A62S6308 Series
64K X 8 BIT LOW VOLTAGE CMOS SRAM
(October, 1998, Version 2.0)
AMIC Technology, Inc.
Document Title
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No. History
Issue Date
Remark
1.0
Initial issue
September 01, 1997
Preliminary
1.1
Modify TSOP (TSSOP) pin configuration.
January 16, 1998
Modify SOP 32L, TSOP 32L and TSSOP 32L type
packages outline dimensions.
1.2
Change TSSOP 32L type package to sTSOP 32L.
June 16, 1998
Modify sTSOP 32L type package L
E
symbol dimensions.
1.3
Modify 32-pin TSOP package L symbol dimensions.
June 22, 1998
2.0
Finalize
October 9, 1998
Final
Add 36-ball Mini BGA (6X8) package
A62S6308 Series
64K X 8 BIT LOW VOLTAGE CMOS SRAM
(October, 1998, Version 2.0)
1
AMIC Technology, Inc.
NC
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
I/O
1
I/O
2
I/O
3
GND
I/O
4
I/O
5
I/O
6
I/O
7
A10
A9
A8
A13
CE2
A15
VCC
A11
A62S6308M
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
OE
CE1
WE
A10
7
6
5
4
3
GND
OE
CE1
2
1
0
NC
A62S6308V
(A62S6308X)
1
9
32
24
A11
A9
2
3
4
5
6
7
8
10
11
12
13
14
15
16
A8
A13
VCC
NC
A14
A12
A7
A6
A5
A4
31
30
29
28
27
26
25
23
22
21
20
19
18
17
I/O
I/O
I/O
I/O
I/O
A0
A1
A2
A3
A15
WE
CE2
I/O
I/O
I/O
~~
~~
NC
1
2
3
4
5
6
A
A0
A1
CE2
A3
A6
A8
B
I/O
4
A2
WE
A4
A7
I/O
0
C
I/O
5
NC
A5
I/O
1
D VSS
VCC
E VCC
VSS
F
I/O
6
NC
NC
I/O
2
G
I/O
7
OE
CE1
NC
A15 I/O
3
H
A9
A10 A11 A12 A13 A14
Features
n
Power supply range: 2.7V to 3.6V
n
Access times:70/100 ns (max.)
n
Current:
A62S6308-S series:
Operating: 40mA (max.)
Standby: 15
A (max.)
A62S6308-SI series:
*Operating: 40mA (max.)
*Standby: 30
A (max.)
n
Extended operating temperature range:-25
C to 85
C
n
Full static operation, no clock or refreshing required
n
All inputs and outputs are directly TTL-compatible
n
Common I/O using three-state output
n
Output enable and two chip enable inputs for easy
application
n
Data retention voltage: 2V (min.)
n
Available in 32-pin SOP, TSOP, sTSOP (8 X
13.4mm) forward type and 36-ball Mini BGA (6X8)
packages
General Description
The A62S6308 is a low operating current 524,288-bit
static random access memory organized as 65,536
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for POWER-DOWN
and a device enable and an output enable input are
included for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
n
n
SOP
n
n
TSOP/(sTSOP)
n
n
Mini BGA (6X8) Top View
(forward type)
A62S6308 Series
(October, 1998, Version 2.0)
2
AMIC Technology, Inc.
Block Diagram
ROW
DECODER
512 X 1024
MEMORY ARRAY
INPUT DATA
CIRCUIT
COLUMN I/O
CONTROL
CIRCUIT
CE2
CE1
WE
I/O
8
I/O
1
A15
A14
A13
A0
VCC
GND
OE
Pin Descriptions - SOP
Pin No.
Symbol
Description
1,2
NC
No Connection
3 - 12, 23,
25 - 28, 31
A0 - A15
Address Inputs
13 - 15,
17 - 21
I/O
1
- I/O
8
Data Inputs/Outputs
16
GND
Ground
22
CE1
Chip Enable
24
OE
Output Enable
29
WE
Write Enable
30
CE2
Chip Enable
32
VCC
Power Supply
Pin Description - TSOP/sTSOP
Pin No.
Symbol
Description
1 - 4, 7,
11 - 20, 31
A0 - A15
Address Inputs
5
WE
Write Enable
6
CE2
Chip Enable
8
VCC
Power Supply
9, 10
NC
No Connection
21 - 23,
25 - 29
I/O
1
- I/O
8
Data Inputs/Outputs
24
GND
Ground
30
CE1
Chip Enable
32
OE
Output Enable
A62S6308 Series
(October, 1998, Version 2.0)
3
AMIC Technology, Inc.
Recommended DC Operating Conditions
(T
A
= 0
C to + 70
C, -25
C to 85
C)
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Supply Voltage
2.7
3.0
3.6
V
GND
Ground
0
0
0
V
V
IH
Input High Voltage
2.0
-
VCC + 0.3
V
V
IL
Input Low Voltage
-0.3
-
+0.6
V
C
L
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
Absolute Maximum Ratings*
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25
C to + 85
C
Storage Temperature, Tstg . .. . . . . . . . -55
C to + 125
C
Power Dissipation, P
T
. . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260
C, 10 sec
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
(T
A
= 0
C to + 70
C or -25
C to 85
C, VCC = 2.7V to 3.6V, GND = 0V)
Symbol
Parameter
A62S6308-70S/10S
A62S6308-70SI/10SI
Unit
Conditions
Min.
Max.
Min.
Max.
I
LI
Input Leakage
Current
-
1
-
1
A
V
IN
= GND to VCC
I
LO
Output Leakage
Current
-
1
-
1
A
CE1 = V
IH
or CE2 = V
IL
or
OE = V
IH
or WE = V
IL
V
I/O
= GND to VCC
I
CC
Active Power
Supply Current
-
3
-
3
mA
CE1 = V
IL
, CE2 = V
IH
I
I/O
= 0mA
I
CC1
Dynamic Operating
-
40
-
40
mA
Min. Cycle, Duty = 100%
CE1 = V
IL
, CE2 = V
IH
I
I/O
= 0mA
I
CC2
Current
-
5
-
5
mA
CE1 = V
IL
, CE2 = V
IH
V
IH
= VCC, V
IL
= 0V
f = 1MH
Z
, I
I/O
= 0mA
A62S6308 Series
(October, 1998, Version 2.0)
4
AMIC Technology, Inc.
DC Electrical Characteristics
(continued)
Symbol
Parameter
A62S6308-70S/10S
A62S6308-70SI/10SI
Unit
Conditions
Min.
Max.
Min.
Max.
I
SB
-
0.5
-
0.5
mA
CE1 = V
IH
or
CE2 = V
IL
I
SB1
Standby Power
Supply Current
-
15
-
30
A
CE1
VCC - 0.2V
CE2
VCC - 0.2V
V
IN
0V
I
SB2
-
15
-
30
A
CE2
0.2V
V
IN
0V
V
OL
Output Low Voltage
-
0.4
-
0.4
V
I
OL
= 2.1mA
V
OH
Output High Voltage
2.4
-
2.4
-
V
I
OH
= -1.0mA
Truth Table
Mode
CE1
CE2
OE
WE
I/O Operation
Supply Current
Standby
H
X
X
X
High Z
I
SB
, I
SB1
X
L
X
X
High Z
I
SB
, I
SB2
Output Disable
L
H
H
H
High Z
I
CC,
I
CC1,
I
CC2
Read
L
H
L
H
D
OUT
I
CC,
I
CC1,
I
CC2
Write
L
H
X
L
D
IN
I
CC,
I
CC1,
I
CC2
Note: X = H or L
Capacitance
(T
A
= 25
C, f = 1.0MHz)
Symbol
Parameter
Min.
Max.
Unit
Conditions
C
IN
*
Input Capacitance
6
pF
V
IN
= 0V
C
I/O
*
Input/Output Capacitance
8
pF
V
I/O
= 0V
* These parameters are sampled and not 100% tested.
A62S6308 Series
(October, 1998, Version 2.0)
5
AMIC Technology, Inc.
AC Characteristics
(T
A
= 0
C to + 70
C or -25
C to 85
C, VCC = 2.7V to 3.6V)
Symbol
Parameter
A62S6308-70S/SI
A62S6308-10S/SI
Unit
Min.
Max.
Min.
Max.
Read Cycle
t
RC
Read Cycle Time
70
-
100
-
ns
t
AA
Address Access Time
-
70
-
100
ns
t
ACE1
Chip Enable Access Time
CE1
-
70
-
100
ns
t
ACE2
CE2
-
70
-
100
ns
t
OE
Output Enable to Output Valid
-
35
-
50
ns
t
CLZ1
Chip Enable to Output in Low Z
CE1
10
-
10
-
ns
t
CLZ2
CE2
10
-
10
-
ns
t
OLZ
Output Enable to Output in Low Z
5
-
5
-
ns
t
CHZ1
Chip Disable to Output in High Z
CE1
0
25
0
35
ns
t
CHZ2
CE2
0
25
0
35
ns
t
OHZ
Output Disable to Output in High Z
0
25
0
35
ns
t
OH
Output Hold from Address Change
10
-
10
-
ns
Read Cycle
t
WC
Write Cycle Time
70
-
100
-
ns
t
CW
Chip Enable to End of Write
60
-
80
-
ns
t
AS
Address Setup Time
0
-
0
-
ns
t
AW
Address Valid to End of Write
60
-
80
-
ns
t
WP
Write Pulse Width
50
-
60
-
ns
t
WR
Write Recovery Time
0
-
0
-
ns
t
WHZ
Write to Output in High Z
0
25
0
35
ns
t
DW
Data to Write Time Overlap
30
-
40
-
ns
t
DH
Data Hold from Write Time
0
-
0
-
ns
t
OW
Output Active from End of Write
5
-
5
-
ns
Notes: t
CHZ1
, t
CHZ2
, t
OHZ
and t
WHZ
are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
A62S6308 Series
(October, 1998, Version 2.0)
6
AMIC Technology, Inc.
Timing Waveforms
Read Cycle 1
(1, 2, 4)
t
RC
t
OH
t
AA
t
OH
Address
D
OUT
Read Cycle 2
(1, 3, 4, 6)
t
CLZ15
t
ACE1
t
CHZ15
CE1
D
OUT
Read Cycle 3
(1, 4, 7 ,8)
t
CLZ25
t
ACE2
t
CHZ25
CE2
D
OUT
A62S6308 Series
(October, 1998, Version 2.0)
7
AMIC Technology, Inc.
Timing Waveforms (continued)
Read Cycle 4
(1)
t
RC
Address
CE2
D
OUT
t
AA
t
OE
t
OLZ5
t
ACE1
t
CLZ15
t
ACE2
t
CLZ25
t
CHZ25
t
OHZ5
t
CHZ15
t
OH
OE
CE1
Notes: 1. WE is high for Read Cycle.
2. Device is continuously enabled CE1 = V
IL
and CE2 = V
IH
.
3. Address valid prior to or coincident with CE1 transition low.
4. OE = V
IL
.
5. Transition is measured
500mV from steady state. This parameter is sampled and not 100% tested.
6. CE2 is high.
7. CE1 is low.
8. Address valid prior to or coincident with CE2 transition high.
A62S6308 Series
(October, 1998, Version 2.0)
8
AMIC Technology, Inc.
Timing Waveforms (continued)
Write Cycle 1
(6)
(Write Enable Controlled)
t
WC
Address
CE1
CE2
D
IN
t
OW
t
DH
t
DW
t
WHZ
t
WP2
t
AS1
(4)
t
CW5
t
AW
t
WR3
WE
D
OUT
(4)
A62S6308 Series
(October, 1998, Version 2.0)
9
AMIC Technology, Inc.
Timing Waveforms (continued)
Write Cycle 2
(Chip Enable Controlled)
t
WC
Address
CE1
CE2
D
IN
t
DH
t
DW
(4)
(4)
t
CW5
t
AW
t
WR3
WE
D
OUT
t
WHZ7
t
WP2
t
CW5
t
AS1
Notes: 1. t
AS
is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (t
WP
) of a low CE1, a high CE2 and a low WE .
3. t
WR
is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. t
CW
is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = V
IL
)
7. Transition is measured
500mV from steady state. This parameter is sampled and not 100% tested.
A62S6308 Series
(October, 1998, Version 2.0)
10
AMIC Technology, Inc.
AC Test Conditions
Input Pulse Levels
0.4V to 2.4V
Input Rise and Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
30pF
* Including scope and jig.
* Including scope and jig.
C
L
TTL
5pF
C
L
TTL
Figure 1. Output Load
Figure 2. Output Load for t
CLZ1
,
t
CLZ2
, t
OHZ
, t
OLZ
, t
CHZ1
,
t
CHZ2
, t
WHZ
, and t
OW
Data Retention Characteristics
(T
A
= 0
C to + 70
C or -25
C to 85
C)
Symbol
Parameter
Min.
Max.
Unit
Conditions
V
DR1
2.0
3.6
V
CE1
VCC - 0.2V
V
DR2
VCC for Data Retention
2.0
3.6
V
CE2
0.2V
CE1
VCC - 0.2V or
CE1
0.2V
I
CCDR1
S-Version
-
10*
A
VCC = 2.0V
CE1
VCC - 0.2V
Data Retention Current
SI-Version
-
20**
CE2
VCC - 0.2V
V
IN
0V
I
CCDR2
S-Version
-
10*
A
VCC = 2.0V
CE2
0.2V
SI-Version
-
20**
V
IN
0V
t
CDR
Chip Disable to Data Retention Time
0
-
ns
t
R
Operation Recovery Time
t
RC
-
ns
See Retention Waveform
t
VR
VCC Rise Time from Data Retention Voltage
to Operating Voltage
5
-
ms
** A62S6308-70S/10S
I
CCDR
: Max. 3
A at T
A
= 0
C + 40
C
* A62S6308-70SI/10SI
I
CCDR
: Max. 3
A at T
A
= 0
C + 40
C
A62S6308 Series
(October, 1998, Version 2.0)
11
AMIC Technology, Inc.
Low VCC Data Retention Waveform (1) ( CE1 Controlled)
VCC
CE1
t
CDR
V
IH
2.7V
t
R
V
IH
2.7V
DATA RETENTION MODE
V
DR
2V
CE1
V
DR
- 0.2V
t
VR
Low VCC Data Retention Waveform (2) (CE2 Controlled)
VCC
CE2
t
CDR
V
IL
2.7V
t
R
V
IL
2.7V
DATA RETENTION MODE
V
DR
2V
CE2 < 0.2V
t
VR
A62S6308 Series
(October, 1998, Version 2.0)
12
AMIC Technology, Inc.
Ordering Information
Part No.
Access Time (ns)
Operating Current
Max. (mA)
Standby Current
Max. (
A)
Package
A62S6308M-70S
40
15
32L SOP
A62S6308M-70SI
40
30
32L SOP
A62S6308V-70S
40
15
32L TSOP
A62S6308V-70SI
70
40
30
32L TSOP
A62S6308X-70S
40
15
32L sTSOP
A62S6308X-70SI
40
30
32L sTSOP
A62S6308G-70S
40
15
36B Mini BGA
A62S6308G-70SI
40
30
36B Mini BGA
A62S6308M-10S
40
15
32L SOP
A62S6308M-10SI
40
30
32L SOP
A62S6308V-10S
40
15
32L TSOP
A62S6308V-10SI
100
40
30
32L TSOP
A62S6308X-10S
40
15
32L sTSOP
A62S6308X-10SI
40
30
32L sTSOP
A62S6308G-10S
40
15
36B Mini BGA
A62S6308G-10SI
40
30
36B Mini BGA
A62S6308 Series
(October, 1998, Version 2.0)
13
AMIC Technology, Inc.
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
1
E
H
E
L
L
E
c
16
See Detail F
Detail F
17
32
A
1
A
2
A
S
D
Seating Plane
D y
e
b
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.118
-
-
3.00
A
1
0.004
-
-
0.10
-
-
A
2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
c
0.006
0.008
0.012
0.15
0.20
0.31
D
-
0.805
0.817
-
20.45
20.75
E
0.440
0.445
0.450
11.18
11.30
11.43
e
0.044
0.050
0.056
1.12
1.27
1.42
H
E
0.546
0.556
0.566
13.87
14.12
14.38
L
0.023
0.031
0.039
0.58
0.79
0.99
L
E
0.047
0.055
0.063
1.19
1.40
1.60
S
-
-
0.036
-
-
0.91
y
-
-
0.004
-
-
0.10
0
-
10
0
-
10
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S6308 Series
(October, 1998, Version 2.0)
14
AMIC Technology, Inc.
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
e
L
E
L
A
A
2
c
D
y
Detail "A"
S
A
1
b
H
D
D
E
Detail "A"
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.047
-
-
1.20
A
1
0.002
-
0.006
0.05
-
0.15
A
2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.009
0.011
0.18
0.22
0.27
c
0.004
-
0.008
0.11
-
0.20
D
0.720
0.724
0.728
18.30
18.40
18.50
E
-
0.315
0.319
-
8.00
8.10
e
0.020 BSC
0.50 BSC
H
D
0.779
0.787
0.795
19.80
20.00
20.20
L
0.016
0.020
0.024
0.40
0.50
0.60
L
E
-
0.032
-
-
0.80
-
S
-
-
0.020
-
-
0.50
y
-
-
0.003
-
-
0.08
0
-
5
0
-
5
Notes:
1. The maximum value of dimension D
includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S6308 Series
(October, 1998, Version 2.0)
15
AMIC Technology, Inc.
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
unit: inches/mm
e
Detail "A"
D
0.076MM
Detail "A"
S
b
D
1
E
D
L
E
L
A
A
2
c
A
1
SEATING PLANE
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.049
-
-
1.25
A
1
0.002
-
-
0.05
-
-
A
2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.008
0.009
0.17
0.20
0.23
c
0.0056 0.0059 0.0062
0.142
0.150
0.158
E
0.311
0.315
0.319
7.90
8.00
8.10
e
0.020 TYP
0.50 TYP
D
0.520
0.528
0.535
13.20
13.40
13.60
D
1
0.461
0.465
0.469
11.70
11.80
11.90
L
0.012
0.020
0.028
0.30
0.50
0.70
L
E
0.0275 0.0315 0.0355
0.700
0.800
0.900
S
0.0109 TYP
0.278 TYP
0
3
5
0
3
5
Notes:
1. The maximum value of dimension D
1
includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S6308 Series
(October, 1998, Version 2.0)
16
AMIC Technology, Inc.
Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions
unit : millimeter(mm)
Symbol
Min
Typ
Max
A
-
0.75
-
B
5.90
6.00
6.10
B1
-
3.75
-
C
7.90
8.00
8.10
C1
-
5.25
-
D
0.30
0.35
0.40
E
1.00
1.10
1.20
E1
-
0.36
-
E2
-
0.22
-
1
2
3
4
5
6
A
B
C
D
E
F
G
H
Bottom View
Pin A1 Index
Diameter D
Solder Ball
A
B1
A
C1
Top View
Pin A1 Index
B
C
0.10
E1
E
E2
D
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