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Электронный компонент: BTM1A16E-TR

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Data Sheet
October 2001
Dual Differential Transceivers
BTK1A and BTM1A
Features
Driver Features
s
Two line drivers per package
s
Logic to convert TTL input logic levels to
differential, pseudo-emitter coupled logic (ECL)
output logic levels
s
No line loading when V
CC
= 0 V
s
High output driver for 50
loads
s
200 mA short-circuit current (typical)
s
2.0 ns maximum propagation delay
s
<0.2 ns output skew (typical)
Receiver Features
s
Two line receivers per package
s
High input impedance
8 k
s
Logic that converts differential input logic levels to
transistor-transistor logic (TTL) output logic levels
s
4.0 ns maximum propagation delay
s
<0.20 V input sensitivity (typical)
s
-
1.2 V to
+
7.2 V common-mode range
Common Device Features
s
Common enable for each driver/receiver pair
s
Operating temperature range: 40
C to +125
C
(wider than the 41 Series)
s
Single 5.0 V
10% supply
s
400 Mbits/s maximum data rate
s
Meets enhanced small device interface (ESDI)
standards
s
Electrostatic discharge (ESD) performance better
than the 41 Series
s
Lower power requirement than the 41 Series
Description
The BTK1A and BTM1A devices are dual differential
transceiver circuits that transmit and receive digital
data over balanced transmission lines and are
compatible with Agere Systems Inc. quad differential
drivers and receivers. The dual drivers translate input
TTL logic levels to differential pseudo-ECL output
levels. The dual receivers convert differential input
logic levels to TTL output levels. Each driver/receiver
pair has its own common enable control allowing
serial data and a control clock to be transmitted and
received on a single integrated circuit. The BTK1A
transceiver requires the customer to supply
termination resistors on the circuit board. The
BTM1A transceiver has an internal resistor
termination for both the driver outputs (220
) and
receiver inputs (110
), eliminating the need for
external resistors on the circuit board when used with
100
impedance, twisted-pair (or flat) cable. These
transceivers replace the Agere 41 Series
transceivers.
The powerdown loading characteristics of the
receiver input circuit are approximately 8 k
relative
to the power supplies; hence, they will not load the
transmission line when the circuit is powered down.
For those circuits with termination resistors, the line
will remain impedance matched when the circuit is
powered down. The driver does not load the line
when it is powered down.
The packaging options that are available for the
dual differential transceivers include a 16-pin DIP; a
16-pin, J-lead SOJ; a 16-pin, gull-wing SOIC; and a
16-pin, narrow-body, gull-wing SOIC.
2
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Pin Information
12-2747.b(F)
Figure 1. Differential Transceiver Logic Diagrams
Table 1. Enable Truth Table
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in
excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
Table 2. Absolute Maximum Ratings
ED
ER
D1
D2
R1
R2
0
0
Active
Active
Active
Active
1
0
Disabled
Disabled
Active
Active
0
1
Active
Active
Disabled
Disabled
1
1
Disabled
Disabled
Disabled
Disabled
Parameter
Symbol
Min
Max
Unit
Power Supply Voltage
V
CC
--
6.5
V
Ambient Operating Temperature
T
A
-
40
125
C
Storage Temperature
T
stg
-
55
150
C
1
2
3
4
5
6
7
8
ED
16
15
14
13
12
11
10
9
RO1
DI1
V
CC
ER
GND
DI2
RO2
DO1
RI1
RI1
DO1
DO2
DO2
RI2
RI2
D1
R2
BTM1A
D2
R1
1
2
3
4
5
6
7
8
ED
16
15
14
13
12
11
10
9
RO1
DI1
V
CC
ER
GND
DI2
RO2
DO1
RI1
RI1
DO1
DO2
DO2
RI2
RI2
D1
R2
BTK1A
D2
R1
Agere Systems Inc.
3
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Electrical Characteristics
For variations in electrical characteristics over the temperature range, see Figure 10 on page 10 through Figure 12
on page 11.
Table 3. Power Supply Current Characteristics
T
A
=
-
40 C to +125 C, V
CC
= 5 V
0.5 V.
Third State
These drivers produce pseudo-ECL levels, and the third-state mode is different than the conventional TTL devices.
When a driver is placed in the third state, the bases of the output transistors are pulled low, bringing the outputs
below the active-high and active-low levels. This voltage is typically 2 V for most drivers. In the bidirectional bus
application, the driver of one device, which is in its third state, may be back driven by another driver on the bus
whose voltage in the low state is lower than the third-stated device. This could come about due to differences in the
drivers' independent power supplies. In this case, the device in the third state will control the line, thus clamping
the line and reducing the signal swing. If the difference voltage between the independent power supplies and the
drivers is small, then this consideration can be ignored. In the typical case, the difference voltage can be as much
as 1 V without significantly affecting the amplitude of the driving signal.
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Current (V
CC
= 5.5 V):
All Outputs Disabled:
BTK1A
I
CC
40
65
mA
BTM1A
I
CC
80
115
mA
All Outputs Enabled:
BTK1A
I
CC
20
35
mA
BTM1A
I
CC
80
115
mA
4
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Electrical Characteristics
(continued)
Table 4. Driver Voltage and Current Characteristics
For variations in output voltage over the temperature range, see Figure 10 and Figure 11. T
A
=
-
40 C to +125 C.
* Values are with terminations as per Figure 7.
The input levels and difference voltage provide zero noise immunity and should be tested only in a static, noise-free environment.
Test must be performed one lead at a time to prevent damage to the device.
Parameter
Symbol
Min
Typ
Max
Unit
Output Voltages:
Low*
V
OL
V
OH
1.4
V
OH
-
1.1
V
OH
-
0.65
V
High*:
V
OH
V
CC
-
1.8
V
CC
-
1
V
CC
-
0.8
V
Differential Voltage (V
OH
V
OL
)
V
DIFF
0.65
1.1
1.4
V
Third State, I
OH
= 1.0 mA, V
CC
= 4.5 V
V
OZ
--
V
OL
-
0.5
V
OL
-
0.2
V
Output Voltages (T
A
= 0 C to 85 C):
Low*
V
OL
V
OH
1.4
V
OH
-
1.1
V
OH
-
0.8
V
High*:
V
OH
V
CC
-
1.5
V
CC
-
1
V
CC
-
0.8
V
Differential Voltage (V
OH
V
OL
)
V
DIFF
0.8
1.1
1.4
V
Input Voltages:
Low, V
CC
= 5.5 V:
V
IL
--
--
0.8
V
Data Input
V
IL
--
--
0.8
V
Enable Input
V
IL
--
--
0.7
V
High, V
CC
= 4.5 V
V
IH
2.0
--
--
V
Clamp, V
CC
= 4.5 V, I
I
= 5.0 mA
V
IK
--
--
-
1.0
V
Short-circuit Output Current, V
CC
= 5.5 V
I
OS
100
--
--
mA
Input Currents, V
CC
= 5.5 V:
Low, V
I
= 0.4 V
I
IL
--
--
-
400
A
High, V
I
= 2.7 V
I
IH
--
--
20
A
Reverse, V
I
= 5.5 V
I
IH
--
--
100
A
Output Resistors:
BTM1A
R
O
--
220
--
Agere Systems Inc.
5
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Electrical Characteristics
(continued)
Table 5. Receiver Voltage and Current Characteristics
For variation in minimum V
OH
and maximum V
OL
over the temperature range, see Figure 10.
T
A
=
-
40 C to +125 C.
* The input levels and difference voltage provide zero noise immunity and should be tested only in a static, noise-free environment.
Outputs of unused receivers assume a logic 1 level when the inputs are left open. (It is recommended that all unused positive inputs
be tied to the positive power supply. No external series resistor is required.)
Test must be performed one lead at a time to prevent damage to the device.
Parameter
Symbol
Min
Typ
Max
Unit
Output Voltages V
CC
= 4.5 V:
Low, I
OL
= 8.0 mA*
V
OL
--
--
0.5
V
High, I
OH
=
-
400
A
V
OH
2.4
--
--
V
Enable Input Voltages:
Low, V
CC
= 5.5 V
V
IL
*
--
--
0.7
V
High, V
CC
= 4.5 V
V
IH
*
2.0
--
--
V
Clamp, V
CC
= 4.5 V, I
I
= 5.0 mA
V
IK
--
--
-
1.0
V
Minimum Differential Input Voltages, V
IH
V
IL
:
-
0.80 V < V
IH
< 7.2 V,
-
1.2 V < V
IL
< 6.8 V
V
TH
*
--
0.1
0.20
V
Input Offset Voltage
V
OFF
0.03
0.05
V
Output Currents, V
CC
= 5.5 V:
Off-state (high Z), V
O
= 0.4 V
I
OZL
--
--
20
A
Off-state (high Z), V
O
= 2.4 V
I
OZH
--
--
20
A
Short Circuit
I
OS
25
--
100
mA
Enable Input Currents, V
CC
= 5.5 V:
Low, V
IN
= 0.4 V
I
IL
--
--
400
A
High, V
IN
= 2.7 V
I
IH
--
--
20
A
Reverse, V
IN
= 5.5 V
I
IH
--
--
100
A
Differential Input Currents, (BTK1A):
Low, V
IN
= 1.2 V
I
IL
--
--
-
1.0
mA
High, V
IN
= 7.2 V
I
IH
--
--
1.0
mA
Differential Input Impedance (BTM1A):
Connected Between RI and RI
R
1
--
110
--
6
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Timing Characteristics
Table 6. Driver Timing Characteristics (See Figure 3 and Figure 4.)
For t
P1
and t
P2
propagation delays over the temperature range, see Figure 13. Propagation delay test circuit
connected to output is shown in Figure 7. T
A
=
-
40 C to +125 C, V
CC
= 5 V
0.5 V.
* tP1 and tP2 are measured from the 1.5 V point of the input to the crossover point of the outputs (see Figure 3).
CL = 5 pF. Capacitor is connected from each output to ground.
Table 7. Receiver Timing Characteristics (See Figure 5 and Figure 6.)
For propagation delays (t
PLH
and t
PHL
) over the temperature range, see Figure 14 and Figure 15. Propagation delay
test circuit connected to output is shown in Figure 8. T
A
=
-
40 C to +125 C, V
CC
= 5 V
0.5 V.
Parameter
Symbol
Min
Typ
Max
Unit
Propagation Delay:
Input High to Output
t
P1
*
0.8
1.2
2.0
ns
Input Low to Output
t
P2
*
0.8
1.2
2.0
ns
Capacitive Delay
t
p
--
0.02
0.03
ns/pF
Disable Time (either E1 or E2):
High-to-High Impedance
t
PHZ
4
8
12
ns
Low-to-High Impedance
t
PLZ
4
8
12
ns
Enable Time (either E1 or E2):
High Impedance to High
t
PZH
4
8
12
ns
High Impedance to Low
t
PZL
4
8
12
ns
Output Skew:
|t
P1
t
P2
|
t
skew1
--
0.1
0.3
ns
|t
PHH
t
PHL
|, |t
PLH
t
PLL
|
t
skew2
--
0.2
0.5
ns
Difference Between Drivers
t
skew
--
--
0.3
ns
Rise Time (20%--80%)
t
tLH
--
0.7
2
ns
Fall Time (80%--20%)
t
tHL
--
0.7
2
ns
Parameter
Symbol
Min
Typ
Max
Unit
Propagation Delay:
Input to Output High
t
PLH
1.5
2.5
4.0
ns
Input to Output Low
t
PHL
1.5
2.5
4.0
ns
Pulse Width Distortion, ltpHL-tpLHI:
Load Capacitance (C
L
) = 15 pF
tskew1
--
--
0.7
ns
Load Capacitance (C
L
) = 150 pF
tskew1
--
--
4.0
ns
Output Waveform Skews:
Part-to-Part Skew, T
A
= 75 C
tskew1p-p
--
0.8
1.4
ns
Part-to-Part Skew, T
A
= 40 C to +125 C
tskew1p-p
--
--
1.5
ns
Same Part Skew
tskew
--
--
0.3
ns
Disable Time, C
L
= 5 pF:
High-to-high Impedance
t
PHZ
--
5
12
ns
Low-to-high Impedance
t
PLZ
--
5
12
ns
Enable Time:
High Impedance to High
t
PZH
--
8
12
ns
High Impedance to Low
t
PZL
--
8
12
ns
Rise Time (20%--80%)
t
tLH
--
--
3.0
ns
Fall Time (80%--20%)
t
tHL
--
--
3.0
ns
Agere Systems Inc.
7
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Timing Characteristics
(continued)
12-3462(F)
Note: This graph is included as an aid to the system designers. Total circuit delay varies with load capacitance. The total delay is the sum of the
delay due to the external capacitance and the intrinsic delay of the device.
Figure 2. Typical Extrinsic Propagation Delay Versus Load Capacitance at 25 C
12-2677(F)
Figure 3. Driver Propagation Delay Timing
25
50
75
100
125
150
0
LOAD CAPACITANCE, C
L
(pF)
2
1
3
7
175
200
0
4
5
6
EX
T
R
IN
S
I
C
PR
OP
AG
A
T
I
O
N

D
E
LAY
,
t
P
(ns
)
t
PHL
(TYP)
t
PLH
(TYP)
INPUT
TRANSITION
OUTPUTS
OUTPUT
OUTPUT
OUTPUT
t
tLH
t
PHL
t
tHL
t
PLH
t
PHH
t
PLL
t
P2
t
P1
20%
80%
20%
80%
2.4 V
1.5 V
0.4 V
V
OH
V
OL
V
OH
(V
OH
+ V
OL
)/2
V
OL
V
OH
(V
OH
+ V
OL
)/2
V
OL
V
OH
V
OL
8
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Timing Characteristics
(continued)
12-2268.c(F)
Note: In the third state, both outputs (i.e., OUTPUT and OUTPUT) are 0.1 V below the low state.
Figure 4. Driver Enable and Disable Timing
12-2251.a(F)
Figure 5. Receiver Propagation Delay Timing
ED
OUTPUT
OUTPUT
t
PHZ
t
PZH
t
PLZ
t
PZL
3.0 V
1.3 V
0.0 V
V
OH
V
OL
+ 0.2 V
V
OL
V
OL
0.1 V
V
OL
V
OL
0.1 V
INPUT
OUTPUT
INPUT
80%
20%
3.7 V
3.2 V
2.7 V
V
OH
1.3 V
V
OL
80%
20%
t
PHL
t
tHL
t
PLH
t
tLH
Data Sheet
October 2001
Agere Systems Inc.
9
BTK1A and BTM1A
Dual Differential Transceivers
Timing Characteristics
(continued)
12-2538.a(F)
* E2 = 1 while E1 changes state.
E1 = 0 while E2 changes state.
Figure 6. Receiver Enable and Disable Timing
V = 0.5 V
V = 0.5 V
V = 0.5 V
V = 0.5 V
E1*
OUTPUT
t
PHZ
t
PZH
3 V
1.3 V
0 V
E2
3 V
1.3 V
0 V
V
OH
V
OL
1.3 V
t
PZL
t
PLZ
Test Conditions
Parametric values specified under the Electrical
Characteristics and Timing Characteristics sections for
the data transmission driver devices are measured with
the following output load circuits.
12-2271.a(F)
BTK1A
12-2271.b(F)
BTM1A
Figure 7. Driver Propagation Delay Test Circuit
12-2249(F)
* Includes probe and jig capacitances.
Note: All 458E, IN4148, or equivalent diodes.
Figure 8. Receiver Propagation Delay Test Circuit
DO
DO
200
200
100
DO
DO
100
TO OUTPUT OF
DEVICE UNDER
TEST
C
L
15 pF*
5 k
2 k
+5 V
10
10
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Output Characteristics
Figure 9 illustrates typical driver output characteristics.
Included are load lines for two typical termination
configurations.
12-2269(F)
A. Output Current vs. Output Voltage for Loads
Shown in B and C
12-2270(F)
B. Y Load
12-2271.a(F)
C.
Load
Figure 9. Driver Output Current Versus Voltage
Characteristics
Temperature Characteristics
2-3467(F)
Figure 10. V
OL
and V
OH
Extremes for Drivers Versus
Temperature for 100
Load
12-3468(F)
Figure 11. Differential Voltage (V
OH
V
OL
) for
Drivers Versus Temperature
10
20
30
40
Y LOAD
LOAD
OUTPUT VOLTAGE (V)
O
U
TP
UT
CURRE
NT
(m
A
)
V
OL
V
OH
V
CC
2 V
V
CC
1 V
V
CC
DO
60
60
90
DO
DO
DO
200
200
100
25
0
25
50
75
100
2.5
TEMPERATURE (C)
2.0
0
125 150
50
0.5
1.0
1.5
OU
TP
U
T
VOL
T
AGE

R
E
L
A
T
I
V
E
TO V
CC
V
OH
MAX
V
OH
MIN
V
OL
MAX
V
OL
MIN
25
0
25
50
75
100
0
TEMPERATURE (C)
0.4
1.2
125 150
50
1.0
0.8
0.6
DI
FFE
RE
NTI
A
L V
O
LT
A
G
E

(V
)
V
OH
V
OL
TYP
V
OH
V
OL
MIN
Agere Systems Inc.
11
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Temperature Characteristics
(continued)
12-3464.b(F)
Figure 12. Minimum V
OH
and Maximum V
OL
Versus
Temperature at V
CC
= 4.5 V for the
Receiver
12-3469.a(F)
Figure 13. Min and Max for t
P1
and t
P2
Propagation
Delays Versus Temperature for the
Driver
12-3465(F)
Figure 14. Propagation Delay for a High Output
(t
PLH
) Versus Temperature at V
CC
= 5.0 V
for the Receivers
12-3466(F)
Figure 15. Propagation Delay for a Low Output
(t
PHL
) Versus Temperature at V
CC
= 5.0 V
for the Receivers
25
0
25
50
75
100
0.0
1.6
TEMPERATURE (
C)
0.8
0.4
1.2
2.8
125
150
2.0
VO
LT
AG
E
(V
)
50
2.4
V
OH
MIN
V
OL
MAX
3.2
3.6
3.8
25
0
25
50
75
100
0.5
TEMPERATURE (C)
0.7
1.7
125 150
50
2.1
2.3
PR
O
P
A
G
AT
IO
N
D
E
LA
Y (ns)
1.5
1.3
1.1
0.9
1.9
0.3
RANGE FOR t
P1
AND t
P2
MAX
MIN
25
0
25
50
75
100
1.00
3.00
TEMPERATURE (
C)
2.00
1.50
2.50
4.00
125
150
3.50
MAX
TYP
MIN
PR
OP
AG
A
T
I
O
N
D
E
LAY
(ns
)
50
25
0
25
50
75
1.00
1.50
2.00
4.00
125
150
50
2.50
3.00
3.50
MAX
TYP
MIN
P
R
O
PAG
A
T
I
O
N
D
E
LA
Y (
n
s)
TEMPERATURE (
C)
100
12
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Handling Precautions
CAUTION: This device is susceptible to damage as a result of electrostatic discharge. Take proper
precautions during both handling and testing. Follow guidelines such as JEDEC Publication
No. 108-A (Dec. 1988).
When handling and mounting line driver products, proper precautions should be taken to avoid exposure to
electrostatic discharge (ESD). The user should adhere to the following basic rules for ESD control:
1. Assume that all electronic components are sensitive to ESD damage.
2. Never touch a sensitive component unless properly grounded.
3. Never transport, store, or handle sensitive components except in a static-safe environment.
ESD Failure Models
Agere employs two models for ESD events that can cause device damage or failure:
1. A human-body model (HBM) that is used by most of the industry for ESD-susceptibility testing and protection-
design evaluation. ESD voltage thresholds are dependent on the critical parameters used to define the model.
A standard HBM (resistance = 1500
, capacitance = 100 pF) is widely used and, therefore, can be used for
comparison purposes.
2. A charged-device model (CDM), which many believe is the better simulator of electronics manufacturing
exposure.
Table 8 and Table 9 illustrate the role these two models play in the overall prevention of ESD damage. HBM ESD
testing is intended to simulate an ESD event from a charged person. The CDM ESD testing simulates charging and
discharging events that occur in production equipment and processes, e.g., an integrated circuit sliding down a
shipping tube.
The HBM ESD threshold voltage presented here was obtained by using these circuit parameters.
Table 8. Typical ESD Thresholds for Data Transmission Transceivers
Table 9. ESD Damage Protection
Device
HBM Threshold
CDM Threshold
BTK1A
BTM1A
>
800
>
1000
All other pins
>
2000
>
1000
ESD Threat Controls
Personnel
Processes
Control
Wrist straps
ESD shoes
Antistatic flooring
Static-dissipative materials
Air ionization
Model
Human-body model (HBM)
Charged-device model (CDM)
Agere Systems Inc.
13
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Latch-Up
Latch-up evaluation has been performed on the data transmission receivers. Latch-up testing determines if the
power-supply current exceeds the specified maximum due to the application of a stress to the device under test. A
device is considered susceptible to latch-up if the power supply current exceeds the maximum level and remains at
that level after the stress is removed.
Agere performs latch-up testing per an internal test method which is consistent with JEDEC Standard No. 17
(previously JC-40.2) CMOS Latch-Up Standardized Test Procedure.
Latch-up evaluation involves the following three separate stresses to evaluate latch-up susceptibility levels:
1. dc current stressing of input and output pins.
2. Power supply slew rate.
3. Power supply overvoltage.
Table 10. Latch-Up Test Criteria and Test Results
Based on the results in Table 10, the data transmission receivers pass the Agere latch-up testing requirements and
are considered not susceptible to latch-up.
dc Current Stress
of I/O Pins
Power Supply
Slew Rate
Power Supply
Overvoltage
Data Transmission
Receiver ICs
Minimum Criteria
150 mA
1 s
1.75 x Vmax
Test Results
250 mA
100 ns
2.25 x Vmax
14
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Outline Diagrams
16-Pin DIP
Dimensions are in millimeters.
5-4410(F)
Note: The dimensions in this outline diagram are intended for informational purposes only. For detailed schematics to assist your design efforts,
please contact your Agere Sales Representative.
Package
Description
Number of
Pins
(N)
Package Dimensions
Maximum Length
(L)
Maximum Width
Without Leads
(B)
Maximum Width
Including Leads
(W)
Maximum Height
Above Board
(H)
PDIP3 (Plastic
Dual-In-Line
Package)
16
20.57
6.48
7.87
5.08
W
H
0.58 MAX
2.54 TYP
0.38 MIN
SEATING PLANE
N
1
PIN #1 IDENTIFIER ZONE
L
B
Agere Systems Inc.
15
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Outline Diagrams
(continued)
16-Pin SOIC (SONB/SOG)
Dimensions are in millimeters.
5-4414(F)
Note: The dimensions in this outline diagram are intended for informational purposes only. For detailed schematics to assist your design efforts,
please contact your Agere Sales Representative.
Package
Description
Number of
Pins
(N)
Package Dimensions
Maximum Length
(L)
Maximum Width
Without Leads
(B)
Maximum Width
Including Leads
(W)
Maximum Height
Above Board
(H)
SONB (Small-
Outline, Narrow
Body)
16
10.11
4.01
6.17
1.73
SOG (Small-
Outline, Gull-
Wing)
16
10.49
7.62
10.64
2.67
W
0.61
0.51 MAX
H
0.28 MAX
0.10
SEATING PLANE
1.27 TYP
N
L
B
1
PIN #1 IDENTIFIER ZONE
16
Agere Systems Inc.
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Outline Diagrams
(continued)
16-Pin SOIC (SOJ)
Dimensions are in millimeters.
5-4413(F)r.3
Note: The dimensions in this outline diagram are intended for informational purposes only. For detailed schematics to assist your design efforts,
please contact your Agere Sales Representative.
Package
Description
Number of
Pins
(N)
Package Dimensions
Maximum Length
(L)
Maximum Width
Without Leads
(B)
Maximum Width
Including Leads
(W)
Maximum Height
Above Board
(H)
SOJ (Small-
Outline, J-Lead)
16
10.41
7.62
8.81
3.18
N
1
PIN #1 IDENTIFIER ZONE
0.51 MAX
0.79 MAX
0.10
SEATING PLANE
1.27 TYP
H
W
B
L
Agere Systems Inc.
17
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Power Dissipation
System designers incorporating Agere data
transmission drivers in their applications should be
aware of package and thermal information associated
with these components.
Proper thermal management is essential to the long-
term reliability of any plastic encapsulated integrated
circuit. Thermal management is especially important
for surface-mount devices, given the increasing circuit
pack density and resulting higher thermal density. A
key aspect of thermal management involves the
junction temperature (silicon temperature) of the
integrated circuit.
Several factors contribute to the resulting junction
temperature of an integrated circuit:
s
Ambient use temperature
s
Device power dissipation
s
Component placement on the board
s
Thermal properties of the board
s
Thermal impedance of the package
Thermal impedance of the package is referred to as
ja
and is measured in C rise in junction temperature
per watt of power dissipation. Thermal impedance is
also a function of airflow present in system application.
The following equation can be used to estimate the
junction temperature of any device:
T
j
= T
A
+
P
D
ja
where:
T
j
is device junction temperature (C).
T
A
is ambient temperature (C).
P
D
is power dissipation (W).
ja
is package thermal impedance (junction to
ambient
--
C/W).
The power dissipation estimate is derived from two
factors:
s
Internal device power
s
Power associated with output terminations
Multiplying I
CC
times V
CC
provides an estimate of
internal power dissipation.
The power dissipated in the output is a function of the:
s
Termination scheme on the outputs
s
Termination resistors
s
Duty cycle of the output
Package thermal impedance depends on:
s
Airflow
s
Package type (e.g., DIP, SOIC, SOIC/NB)
The junction temperature can be calculated using the
previous equation, after power dissipation levels and
package thermal impedances are known.
Figure 16 illustrates the thermal impedance estimates
for the various package types as a function of airflow.
This figure shows that package thermal impedance is
higher for the narrow-body SOIC package. Particular
attention should, therefore, be paid to the thermal
management issues when using this package type.
In general, system designers should attempt to
maintain junction temperature below 125 C. The
following factors should be used to determine if specific
data transmission drivers in particular package types
meet the system reliability objectives:
s
System ambient temperature
s
Power dissipation
s
Package type
s
Airflow
12-2753F
Figure 16. Power Dissipation
DIP
SOIC/NB
J-LEAD SOIC/GULL WING
AIRFLOW (ft./min.)
200
400
600
800
1000
1200
0
40
50
60
70
80
90
100
110
120
130
140
T
H
ER
M
A
L R
ESI
ST
AN
C
E
ja
(
C/
W
)
Copyright 2001 Agere Systems Inc.
All Rights Reserved
October 2001
DS02-011HSI (Replaces DS99-009HSI)
Agere Systems Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
For additional information, contact your Agere Systems Account Manager or the following:
INTERNET:
http://www.agere.com
E-MAIL:
docmaster@agere.com
N. AMERICA:
Agere Systems Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18109-3286
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA:
Agere Systems Hong Kong Ltd., Suites 3201 & 3210-12, 32/F, Tower 2, The Gateway, Harbour City, Kowloon
Tel. (852) 3129-2000, FAX (852) 3129-2020
CHINA: (86) 21-5047-1212 (Shanghai), (86) 10-6522-5566 (Beijing), (86) 755-695-7224 (Shenzhen)
JAPAN: (81) 3-5421-1600 (Tokyo), KOREA: (82) 2-767-1850 (Seoul), SINGAPORE: (65) 778-8833, TAIWAN: (886) 2-2725-5858 (Taipei)
EUROPE:
Tel. (44) 7000 624624, FAX (44) 1344 488 045
Data Sheet
October 2001
BTK1A and BTM1A
Dual Differential Transceivers
Ordering Information
* Indicates on-chip output terminating resistors from each driver output to ground.
Indicates on-chip input terminations across receiver inputs.
Part Number
Driver
Termination*
Receiver
Termination
Package Type
Comcode
Former
Pkg.
Type
Former
Part Number
BTK1A16E
None
None
16-pin, Plastic SOJ
107950347
1041
LK, MK
BTK1A16E-TR
None
None
Tape & Reel SOJ
107950354
1041
LK, MK, -TR
BTK1A16G
None
None
16-pin, Plastic SOIC
107950362
1141
LK, MK
BTK1A16G-TR
None
None
Tape & Reel SOIC
107950370
1141
LK, MK, -TR
BTK1A16NB
None
None
Plastic SOIC/NB
107950388
1241
LK, MK
BTK1A16NB-TR
None
None
Tape & Reel SOIC/NB
107950396
1241
LK, MK, -TR
BTK1A16P
None
None
16-pin, Plastic DIP
107950404
41
LK, MK
BTM1A16E
220
110
16-pin, Plastic SOJ
107950537
1041
LM, MM
BTM1A16E-TR
220
110
Tape & Reel SOJ
107950545
1041
LM, MM, -TR
BTM1A16G
220
110
16-pin, Plastic SOIC
107950552
1141
LM, MM
BTM1A16G-TR
220
110
Tape & Reel SOIC
107950560
1141
LM, MM, -TR
BTM1A16NB
220
110
Plastic SOIC/NB
107950578
1241
LM, MM
BTM1A16NB-TR
220
110
Tape & Reel SOIC/NB
107950586
1241
LM, MM, -TR
BTM1A16P
220
110
16-pin, Plastic DIP
107950594
41
LM, MM