Agilent ABA-31563
3.5 GHz Broadband Silicon
RFIC Amplifier
Data Sheet
Description
Agilent's ABA-31563 is an
economical, easy-to-use, inter-
nally 50
matched, silicon
monolithic broadband amplifier
that offers excellent gain and
broadband response from DC to
3.5 GHz. Packaged in an ultra-
miniature SOT-363 package, it
requires half the board space of
a SOT-143 package.
At 2 GHz, the ABA-31563 offers
a small-signal gain of 21.5 dB,
output P1dB of 2.2 dBm and
13.1 dBm output third order
intercept point. It is suitable for
use as wideband applications.
They are designed for low cost
gain blocks in cellular applica-
tions, DBS tuners, LNB and other
wireless communication systems.
ABA-31563 is fabricated using
Agilent's HP25 silicon bipolar
process, which employs a double-
diffused single polysilicon
process with self-aligned submi-
cron emitter geometry. The
process is capable of simulta-
neous high f
T
and high NPN
breakdown (25 GHz f
T
at 6V
BVCEO). The process utilizes
industry standard device oxide
isolation technologies and
submicron aluminum multilayer
interconnect to achieve superior
performance, high uniformity,
and proven reliability.
Features
Operating Frequency DC ~ 3.5GHz
21.5 dB Gain
VSWR < 2.0 throughout operating
frequency
2.2 dBm Output P1dB
13.1 dBm Output IP3
3.8 dB Noise Figure
Unconditionally Stable
Single 3V Supply (Id = 14 mA)
Lead-free
Applications
Amplifier for Cellular, Cordless,
Special Mobile Radio, PCS, ISM,
Wireless LAN, DBS, TVRO, and TV
Tuner Applications
Surface Mount Package
SOT-363/SC70
Pin Connections and
Package Marking
Simplified Schematic
Note:
Top View. Package marking provides orientation
and identification. "x" is the date code.
Vcc
GND 3
1Kx
Input
GND 2
GND 1
Output
& Vcc
Vcc
Ground 2
Ground 1
Ground 3
RF
Input
RF
Output
& Vcc
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1B)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
2
ABA-31563 Absolute Maximum Ratings
[1]
Symbol
Parameter
Units
Absolute Max.
V
cc
Device Voltage, RF output to ground (T = 25
C)
V
6
P
in
CW RF Input Power (Vcc = 3V)
dBm
15
P
diss
Total Power Dissipation
[3]
W
0.3
T
j
Junction Temperature
C
150
T
STG
Storage Temperature
C
-65 to 150
Notes:
1. Operation of this device in excess of any of
these limits may cause permanent damage.
2. Thermal resistance measured using 150
C
Liquid Crystal Measurement Technique.
3. Board (package belly) temperature, Tc, is
25
C. Derate 2.3 mW/C for Tc
> 120.8
C.
Electrical Specifications
T
c
= +25
C, Z
o
= 50
, P
in
= -30 dBm, V
cc
= 3V, Freq = 2 GHz, unless stated otherwise.
Symbol
Parameter and Test Condition
Units
Min.
Typ.
Max.
Std Dev.
Gp
[1]
Power Gain (|S
21
|
2
)
dB
20.0
21.5
Gp
Power Gain Flatness, f = 0.1 ~ 2.5 GHz
dB
0.2
f = 0.1 ~ 3.5 GHz
1.3
NF
[1]
Noise Figure
dB
3.8
4.8
P1dB
[1]
Output Power at 1dB Gain Compression
dBm
2.2
OIP3
[1]
Output Third Order Intercept Point
dBm
13.1
VSWR
in
[1]
Input VSWR
<1.5
VSWR
out
[1]
Output VSWR
<1.5
Icc
[1]
Device Current
mA
14
16
Td
[1]
Group Delay
ps
140
Notes:
1. Measurements taken on 50
test board shown on Figure 1. Excess circuit losses had been de-embedded from actual measurements. Standard
deviation and typical data based on at least 500 parts sample size from 2 wafer lots. Future wafers allocated to this product may have nominal values
anywhere within the upper and lower spec limits.
Figure 1. ABA-31563 Production Test Circuit.
Thermal Resistance
[2]
(Vcc = 3V)
j-c
= 125
C/W
RF Output
RF Input
Vcc
RFC
33 nH
C
block
1 nF
C
block
1 nF
1Kx
C
bypass
100 pF
C
bypass
1000 pF
3
ABA-31563 Typical Performance
T
c
= +25
C, Z
o
= 50
, V
cc
= 3V unless stated otherwise.
FREQUENCY (GHz)
Figure 2. Gain vs. Frequency and Voltage.
GAIN (dB)
0
23
22
21
20
19
18
17
4
1
0.5
2
2.5
3
1.5
3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 3. Gain vs. Frequency and Temperature.
GAIN (dB)
0
23
22
21
20
19
18
17
4
1
0.5
2
2.5
3
1.5
3.5
+85
C
+25
C
-40
C
FREQUENCY (GHz)
Figure 4. Noise Figure vs. Frequency and
Voltage.
NF (dB)
0
6
5.5
5
4.5
4
3.5
3
4
1
0.5
2
2.5
3
1.5
3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 5. Noise Figure vs. Frequency and
Temperature.
NF (dB)
0
6
5.5
5
4.5
4
3.5
3
4
1
0.5
2
2.5
3
1.5
3.5
+85
C
+25
C
-40
C
FREQUENCY (GHz)
Figure 6. Output Power for 1 dB Gain
Compression vs. Frequency and Voltage.
P1dB (dBm)
0
6
4
2
0
-2
-4
4
1
0.5
2
2.5
3
1.5
3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 7. Output Power for 1 dB Gain
Compression vs. Frequency and Temperature.
P1dB (dBm)
0
6
4
2
0
-2
-4
4
1
0.5
2
2.5
3
1.5
3.5
+85
C
+25
C
-40
C
4
ABA-31563 Typical Performance,
continued
T
c
= +25
C, Z
o
= 50
, V
cc
= 3V unless stated otherwise.
FREQUENCY (GHz)
Figure 8. Output IP3 vs. Frequency and
Voltage.
OIP3 (dBm)
0
20
16
12
8
4
0
4
1
0.5
2
2.5
3
1.5
3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 9. Output IP3 vs. Frequency and
Temperature.
OIP3 (dBm)
0
20
16
12
8
4
0
4
1
0.5
2
2.5
3
1.5
3.5
+85
C
+25
C
-40
C
FREQUENCY (GHz)
Figure 10. Input and Output VSWR vs.
Frequency.
VSWR
1.8
1.6
1.4
1.2
1.0
VSWR IN
VWSR OUT
0
4
1
0.5
2
2.5
3
1.5
3.5
VOLTAGE (V)
Figure 11. Supply Current vs. Voltage and
Temperature.
Icc (mA)
0
70
60
50
40
30
20
10
0
2
1
4
5
6
3
7
+85
C
+25
C
-40
C
5
ABA-31563 Typical Scattering Parameters
T
C
= +25
C, Z
O
= 50
, V
CC
= 3V, unless stated otherwise
Freq
S
11
S
11
S
21
S
21
S
21
S
12
S
12
S
22
S
22
K
(GHz)
Mag.
Ang.
dB
Mag.
Ang.
Mag.
Ang.
Mag.
Ang.
Factor
0.10
0.05
3.1
21.25
11.54
-4.1
0.03
-0.6
0.23
-4.9
1.800
0.20
0.06
1.6
21.26
11.56
-8.3
0.03
-0.7
0.23
-9.3
1.800
0.30
0.06
1.1
21.28
11.59
-12.5
0.02
-0.6
0.23
-13.6
1.800
0.40
0.06
0.3
21.31
11.62
-16.9
0.02
-0.4
0.23
-18.0
1.800
0.50
0.07
18.4
21.3
11.62
-21.7
0.02
-0.4
0.21
-18.4
1.800
0.60
0.08
21.0
21.3
11.61
-26.3
0.02
0.0
0.21
-20.1
1.900
0.70
0.09
21.0
21.31
11.62
-30.8
0.02
0.8
0.21
-21.9
1.900
0.80
0.10
20.7
21.31
11.62
-35.3
0.02
1.5
0.21
-24.0
1.900
0.90
0.10
18.8
21.32
11.64
-39.8
0.02
2.4
0.20
-26.1
1.900
1.00
0.11
19.2
21.32
11.64
-44.4
0.02
3.2
0.20
-28.1
1.900
1.10
0.12
15.5
21.32
11.65
-48.9
0.02
4.2
0.20
-30.2
1.900
1.20
0.12
14.0
21.32
11.64
-53.4
0.02
5.4
0.20
-32.2
1.900
1.30
0.12
12.4
21.33
11.65
-58.0
0.02
6.5
0.19
-34.6
1.900
1.40
0.13
9.5
21.32
11.64
-62.6
0.02
7.7
0.19
-36.9
1.900
1.50
0.13
7.5
21.35
11.69
-67.2
0.02
8.9
0.18
-39.1
1.900
1.60
0.14
5.0
21.37
11.71
-71.9
0.02
10.2
0.17
-41.2
1.900
1.70
0.14
3.7
21.36
11.70
-76.8
0.02
11.5
0.17
-43.1
1.900
1.80
0.15
0.5
21.36
11.70
-81.4
0.02
12.5
0.16
-44.7
1.900
1.90
0.15
-2.6
21.37
11.71
-86.2
0.02
13.4
0.15
-46.1
1.900
2.00
0.16
-4.2
21.37
11.71
-91.2
0.02
14.8
0.14
-47.8
1.900
2.20
0.17
-9.7
21.33
11.66
-100.7
0.02
16.8
0.12
-48.2
1.800
2.40
0.17
-15.7
21.32
11.64
-110.8
0.03
18.5
0.10
-46.8
1.800
2.60
0.18
-20.1
21.21
11.50
-121.2
0.03
21.0
0.08
-39.7
1.800
2.80
0.19
-27.1
21.1
11.35
-131.2
0.03
21.9
0.07
-23.6
1.700
3.00
0.19
-34.0
20.94
11.15
-141.5
0.03
22.3
0.08
-9.9
1.700
3.20
0.20
-41.7
20.73
10.87
-152.0
0.03
23.2
0.08
0.4
1.700
3.40
0.20
-48.8
20.43
10.51
-162.2
0.03
24.2
0.10
6.3
1.600
3.60
0.20
-57.6
20.12
10.14
-172.3
0.03
24.6
0.11
7.6
1.600
3.80
0.19
-67.0
19.77
9.74
177.7
0.03
25.2
0.12
6.6
1.600
4.00
0.19
-76.0
19.38
9.31
167.9
0.04
25.2
0.13
6.6
1.600
4.20
0.18
-85.5
18.94
8.85
158.6
0.04
25.8
0.14
5.7
1.600
4.40
0.17
-98.2
18.57
8.48
149.1
0.04
24.9
0.14
1.6
1.600
4.60
0.16
-111.5
18.16
8.09
139.4
0.04
24.2
0.14
-2.9
1.600
4.80
0.15
-123.8
17.66
7.64
129.7
0.04
23.2
0.15
-6.5
1.600
5.00
0.14
-136.6
17.08
7.14
120.6
0.05
22.0
0.15
-10.1
1.600
5.20
0.13
-149.9
16.52
6.70
111.9
0.05
20.6
0.15
-15.1
1.600
5.40
0.13
-162.5
15.9
6.24
103.5
0.05
19.2
0.15
-19.7
1.600
5.60
0.14
-175.1
15.37
5.87
95.5
0.06
16.9
0.15
-27.2
1.600
5.80
0.14
170.6
14.81
5.50
87.5
0.06
13.9
0.14
-33.8
1.600
6.00
0.14
164.1
14.22
5.14
80.0
0.06
11.8
0.13
-38.1
1.700
6
Ordering Information
Part Number
Devices per Container
Container
ABA-31563-TR1G
3000
7" reel
ABA-31563-TR2G
10000
13" reel
ABA-31563-BLKG
100
antistatic bag
Note: Only lead-free option available.
Package Dimensions
Outline 63 (SOT-363/SC-70)
Device Models
Refer to Agilent's web site
www.agilent.com/view/rf
Recommended PCB Pad Layout for
Agilent's SC70 6L/SOT-363 Products
E
HE
D
e
A1
b
A
A2
Q1
L
c
DIMENSIONS (mm)
MIN.
1.15
1.80
1.80
0.80
0.80
0.00
0.10
0.15
0.10
0.10
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
0.40
0.30
0.20
0.30
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
c
L
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form,
ie: reverse trim/form.
6. Package surface to be mirror finish.
0.650 BCS
0.026
0.079
0.018
0.039
Dimensions in inches.
7
Device Orientation
Tape Dimensions and Product Orientation for Outline 63
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
REEL
END VIEW
8 mm
4 mm
TOP VIEW
(Package marking example orientation shown.)
1Kx
1Kx
1Kx
1Kx
P
P
0
P
2
F
W
C
D
1
D
E
A
0
10
MAX.
t
1
(CARRIER TAPE THICKNESS)
T
t
(COVER TAPE THICKNESS)
10
MAX.
B
0
K
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
2.40
0.10
2.40
0.10
1.20
0.10
4.00
0.10
1.00 + 0.25
0.094
0.004
0.094
0.004
0.047
0.004
0.157
0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.50
0.10
4.00
0.10
1.75
0.10
0.061 + 0.002
0.157
0.004
0.069
0.004
PERFORATION
WIDTH
THICKNESS
W
t
1
8.00 + 0.30 - 0.10
0.254
0.02
0.315 + 0.012
0.0100
0.0008
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50
0.05
2.00
0.05
0.138
0.002
0.079
0.002
DISTANCE
WIDTH
TAPE THICKNESS
C
T
t
5.40
0.10
0.062
0.001
0.205 + 0.004
0.0025
0.0004
COVER TAPE
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright 2004 Agilent Technologies, Inc.
Obsoletes 5989-0755EN
November 30, 2004
5989-1968EN
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