0.4 Amp Output Current
IGBT Gate Drive Optocoupler
Technical Data
HCPL-314J
Features
0.4 A Minimum Peak
Output Current
High Speed Response:
0.7
s Max. Propagation
Delay over Temp. Range
Ultra High CMR: Min.
10 kV/
s at V
CM
= 1.5 kV
Bootstrappable Supply
Current: Max. 3 mA
Wide Operating Temp.
Range: -40
C to 100
C
Wide V
CC
Operating Range:
10 V to 30 V over Temp.
Range
Available in DIP8 (Single)
and SO16 (Dual) Package
Safety Approvals: UL
Recognized, 3750 V
rms
for
1 Minute. CSA Approval.
IEC/EN/DIN EN 60747-5-2
Approval VIORM=891 V
peak
Applications
Isolated IGBT/Power
MOSFET Gate Drive
AC and Brushless DC Motor
Drives
Inverters for Appliances
Industrial Inverters
Switch Mode Power
Supplies (SMPS)
Uninterruptable Power
Supplies (UPS)
Description
The HCPL-314J family of devices
consists of an AlGaAs LED
optically coupled to an integrated
circuit with a power output stage.
These optocouplers are ideally
suited for driving power IGBTs
and MOSFETs used in motor
control inverter applications. The
high operating voltage range of
the output stage provides the
drive voltages required by gate
controlled devices. The voltage
and current supplied by this
optocoupler makes it ideally
suited for directly driving small
or medium power IGBTs. For
IGBTs with higher ratings the
HCPL-3150(0.5A) or HCPL-3120
(2.0A) optocouplers can be used.
Functional Diagram
Truth Table
LED
V
O
OFF
LOW
ON
HIGH
HCPL-314J
A 0.1
F bypass capacitor must be connected between pins V
CC
and V
EE
.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
1
3
SHIELD
2
8
16
14
15
9
N/C
CATHODE
ANODE
N/C
VCC
VEE
VO
VEE
7
6
10
11
CATHODE
ANODE
VO
VCC
SHIELD
2
Package Outline Drawing
HCPL-314J SO16 Package:
Selection Guide
Package Type
Part Number
Number of Channels
SO16
HCPL-314J
2
Ordering Information
Specify part number followed by option number (if desired)
Example:
HCPL-314J#YYYY
No option = SO16 Package.
500 = Tape and Reel Packaging Option.
XXXE = Lead Free Option
Remarks: The notation "#" is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use ""
HCPL-314J
8.76 0.20
(0.345 0.008)
7.49 0.10
(0.295 0.004)
0.016 0.0003
(0.406 0.007)
3.51 0.13
(0.138 0.005)
0.457
(0.018)
1.27
(0.050)
9
16 15 14
11 10
9
1
2
3
6
7
8
VIEW
FROM
PIN 16
VIEW
FROM
PIN 1
0.64
(0.025 MIN.)
10.36 0.20
(0.408 0.008)
0.23
(0.0091)
8.76 0.20
(0.345 0.008)
ALL LEADS TO BE COPLANAR 0.05 mm (0.002 INCHES) .
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0 - 8
V
CC1
V
O1
GND
1
V
CC2
V
O2
GND
2
NC
V
IN1
V
1
V
IN2
V
2
NC
0.10 - 0.30
(0.004 - 0.0118)
STANDOFF
TOP VIEW
11.63 (0.458)
2.16 (0.085)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
3
Regulatory Information
The HCPL-314J has been
approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 3750 V
rms
. File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
0
TIME (SECONDS)
TEMPERATURE (
C)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160C
140C
150C
PEAK
TEMP.
245C
PEAK
TEMP.
240C
PEAK
TEMP.
230C
SOLDERING
TIME
200C
PREHEATING TIME
150C, 90 + 30 SEC.
2.5C 0.5C/SEC.
3C + 1C/0.5C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3C + 1C/0.5C/SEC.
REFLOW HEATING RATE 2.5C 0.5C/SEC.
217 C
RAMP-DOWN
6 C/SEC. MAX.
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
260 +0/-5 C
t 25 C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
tp
ts
PREHEAT
60 to 180 SEC.
tL
TL
Tsmax
Tsmin
25
Tp
TIME
TEMPERA
TURE
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 C, Tsmin = 150 C
4
OUTPUT POWER
P
S
, INPUT CURRENT
I
S
0
0
TS CASE TEMPERATURE C
200
600
400
25
800
50
75 100
200
150 175
PS (mW)
125
100
300
500
700
IS (mA)
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics
Description
Symbol
Characteristic
Unit
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
150 V
rms
I - IV
for rated mains voltage
300 V
rms
I - III
for rated mains voltage
600 V
rms
I-II
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
Maximum Working Insulation Voltage
V
IORM
891
V
peak
Input to Output Test Voltage, Method b*
V
IORM
x 1.875=V
PR
, 100% Production Test with
V
PR
1670
V
peak
t
m
=1 sec, Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5=V
PR
, Type and Sample Test, t
m
=60 sec,
V
PR
1336
V
peak
Partial discharge < 5 pC
Highest Allowable Overvoltage
V
IOTM
6000
V
peak
(Transient Overvoltage t
ini
= 10 sec)
Safety-limiting values - maximum values allowed in the
event of a failure.
Case Temperature
T
S
175
C
Input Current**
I
S,INPUT
400
mA
Output Power**
P
S, OUTPUT
1200
mW
Insulation Resistance at T
S
, V
IO
= 500 V
R
S
>10
9
* Refer to the optocoupler section of the Isolation and Control Components Designer's Catalog, under Product Safety Regulations
section, IEC/EN/DIN EN 60747-5-2, for a detailed description of Method a and Method b partial discharge test profiles.
** Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
5
Insulation and Safety Related Specifications
Parameter
Symbol HCPL-314J
Units
Conditions
Minimum External Air Gap
L(101) 8.3 mm
Measured from input terminals
(Clearance)
to output terminals, shortest
distance through air.
Minimum External Tracking
L(102) 8.3
mm
Measured from input terminals
(Creepage)
to output terminals, shortest
distance path along body.
Minimum Internal Plastic Gap
0.5 mm
Through insulation distance
(Internal Clearance)
conductor to conductor, usually
the straight line distance
thickness between the emitter
and detector.
Tracking Resistance
CTI >175 V
DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group
IIIa Material Group (DIN VDE
0110, 1/89, Table 1)
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Note
Power Supply
V
CC
-V
EE
10
30
V
Input Current (ON)
I
F(ON)
8
12
mA
Input Voltage (OFF)
V
F(OFF)
-3.0
0.8
V
Operating Temperature
T
A
- 40
100
C
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Note
Storage Temperature
T
S
-55
125
C
Operating Temperature
T
A
-40
100
C
Average Input Current
I
F(AVG)
25
mA
1
Peak Transient Input Current (<1
s pulse
I
F(TRAN)
1.0
A
width, 300pps)
Reverse Input Voltage
V
R
3
V
"High" Peak Output Current
I
OH(PEAK)
0.6
A
2
"Low" Peak Output Current
I
OL(PEAK)
0.6
A
2
Supply Voltage
V
CC
-V
EE
-0.5
35
V
Output Voltage
V
O(PEAK)
-0.5
V
CC
V
Output Power Dissipation
P
O
260
mW
3
Input Power Dissipation
P
I
105
mW
4
Lead Solder Temperature
260
C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Package Outline Drawings section
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