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Электронный компонент: HCPL-0300-300

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8 MBd Low Input Current
Optocoupler
Technical Data
HCPL-2300/HCPL-0300
Features
Guaranteed Low Thresholds:
I
F
= 0.5 mA, V
F
1.5 V
High Speed: Guaranteed
5 MBd over Temperature
Versatile: Compatible with
TTL, LSTTL and CMOS
Efficient 820 nm AlGaAs LED
Internal Shield for
Guaranteed Common Mode
Rejection
Schottky Clamped, Open
Collector Output with
Optional Integrated Pull-Up
Resistor
Static and Dynamic
Performance Guaranteed
from -40
C to 85
C
Safety Approval
UL Recognized -3750 V rms for
1 minute
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with V
IORM
= 630
V
peak
(Option 060)
Applications
Ground Loop Elimination
Computer-Peripheral
Interfaces
Level Shifting
Microprocessor System
Interfaces
Digital Isolation for A/D,
D/A Conversion
RS-232-C Interface
High Speed, Long Distance
Isolated Line Receiver
Description
The HCPL-2300/HCPL-0300
optocoupler combines an 820 nm
AlGaAs photon emitting diode
with an integrated high gain
photon detector. This
combination of Agilent designed
and manufactured semiconductor
devices brings new high
performance capabilities to
designers of isolated logic and
data communication circuits.
The new low current, high speed
AlGaAs emitter manufactured
with a unique diffused junction,
has the virtue of fast rise and fall
times at low drive currents.
Figure 6 illustrates the propaga-
tion delay vs. input current
characteristic. These unique
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
Functional Diagram
A 0.1 pF bypass capacitor must be connected between pins 5 and 8.
8
7
6
1
3
5
2
4
NC
ANODE
CATHODE
NC
V
CC
R
L
V
OUT
GND
Schematic
I
F
SHIELD
V
F
V
CC
GND
I
CC
+
2
3
8
5
V
O
7
6
A 0.1 F CAPACITOR MUST
BE CONNECTED BETWEEN
PINS 8 AND 5 (SEE NOTE 1).
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
R
L
1000
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2
Package Outline Drawings
Ordering Information
Specify part number followed by Option Number (if desired).
HCPL-2300# XXXX
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V
peak
Option
300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 K min)
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
characteristics enable this device
to be used in an RS-232-C inter-
face with ground loop isolation
and improved common mode
rejection. As a line receiver, the
HCPL-2300/HCPL-0300 will
operate over longer line lengths
for a given data rate because of
lower I
F
and V
F
specifications.
The output of the shielded inte-
grated detector circuit is an open
collector Schottky clamped tran-
sistor. The shield, which shunts
capacitively coupled common
mode noise to ground, provides a
guaranteed transient immunity
specification of 100 V/
s. The
output circuit includes an
optional integrated 1000
pull-
up resistor for the open collector.
This gives designers the flexibility
to use the internal resistor for
pull-up to five volt logic or to use
an external resistor for connec-
tion to supply voltages up to 18 V
(CMOS logic voltage).
The Electrical and Switching
Characteristics of the
HCPL-2300/HCPL-0300 are
guaranteed over a temperature
range of -40
C to 85C. This
enables the user to confidently
design a circuit which will
operate under a broad range of
operating conditions.
Small Outline SO-8
Package HCPL-0300
Remarks: The notation "#" is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use "-"
XXX
YWW
8
7
6
5
4
3
2
1
5.994 0.203
(0.236 0.008)
3.937 0.127
(0.155 0.005)
0.406 0.076
(0.016 0.003)
1.270
(0.050)
BSC
5.080 0.127
(0.200 0.005)
3.175 0.127
(0.125 0.005)
1.524
(0.060)
45 X
0.432
(0.017)
0.228 0.025
(0.009 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 0.254 (0.205 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 0.102
(0.008 0.004)
7
PIN ONE
0 ~ 7
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
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3
8-Pin DIP Package (HCPL-2300)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2300)
1.080 0.320
(0.043 0.013)
2.54 0.25
(0.100 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5 TYP.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 0.25
(0.300 0.010)
6.35 0.25
(0.250 0.010)
9.65 0.25
(0.380 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5
6
7
8
4
3
2
1
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 0.13
(0.140 0.005)
0.635 0.25
(0.025 0.010)
12 NOM.
9.65 0.25
(0.380 0.010)
0.635 0.130
(0.025 0.005)
7.62 0.25
(0.300 0.010)
5
6
7
8
4
3
2
1
9.65 0.25
(0.380 0.010)
6.350 0.25
(0.250 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 0.320
(0.043 0.013)
3.56 0.13
(0.140 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
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4
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Min. External Air Gap
L(IO1)
7.1
mm
Measured from input terminals to output
(External Clearance)
terminals, shortest distance through air
Min. External Tracking Path
L(IO2)
7.4
mm
Measured from input terminals to output
(External Creepage)
terminals, shortest distance path along body
Min. Internal Plastic Gap
0.08
mm
Through insulation distance, conductor to
(Internal Clearance)
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
Tracking Resistance
CTI
200
Volts
DIN IEC 112/VDE 0303 PART 1
(Comparative Tracking Index)
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 surface mount classification is Class A in accordance with CECC 00802.
Regulatory Information
The HCPL-2300 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA 88324.
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
0
TIME (SECONDS)
TEMPERATURE (

C)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160C
140C
150C
PEAK
TEMP.
245C
PEAK
TEMP.
240C
PEAK
TEMP.
230C
SOLDERING
TIME
200C
PREHEATING TIME
150C, 90 + 30 SEC.
2.5C 0.5C/SEC.
3C + 1C/0.5C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3C + 1C/0.5C/SEC.
REFLOW HEATING RATE 2.5C 0.5C/SEC.
217 C
RAMP-DOWN
6 C/SEC. MAX.
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
260 +0/-5 C
t 25 C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERA
TURE
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 C, T
smin
= 150 C
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5
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCPL-2300 Option 060 only)
Description
Symbol
Characteristic
Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
300 V rms
I-IV
for rated mains voltage
450 V rms
I-III
Climatic Classification
55/85/21
Pollution Degree (DIN VDE 0110/1.89)
2
Maximum Working Insulation Voltage
V
IORM
630
V
peak
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test with t
m
= 1 sec,
V
PR
1181
V
peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and sample test, t
m
= 60 sec,
V
PR
945
V
peak
Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
V
IOTM
6000
V
peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
T
S
175
C
Input Current
I
S,INPUT
230
mA
Output Power
P
S,OUTPUT
600
mW
Insulation Resistance at T
S
, V
IO
= 500 V
R
S
10
9
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN
60747-5-2, for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Input Voltage, Low Level
V
FL
-2.5
0.8
V
Input Current High Level
0
C to 85C
I
FH
0.5
1.0
mA
-40
C to 85C
0.5
0.75
Supply Voltage, Output
V
CC
4.75
5.25
V
Fan Out (TTL Load)
N
5
Operating Temperature
T
A
-40
85
C
Absolute Maximum Ratings
(No Derating Required up to 55
C)
Storage Temperature, T
S
............................................. -55
C to +125C
Operating Temperature, T
A
........................................... -40
C to +85C
Lead Solder Temperature, max .......................................... 260
C for 10 s
(1.6 mm below seating plane)
Average Forward Input Current - I
F
............................................ 5 mA
[2]
Reverse Input Voltage, V
R
.............................................................. 3.0 V
Supply Voltage, V
CC
............................................................... 0 V to 7.0 V
Pull-Up Resistor Voltage, V
RL
............................................. -0.5 V to V
CC
Output Collector Current, I
O
............................................ -25 to 25 mA
Input Power Dissipation, P
I
........................................................ 10 mW
Output Collector Power Dissipation, P
O
..................................... 40 mW
Output Collector Voltage, V
O
........................................... -0.5 V to 18 V
Infrared and Vapor Phase Reflow Temperature
(Option #300) .......................................... see Fig. 1, Thermal Profile