CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
1.5 Amp Output Current IGBT
Gate Drive Optocoupler
Technical Data
HCPL-T250
Features
Input Threshold Current
(I
FLH
): 5 mA (Max.)
Supply Current
(I
CC
): 11 mA (Max.)
Supply Voltage
(V
CC
): 15-35 V
Output Current
(I
O
):
0.5 A (Min.)
Switching Time
(t
PLH
/t
PHL
): 0.5
s (Max.)
Isolation Voltage
(V
ISO
): 3750 Vrms (Min.)
UL 1577 Recognized:
File No. E55361
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with V
IORM
= 630
V
peak
8 kV/
s Minimum Common
Mode Rejection (CMR) at
Vcm = 1500 V
Creepage Distance: 7.4 mm.
Clearance: 7.1 mm.
Applications
IGBT/MOSFET Gate Drive
AC/Brushless DC Motor
Drives
Industrial Inverters
Switch Mode Power
Supplies
Description
The HCPL-T250 contains GaAs
LED. The LED is optically
coupled to an integrated circuit
with a power output stage. This
optocoupler is ideally suited for
driving power IGBTs and
MOSFETs used in motor control
inverter applications. The high
operating voltage range of the
output stage provides the drive
voltages required by gate
controlled devices. The voltage
and current supplied by this
optocoupler makes it ideally
suited for directly driving IGBTs
with ratings up to 1200 V/25 A.
For IGBTs with higher ratings,
the HCPL-T250 can be used to
drive a discrete power stage
which drives the IGBT gate.
Ordering Information
Specify Part Number followed by
Option Number.
Example:
A 0.1
F bypass capacitor must be connected between pins 5 and 8.
Truth Table
LED
V
out
ON
LOW
OFF
HIGH
Functional Diagram
1
3
SHIELD
2
4
8
6
7
5
N/C
CATHODE
ANODE
N/C
VCC
VO
VO
VEE
Q1
Q2
HCPL-T250 #XXXX
No Option = Standard DIP Package, 50 per tube.
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V
peak
Option, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option, 1000 per reel.
XXXE = Lead Free Option
Remarks: The notation "#" is used for existing products, while (new) products launched
since 15th July 2001 and lead free option will use ""
2
Package Outline Drawings
Standard DIP Package
Gull Wing Surface Mount Option 300
9.65 0.25
(0.380 0.010)
PIN ONE
1.78 (0.070) MAX.
1.19 (0.047) MAX.
1.080 0.320
(0.043 0.013)
2.54 0.25
(0.100 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
7.62 0.25
(0.300 0.010)
0.254
5 TYP.
5
6
7
8
4
3
2
1
PIN ONE
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
DATE CODE
A T250
YYWW
6.35 0.25
(0.250 0.010)
(0.010
+ 0.076
- 0.051
+ 0.003)
- 0.002)
3.56 0.13
(0.140 0.005)
0.635 0.25
(0.025 0.010)
12 NOM.
9.65 0.25
(0.380 0.010)
0.635 0.130
(0.025 0.005)
7.62 0.25
(0.300 0.010)
5
6
7
8
4
3
2
1
9.65 0.25
(0.380 0.010)
6.350 0.25
(0.250 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 0.320
(0.043 0.013)
3.56 0.13
(0.140 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
3
Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
0
TIME (SECONDS)
TEMPERATURE (
C)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160C
140C
150C
PEAK
TEMP.
245C
PEAK
TEMP.
240C
PEAK
TEMP.
230C
SOLDERING
TIME
200C
PREHEATING TIME
150C, 90 + 30 SEC.
2.5C 0.5C/SEC.
3C + 1C/0.5C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3C + 1C/0.5C/SEC.
REFLOW HEATING RATE 2.5C 0.5C/SEC.
217 C
RAMP-DOWN
6 C/SEC. MAX.
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
260 +0/-5 C
t 25 C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
tp
ts
PREHEAT
60 to 180 SEC.
tL
TL
Tsmax
Tsmin
25
Tp
TIME
TEMPERA
TURE
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 C, Tsmin = 150 C
4
Regulatory Information
The HCPL-T250 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
Insulation and Safety Related
Parameter
Symbol
Value
Units
Conditions
Minimum External Air Gap
L(101)
7.1
mm
Measured from input terminals to
(Clearance)
output terminals, shortest distance through
air.
Minimum External Tracking
L(102)
7.4
mm
Measured from input terminals to
(Creepage)
output terminals, shortest distance path
along body.
Minimum Internal Plastic Gap
0.08
mm
Insulation thickness between emitter
(Internal Clearance)
and detector; also known as distance
through insulation
Tracking Resistance
CTI
175 Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
(Compared with HCPL-3120)
HCPL-3120
HCPL-T250
Parameter
Symbol
Units
Min.
Max.
Min.
Max.
Note
Operating Temperature
T
A
C
-40
100
-20
85
"High" Peak Output Current
I
OH(PEAK)
A
2.5
1.5
1
"High" Peak Output Current
I
OL(PEAK)
A
2.5
1.5
Storage Temperature
T
S
C
-55
125
-55
125
Average Input Current
I
F(AVG)
mA
25
20
2
Peak Transient Input Current
I
F(TRAN)
A
1.0
1.0
(<1
s Pulse Width, 300 pps)
Reverse Input Voltage
V
R
V
5
5
Supply Voltage
(V
CC
- V
EE
)
V
0
35
0
35
Output Voltage
V
O
V
0
V
CC
0
V
CC
Output Power Dissipation
P
O
mW
250
250
3
Lead Solder Temperature
260
C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Package Outline Drawings section
Notes:
1. Maximum pulse width = 10
s, maximum duty cycle = 0.2%. See HCPL-3120 Applications section for additional details on limiting
I
OH(PEAK)
.
2. Derate linearly above 70
C free-air temperature at a rate of 0.3 mA/C.
3. Derate lineraly above 70
C free-air temperature at a rate of 4.8 mW/C.
5
DC Electrical Specifications
(Compared with HCPL-3120)
Over recommended operating conditions (I
F(ON)
= 7 to 16 mA, V
F(OFF)
= -3.0 to 0.8 V, V
CC
= 15 to 30 V,
V
EE
= Ground) unless otherwise specified.
HCPL-3120
HCPL-T250
Test
Parameter
Symbol
Units
Min.
Typ.*
Max.
Min.
Typ.*
Max.
Conditions
Note
Input Forward
V
F
V
1.2
1.5
1.8
1.6
1.8
I
F
= 10 mA
Voltage
Temperature
V
F
/
T
A
mV/
C
-1.6
-2.0
I
F
= 10 mA
Coefficient of
Forward Voltage
Input Reverse
I
R
A
10
10
V
R
= 5 V
Current
Input Capacitance
C
IN
pF
60
60
250
V
F
= 0 V,
F = 1 MHz
High Level
I
OH
A
0.5
1.5
0.5
1.5
V
O
= V
CC
- 4 V
Output Current
2.0
N.A.
V
O
= V
CC
- 15 V
Low Level
I
OL
A
0.5
2.0
0.5
2.0
V
O
= V
CC
- 4 V
Output Current
2.0
N.A.
V
O
= V
CC
- 15 V
High Level
V
OH
V
V
CC
- 4
V
CC
- 3
V
CC
- 4
V
CC
- 3
I
O
= -100 mA
Output Voltage
Low Level
V
OL
V
V
EE
+0.1 V
EE
+0.5
V
EE
+0.8 V
EE
+2.5 I
O
= 100 mA
Output Voltage
High Level
I
CCH
mA
2.0
5
7
11
Output Open
Supply Current
ntSupply Current
I
F
= 7 to 16 mA
Low Level
I
CCL
mA
2.0
5
7.5
11
Output Open
Supply Current
V
F
= -3.0 to
+0.8 V
Threshold Input
I
FLH
mA
2.3
5
1.2
5
I
O
= 0 mA,
Current Low to
V
O
> 5 V
High
Threshold Input
V
FHL
V
0.8
0.8
Voltage High
to Low
Supply Voltage
V
CC
V
15
30
15
30
Capacitance
C
I-0
pF
0.6
1.0
(Input-Output)
Resistance
R
I-0
10
12
10
12
(Input-Output)
*All typical values at T
A
= 25
C and V
CC
- V
EE
= 3
V, unless otherwise noted.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
V
CC
- V
EE
15
30
V
Input Current (ON)
I
F(ON)
7
16
mA
Input Voltage (OFF)
V
F(OFF)
-3.0
0.8
V
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