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Электронный компонент: HDSP-815G

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20 mm (0.8 inch) General Purpose
Seven Segment Displays
Technical Data
HDSP-815E
HDSP-816E
HDSP-815G
HDSP-816G
Features
Industry Standard Size
Industry Standard Pin-Out
15.24 mm (0.6 in.) DIP Leads
on 2.54 mm (0.1 in.) Centers
Choice of Colors
Red, Green
Mitered Font
Mitered Corners on Segments
Gray Face Paint
Gray Package Gives Optimum
Contrast
50
Viewing Angle
Design Flexibility
Common Anode or Common
Cathode
Categorized for Luminous
Intensity
Applications
Suitable for Indoor Use
Not Recommended for
Industrial Applications, i.e.
Operating Temperatures
Requirements Exceeding
85
C or Below -25
C
[1]
Extreme Temperature
Cycling Not
Recommended
[2]
Description
These 20 mm (0.8 inch) displays
use industry standard size and
pin-out. The devices are available
as either common anode or
common cathode. Available in
either red or green colors, these
gray-faced displays are suitable
for indoor use.
Devices
HER HDSP-
Green HDSP-
Description
815E
815G
Common Anode Right Hand Decimal
816E
816G
Common Cathode Right Hand Decimal
Notes:
1. For industrial applications, it is recommended to use HDSP-3901/3903/8601/8603.
2. For details, please contact your local Agilent Technologies sales office or an authorized distributor.
No color binning is offered for
these parts.
These parts are subjected to
Outgoing Quality Assurance
(OQA) inspection with AQL of
0.065% for functional and visual/
cosmetic rejects.
2
Part Numbering System
Notes:
1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest
Agilent representative for details.
2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1
bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.
5082 -X X X X-X X X X X
HDSP-X X X X-X X X X X
Mechanical Options
[1]
00: No Mechanical Option
Color Bin Options
[1,2]
0: No Color Bin Limitation
Maximum Intensity Bin
[1,2]
0: No Maximum Intensity Bin Limitation
Minimum Intensity Bin
[1,2]
0: No Minimum Intensity Bin Limitation
Device Configuration/Color
[1]
E: High Efficiency Red
G: Green
Device Specific Configuration
[1]
Refer to Respective Datasheet
Package
[1]
Refer to Respective Datasheet
3
Package Dimensions
NOTES:
1. DIMENSIONS IN MILLIMETERS AND (INCHES).
2. TOLERANCE IS 0.25 mm (0.010 INCH) UNLESS OTHERWISE STATED.
27.69 0.25
(1.090 0.010)
20.32
(0.800)
11.07
(0.436)
8
1
6
9
1.70
(0.067)
13.08
(0.514)
1.25
(0.049)
8.20
(0.323)
C
L
C
L
CHARACTER
PACKAGE
UNUSED DP
16
RHDP
DATE CODE
COUNTRY OF ORIGIN
0.50
(0.020)
HDSP-XXXX
XYY Z
XXXX
8.38
(0.330)
2.54 x 7 = 17.78
(0.100 x 7 = 0.700)
DIA.
SIDE VIEW
19.96
(0.786)
15.24
(0.600)
4.8 0.50
(0.189 0.020)
4.60
(0.181)
FRONT VIEW
END VIEW
LUMINOUS INTENSITY CATEGORY
4
Internal Circuit Diagram
COMMON ANODE
COMMON CATHODE
PIN
FUNCTION
PIN
1
CATHODE A
2
CATHODE F
3
COMMON ANODE
4
CATHODE E
5
COMMON ANODE
6
NO CONNECTION
7
NO PIN
8
NO PIN
9
CATHODE RHDP
10
CATHODE D
11
COMMON ANODE
12
CATHODE C
1
2
3
4
5
6
7
8
9
10
11
12
FUNCTION
13
CATHODE G
13
14
CATHODE B
14
15
NO PIN
15
16
COMMON ANODE
16
ANODE A
ANODE F
COMMON CATHODE
ANODE E
COMMON CATHODE
NO CONNECTION
NO PIN
NO PIN
ANODE RHDP
ANODE D
COMMON CATHODE
ANODE C
ANODE G
ANODE B
NO PIN
COMMON CATHODE
f
COMMON ANODE
e
g
d
a
b
c
DP
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
f
COMMON CATHODE
e
g
d
a
b
c
DP
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
5
Absolute Maximum Ratings at T
A
=25
C
High Efficiency Red
Green
HDSP-815E
HDSP-815G
Parameter
HDSP-816E
HDSP-816G
Units
Average Power per Segment or DP
62.5
65
MW
Peak Forward Current per Segment or DP
100
90
mA
(1/10 Duty Cycle, 0.1 ms Pulse Width)
DC Forward Current per Segment or DP
[1]
25
25
mA
Reverse Voltage per Segment or DP
3
3
V
Operating Temperature
-25 to +85
-25 to +85
C
Storage Temperature
-25 to +85
-25 to +85
C
Wave Soldering Temperature for 3 Seconds
[2]
250
250
C
(1.6 mm [0.063 in.] below Body)
Notes:
1. Derate above 25
C at 0.33 mA/
C.
2. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time not
to exceed 5 seconds.
Optical/Electrical Characteristics at T
A
=25
C
High Efficiency Red
Devices
Test
HDSP-
Parameter
Symbol
Min.
Typ.
Max. Units Conditions
Luminous Intensity/Segment
I
v
2.3
4.8
mcd
I
F
= 20 mA
(Segment Average)
[1,2]
Forward Voltage/Segment or DP
V
F
2.1
3.0
V
I
F
= 20 mA
815E
Peak Wavelength
PEAK
635
nm
816E
Dominant Wavelength
[3]
d
626
nm
Reverse Voltage/Segment or DP
[4]
V
R
3.0
25
V
I
R
= 100
A
Temperature Coefficient of
V
F
/
C
-2
mV/
C
V
F
/Segment or DP
Green
Devices
Test
HDSP-
Parameter
Symbol
Min.
Typ.
Max. Units Conditions
Luminous Intensity/Segment
I
v
1.5
3.3
mcd
I
F
= 20 mA
(Segment Average)
[1,2]
Forward Voltage/Segment or DP
V
F
2.1
2.6
V
I
F
= 20 mA
815G
Peak Wavelength
PEAK
566
nm
816G
Dominant Wavelength
[3]
d
571
nm
Reverse Voltage/Segment or DP
[4]
V
R
3.0
50
V
I
R
= 100
A
Temperature Coefficient of
V
F
/
C
-2
mV/
C
V
F
/Segment or DP
Notes:
1. Case temperature of the device immediately prior to the intensity measurement is 25
C.
2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.
3. The dominant wavelength,
d
, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
4. Typical specification for reference only. Do not exceed absolute maximum ratings.