5 V/Float

Off

Don't

Care

Don't

Care

Don't

Care

0 V

Off

Lucent Technologies Inc.

Data Sheet
February 2001

L7583A/B/C/D Line Card Access Switch

Application

(continued)

Table 17. Truth Table for L7583C/D

If T

= 5 V, the thermal shutdown mechanism is disabled. If T

is floating, the thermal shutdown mechanism is active.

Forcing T

to ground overrides the logic input pins and forces an all OFF state.

Idle/Talk state.

TESTout state.

TESTin state.

Power ringing state.

Ringing generator test state.

Simultaneous TESTout and TESTin state.

All OFF state.

10. Simultaneous TESTout--Ring Test state.

A parallel in/parallel out data latch is integrated into the L7583C/D. Operation of the data latch is controlled by the
logic level input pin LATCH. The data input to the latch is the INPUT pin of the L7583C/D and the output of the data
latch is an internal node used for state control.

When the LATCH control pin is at logic 1, the data latch is active; the L7583C/D will no longer react to changes at
the INPUT control pin. The state of the switches is now latched; that is, the state of the switches will remain as they
were when the LATCH input transitioned from logic 0 to logic 1. The switches will not respond to changes in INPUT
as long as LATCH is held high.

Note that the T

input is not tied to the data latch. T

is not affected by the LATCH input. T

input will override

state control via INPUT and LATCH.

RING

TESTin

TESTout

TESTin

Switches

Break

Switches

Ring Test

Switches

Ring

Switches

TESTout

Switches

0 V

5 V/Float

Off

0 V

5 V

5 V/Float

Off

0 V

5 V

0 V

5 V/Float

Off

5 V

0 V

5 V/Float

Off

5 V

0 V

5 V/Float

Off

0 V

5 V

5 V/Float

Off

5 V

0 V

5 V

5 V/Float

Off

5 V

5 V/Float

Off

Don't

Care

Don't

Care

Don't

Care

0 V

Off

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. N o liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.

February 2001
DS01-111ALC (Replaces DS00-052ALC)

For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET: http://www.lucent.com/micro
E-MAIL: docmaster@micro.lucent.com
N. AMERICA:

Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18109-3286
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)

ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256

Tel. (65) 778 8833, FAX (65) 777 7495

CHINA: Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai

200233 P. R. China Tel. (86) 21 6440 0468, ext. 325, FAX (86) 21 6440 0652

JAPAN: Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan

Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700

EUROPE: Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368, FAX (44) 1189 328 148

Technical Inquiries: GERMANY: (49) 89 95086 0 (Munich), UNITED KINGDOM: (44) 1344 865 900 (Ascot),

FRANCE: (33) 1 40 83 68 00 (Paris), SWEDEN: (46) 8 594 607 00 (Stockholm), FINLAND: (358) 9 3507670 (Helsinki),
ITALY: (39) 02 6608131 (Milan), SPAIN: (34) 1 807 1441 (Madrid)

Ordering Information

*Devices on tape and reel must be ordered in 1000-piece increments.

Device Part No. Description Package Comcode

ATTL7583AAJ -D Line Card Access Switch 28-Pin SOG (Dry-bagged) 107338626

ATTL7583AAJ-DT* Line Card Access Switch 28-Pin SOG (Tape & Reel, Dry-bagged) 107338659

ATTL7583AF Line Card Access Switch 24-Pin DIP 107338592

ATTL7583BAJ-D Line Card Access Switch 28-Pin SOG (Dry-bagged) 107394355

ATTL7583BAJ-DT* Line Card Access Switch 28-Pin SOG (Tape & Reel, Dry-bagged) 107411563

ATTL7583BF Line Card Access Switch 24-Pin DIP 107394306

ATTL7583CAJ-D Line Card Access Switch 28-Pin SOG (Dry-bagged) 107602229

ATTL7583CAJ-DT* Line Card Access Switch 28-Pin SOG (Tape & Reel, Dry-bagged) 107602245

ATTL7583CF Line Card Access Switch 24-Pin DIP 107602278

ATTL7583DAJ-D Line Card Access Switch 28-Pin SOG (Dry-bagged) 107602328

ATTL7583DAJ-DT* Line Card Access Switch 28-Pin SOG (Tape & Reel, Dry-bagged) 107602344

ATTL7583DF Line Card Access Switch 24-Pin DIP 107602377

Document Outline

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Document Outline

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