Versatile Link
The Versatile Fiber Optic
Connection
Technical Data
HFBR-0501 Series
Features
Low Cost Fiber Optic
Components
Enhanced Digital Links
dc-5 MBd
Extended Distance Links up
to 120 m at 40 kBd
Low Current Link: 6 mA
Peak Supply Current
Horizontal and Vertical
Mounting
Interlocking Feature
High Noise Immunity
Easy Connectoring
Simplex, Duplex, and
Latching Connectors
Flame Retardant
Transmitters Incorporate a
660 nm Red LED for Easy
Visibility
Compatible with Standard
TTL Circuitry
Applications
Reduction of Lightning/Volt-
age Transient Susceptibility
Motor Controller Triggering
Data Communications and
Local Area Networks
Electromagnetic
Compatibility (EMC) for
Regulated Systems: FCC,
VDE, CSA, etc.
Tempest-Secure Data
Processing Equipment
Isolation in Test and
Measurement Instruments
Error Free Signalling for
Industrial and Manufactur-
ing Equipment
Automotive Communications
and Control Networks
Noise Immune Communica-
tion in Audio and Video
Equipment
Description
The Versatile Link series is a
complete family of fiber optic link
components for applications
requiring a low cost solution. The
HFBR-0501 series includes trans-
mitters, receivers, connectors and
cable specified for easy design.
This series of components is ideal
for solving problems with voltage
isolation/insulation, EMI/RFI
immunity or data security. The
optical link design is simplified
by the logic compatible receivers
and complete specifications for
each component. The key optical
and electrical parameters of links
configured with the HFBR-0501
family are fully guaranteed from
0
to 70
C.
A wide variety of package config-
urations and connectors provide
the designer with numerous
mechanical solutions to meet
application requirements. The
transmitter and receiver compo-
nents have been designed for use
in high volume/low cost assembly
processes such as auto insertion
and wave soldering.
Transmitters incorporate a 660
nm LED. Receivers include a
monolithic dc coupled, digital IC
receiver with open collector
Schottky output transistor. An
internal pullup resistor is avail-
able for use in the HFBR-25X1/2/
4 receivers. A shield has been
integrated into the receiver IC to
provide additional, localized noise
immunity.
Internal optics have been optim-
ized for use with 1 mm diameter
plastic optical fiber. Versatile
Link specifications incorporate
all connector interface losses.
Therefore, optical calculations for
common link applications are
simplified.
2
HFBR-0501 Series Part Number Guide
HFBR X5XX
1 = Transmitter
2 = Receiver
5 = 600 nm Transmitter and
Receiver Products
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
3 = 40 kBd Low Current/Extended Distance Link
2 = Horizontal Package
4 = 1 MBd Standard Link
3 = Vertical Package
6 = 155 MBd Receiver
7 = 155 MBd Transmitter
8 = 10 MBd High Performance Link
Link Selection Guide
(Links specified from 0 to 70
C, for plastic optical fiber unless specified.)
Signal Rate
Distance (m) 25
C
Distance (m)
Transmitter
Receiver
40 kBd
120
110
HFBR-1523
HFBR-2523
1 MBd
20
10
HFBR-1524
HFBR-2524
1 MBd
55
45
HFBR-1522
HFBR-2522
5 Mbd
30
20
HFBR-1521
HFBR-2521
Evaluation Kit
HFBR-0501 1 MBd Versatile Link:
This kit contains: HFBR-1524 Tx, HFBR-2524 Rx, polishing kit, 3 styles of plastic connectors, Bulkhead
feedthrough, 5 meters of 1 mm diameter plastic cable, lapping film and grit paper, and HFBR-0501 data
sheet.
Application Literature
Application Note 1035 (Versatile Link)
VALOX
is a registered trademark of the General Electric Corporation.
Package and Handling
Information
The compact Versatile Link pack-
age is made of a flame retardant
VALOX
UL 94 V-0 material
(UL file # E121562) and uses the
same pad layout as a standard,
eight pin dual-in-line package.
Vertical and horizontal mountable
parts are available. These low
profile Versatile Link packages
are stackable and are enclosed to
provide a dust resistant seal.
Snap action simplex, simplex
latching, duplex, and duplex
latching connectors are offered
with simplex or duplex cables.
Package Orientation
Performance and pinouts for the
vertical and horizontal packages
are identical. To provide addi-
tional attachment support for the
vertical Versatile Link housing,
the designer has the option of
using a self-tapping screw
through a printed circuit board
into a mounting hole at the
bottom of the package. For most
applications this is not necessary.
Package Housing Color
Versatile Link components and
simplex connectors are color
coded to eliminate confusion
3
when making connections.
Receivers are blue and transmit-
ters are gray, except for the
HFBR-15X3 transmitter, which is
black.
Handling
Versatile Link components are
auto-insertable. When wave
soldering is performed with
Versatile Link components, the
optical port plug should be left in
to prevent contamination of the
port. Do not use reflow solder
processes (i.e., infrared reflow or
vapor-phase reflow).
Nonhalogenated water soluble
fluxes (i.e., 0% chloride), not
rosin based fluxes, are recom-
mended for use with Versatile
Link components.
Versatile Link components are
moisture sensitive devices and
are shipped in a moisture sealed
bag. If the components are
exposed to air for an extended
period of time, they may require
a baking step before the solder-
ing process. Refer to the special
labeling on the shipping tube for
details.
Recommended Chemicals for
Cleaning/Degreasing
Alcohols:
methyl, isopropyl,
isobutyl. Aliphatics: hexane,
heptane, Other: soap solution,
naphtha.
Do not use
partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or N-
methylpyrolldone. Also, Agilent
does not recommend the use of
cleaners that use halogenated
hydrocarbons because of their
potential environmental harm.
6.8
(0.270)
10.2
(0.400)
4.2
(0.165)
1.27
(0.050)
2.5
(0.100)
0.51
(0.020)
18.8
(0.740)
2.0
(0.080)
7.71
(0.305)
0.64
(0.025)
7.62
(0.300)
2.8
(0.109)
1.85
(0.073)
0.64 (0.025) DIA.
5.1
(0.200)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
Mechanical Dimensions
Horizontal Modules
Vertical Modules
18.8
0.740
7.6
(0.30)
7.6
(0.30)
Level
4
CAUTION
This bag contains
MOISTURE-SENSITIVE
DEVICES
1. Shelf life in sealed bag: 12 months at < 40
C and < 90% Relative
Humidity (RH).
2. After this bag is opened, devices that will be subjected to wave
soldering, or equivalent processing (solder temperature < 260
C for
10 sec) must be:
a) Mounted within 72 hours at factory conditions of
30
C/60% RH.
b) Stored at
20% RH.
3. Devices require baking, before mounting, if:
a) Desiccant changes to PINK.
b) If 2a or 2b are not met.
4. If baking is required, devices may be baked outside of tube for 20
hours at 75
C.
Bag Seal Date: ______________________________________________________
(If blank, see barcode label)
Note: LEVEL defined by EIA JEDEC Standard J-STD-020
4
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Vertical Module
Interlocked (Stacked)
Assemblies (refer to
Figure 1)
Horizontal packages may be
stacked by placing units with pins
facing upward. Initially engage
the interlocking mechanism by
sliding the L bracket body from
above into the L slot body of the
lower package. Use a straight
edge, such as a ruler, to bring all
stacked units into uniform
alignment. This technique
prevents potential harm that
could occur to fingers and hands
of assemblers from the package
pins. Stacked horizontal packages
can be disengaged if necessary.
Repeated stacking and unstack-
ing causes no damage to
individual units.
To stack vertical packages, hold
one unit in each hand, with the
pins facing away and the optical
ports on the bottom. Slide the L
bracket unit into the L slot unit.
The straight edge used for
horizontal package alignment is
not needed.
Stacking Horizontal Modules
Figure 1. Interlocked (Stacked) Horizontal or Vertical Packages.
4
1
3
2
5
6
7.62
(0.300)
1.01 (0.040) DIA.
1.85
(0.073)
MIN.
TOP VIEW
2.54
(0.100)
7.62
(0.300)
DIMENSIONS IN MILLIMETERS (INCHES).
PCB EDGE
Stacking Vertical Modules
5
5 MBd Link (HFBR-15X1/25X1)
System Performance 0 to 70
C unless otherwise specified.
Parameter
Symbol Min. Typ. Max. Units
Conditions
Ref.
High
Data Rate
dc
5
MBd
BER
10
-9
, PRBS:2
7
-1
Link Distance
19
m
I
Fdc
= 60 mA
Fig. 3
(Standard Cable)
27
48
m
I
Fdc
= 60 mA, 25
C
Note 3
Link Distance
22
m
I
Fdc
= 60 mA
Fig. 4
(Improved Cable)
27
53
m
I
Fdc
= 60 mA, 25
C
Note 3
Propagation
t
PLH
80
140
ns
R
L
= 560
, C
L
= 30 pF
Fig. 5, 8
Delay
t
PHL
50
140
ns
fiber length = 0.5 m
Notes 1, 2
-21.6
P
R
-9.5 dBm
Pulse Width
t
D
30
ns
P
R
= -15 dBm
Fig. 5, 7
Distortion t
PLH
-t
PHL
R
L
= 560
, C
L
= 30 pF
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at P
R
= -15 dBm.
3. Estimated typical link life expectancy at 40
C exceeds 10 years at 60 mA.
Figure 2. Typical 5 MBd Interface Circuit.
Figure 4. Guaranteed System Performance with Improved
Cable (HFBR-15X1/25X1).
Figure 3. Guaranteed System Performance with Standard
Cable (HFBR-15X1/25X1).
Performance
5 MBd
100
50
40
30
20
10
5
0
10
20
30
40
50
I FORWARD CURRENT (mA)
F
CABLE LENGTH METRES
60
25C
0C70C
OVERDRIVE
UNDERDRIVE
100
50
40
30
20
10
5
0
10
20
30
40
50
I FORWARD CURRENT (mA)
F
CABLE LENGTH METRES
OVERDRIVE
UNDERDRIVE
25C
0C70C
PDF 
ZIP