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This document contains information on a product under development. American Microsystems, Inc. reserves the right to change or discontinue this product without notice.
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1.0 Features
On-board
crystal
oscillator
Phase-locked loop (PLL) synthesizes desired CLK
frequency
Internal loop filter
Internal crystal oscillator load capacitance (16pF
nominal)
Only external components required are decoupling
capacitors
Minimal board footprint (8-pin 0.150" SOIC package)
2.0 Description
The FS6118 is a monolithic CMOS frequency synthesizer
IC designed for cost sensitive or space limited applica-
tions.
An on-board crystal oscillator accepts a quartz crystal
and provides a different, synthesized frequency on the
CLK output. The device is packaged in an 8-pin SOIC
package for a minimal board footprint.
Custom factory-programmed clock frequencies are avail-
able. Please contact your local AMI sales representative
for more information.
Figure 1: Block Diagram
XIN
FS6118
CLK
Crystal
Oscillator
Phase-
Locked Loop
XOUT
Figure 2: Pin Configuration
1
8
2
3
4
7
6
5
VSS
XOUT
XIN
VDD
CLK
VSS
n/c
VDD
8-pin 0.150" SOIC
F
S
61
18
Table 1: Pin Descriptions
Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DI
U
= Input with Internal Pull-Up;
DI
D
= Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input,
DO = Digital Output; P = Power/Ground; # = Active Low pin
PIN
TYPE
NAME
DESCRIPTION
1
P
VSS
Ground
2
AO
XOUT
Crystal oscillator feedback
3
AI
XIN
Crystal oscillator drive
4
P
VDD
Power supply (+5V)
5
--
N/C
No Connection
6
P
VSS
Ground
7
DO
CLK
Clock Output
8
P
VDD
Power Supply (+5V)
Table 2: Font Description
DEVICE
CRYSTAL FREQUENCY
(MHz)
CLK FREQUENCY
(MHz)
FS6118-01
14.31818
40.0000
Custom frequencies available contact AMI for more information
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3.0 Electrical Specifications
Table 3: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage (V
SS
= ground)
V
DD
V
SS
-0.5
7
V
Input Voltage, dc
V
I
V
SS
-0.5
V
DD
+0.5
V
Output Voltage, dc
V
O
V
SS
-0.5
V
DD
+0.5
V
Input Clamp Current, dc (V
I
< 0 or V
I
> V
DD
)
I
IK
-50
50
mA
Output Clamp Current, dc (V
I
< 0 or V
I
> V
DD
)
I
OK
-50
50
mA
Storage Temperature Range (non-condensing)
T
S
-65
150
C
Ambient Temperature Range, Under Bias
T
A
-55
125
C
Junction Temperature
T
J
125
C
Lead Temperature (soldering, 10s)
260
C
Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
2
kV
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy elec-
trostatic discharge.
Table 4: Operating Conditions
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
Supply Voltage
V
DD
5V 10%
4.5
5.0
5.5
V
Ambient Operating Temperature Range
T
A
0
70
C
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4.0 Package
Information
Table 5: 8-pin SOIC (0.150") Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
A
0.061
0.068
1.55
1.73
A1
0.004
0.0098
0.102
0.249
A2
0.055
0.061
1.40
1.55
B
0.013
0.019
0.33
0.49
C
0.0075
0.0098
0.191
0.249
D
0.189
0.196
4.80
4.98
E
0.150
0.157
3.81
3.99
e
0.050 BSC
1.27 BSC
H
0.230
0.244
5.84
6.20
h
0.010
0.016
0.25
0.41
L
0.016
0.035
0.41
0.89
0
8
0
8
B
D
A
1
SEATING
PLANE
H
E
8
1
ALL RADII:
0.005" TO 0.01"
BASE
PLANE
A
2
e
""#)#$#
A
R
C
L
7 typ.
h x 45
Table 6: 8-pin SOIC (0.150") Package Characteristics
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
TYP.
UNITS
Thermal Impedance, Junction to Free-Air
JA
Air flow = 0 m/s
173
C/W
Corner lead
2.0
Lead Inductance, Self
L
11
Center lead
1.6
nH
Lead Inductance, Mutual
L
12
Any lead to any adjacent lead
0.4
nH
Lead Capacitance, Bulk
C
11
Any lead to V
SS
0.27
pF
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5.0 Ordering Information
ORDERING CODE
DEVICE NUMBER
PACKAGE TYPE
OPERATING
TEMPERATURE RANGE
SHIPPING
CONFIGURATION
11640-802
FS6118-01
8-pin (0.150") SOIC
(Small Outline Package)
0
C to 70
C (Commercial)
Tape-and-Reel
11640-812
FS6118-01
8-pin (0.150") SOIC
(Small Outline Package)
0
C to 70
C (Commercial)
Tubes
Copyright 1998 American Microsystems, Inc.
Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale
only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or
regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or
fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any
time and without notice. AMI's products are intended for use in commercial applications. Applications requiring ex-
tended temperature range, unusual environmental requirements, or high reliability applications, such as military, medi-
cal life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for
such applications.
American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796,
WWW Address:
http://www.amis.com
E-mail:
tgp@amis.com
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