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Электронный компонент: HDSP-B582

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Agilent HDSP-B58x Series
53.3 mm (2.1 inch) General Purpose
5 x 8 Dot Matrix Bi-Color
Alphanumeric Displays
Data Sheet
Description
These displays have a 53.3 mm
(2.1 inch) character height. The
devices are available in either
common row anode or common row
cathode configurations. The
displays come in only black face
paint. This bi-color display consists
of GaP Red (HER) and GaP Green
colors.
Features
5 x 8 Dot matrix font
X-Y stackable
Pin-out
45.72 mm (1.8 in.) Dual-In-Line
(DIP) leads on 2.54 mm (0.1 in.)
centers
Color
Bi-color: GaP Red and GaP Green
Face paint color: black
Design flexibility
Common row anode or common
row cathode
Categorized for luminance
Applications
Suitable for indoor use
Not recommended for industrial
applications, i.e., operating
temperature requirements
exceeding 85
C or below 35
C
Extreme temperature cycling not
recommended
[1]
These parts are subjected to Out-
going Quality Assurance (OQA)
inspection with an AQL of
0.065% for functional and visual/
cosmetic defects.
Devices
HDSP-
Description
B581
53.3 mm Black Surface Common Row Anode
B582
53.3 mm Black Surface Common Row Cathode
Note:
1. For details, please contact your local Agilent components sales office or an authorized distributor.
2
Package Dimensions
30.48 (1.201)
38.00 (1.496)
PIN 1
5.0 (0.197)
x 40
7.62 (0.300)
2.54 x 8 =
20.32 (0.800)
3.5 (0.138) 0.5
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. UNLESS OTHERWISE STATED, TOLERANCES ARE 0.25 mm.
0.51
(0.020)
ROW
COL
1
2
3
4
5
6
7
1
2
3
4
5
PART NO.
53.34
(2.100)
60.60
(2.386)
7.62
(0.300)
0.40
(0.016)
0.50
(0.019)
8
8.8 (0.346)
46.1(1.81)
3
Internal Circuit Diagram
HDSP-B581
7
16
10
11
4
5
12
4
15
17
14
8
5
9
1
2
3
4
5
6
8
PIN
COLUMN
ROW
13
3
2
2
3
THE SIGN
REPRESENTS HER CHIPS
THE SIGN
REPRESENTS GREEN CHIPS
18
1
1
6
7
PIN NO.
CONNECTION
1
COLUMN 1 GREEN
2
COLUMN 2 GREEN
3
COLUMN 2 RED
4
COLUMN 3 RED
5
ROW 6
6
ROW 7
7
COLUMN 4 RED
8
ROW 5
9
ROW 8
10
COLUMN 5 GREEN
11
COLUMN 5 RED
12
COLUMN 4 GREEN
13
COLUMN 3 GREEN
14
ROW 4
15
ROW 2
16
ROW 1
17
ROW 3
18
COLUMN 1 RED
4
Internal Circuit Diagram
HDSP-B582
7
16
10
11
4
5
12
4
15
17
14
8
5
9
1
2
3
4
5
6
8
PIN
COLUMN
ROW
13
3
2
2
3
THE SIGN
REPRESENTS HER CHIPS
THE SIGN
REPRESENTS GREEN CHIPS
18
1
1
6
7
PIN NO.
FUNCTION
1
COLUMN 1 GREEN ANODE
2
COLUMN 2 GREEN ANODE
3
COLUMN 2 RED ANODE
4
COLUMN 4 RED ANODE
5
ROW 6 CATHODE
6
ROW 7 CATHODE
7
COLUMN 4 RED ANODE
8
ROW 5 CATHODE
9
ROW 8 CATHODE
10
COLUMN 5 GREEN ANODE
11
COLUMN 5 RED ANODE
12
COLUMN 4 GREEN ANODE
13
COLUMN 3 GREEN ANODE
14
ROW 4 CATHODE
15
ROW 2 CATHODE
16
ROW 1 CATHODE
17
ROW 3 CATHODE
18
COLUMN 1 RED ANODE
5
Absolute Maximum Ratings at T
A
= 25C
GaP Red
GaP Green
Parameter
HDSP-B581/B582
HDSP-B581/B582
Units
Average Power per Dot
[1]
65
65
mW
Peak Forward Current per Dot
[1]
(1/8 Duty Cycle at 10 kHz)
80
100
mA
Average Forward Current per Dot
25
[1,2]
25
[1,3]
mA
Reverse Voltage per Dot
3
3
V
Operating Temperature
35 to +85
35 to +85
C
Storage Temperature
35 to +85
35 to +85
C
Wave Soldering Temperature for 3 seconds
[4]
(2 mm [0.078 in.] below Body)
250
250
C
Notes:
1. Do not exceed maximum average current per dot.
2. Derate above 25
C at 0.20 mA/
C.
3. Derate above 25
C at 0.33 mA/
C.
4. Not recommended to be soldered more than two times. Minimum interval between solderings is 15 minutes.
Total soldering time not to exceed 3 seconds.