A62S7308B Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
PRELIMINARY (March, 2001, Version 0.2)
AMIC Technology, Inc.
Document Title
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No. History
Issue Date
Remark
0.0
Initial issue
September 5, 2000
Preliminary
0.1
Change max. power supply voltage from 3.3V to 3.6V
October 12, 2000
Change min. V
IH
from 2.2V to 2.4V
Add feature "Interfaces directly with 3.3V typ. logic chip"
Remove A62S7308B-10S/SI part
0.2
Add A62S7308B-55S/SI part
March 9, 2001
Change Input Pulse Levels from 0.4V~2.4V to 0V~3.0V in AC Test
Conditions table
A62S7308B Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
PRELIMINARY (March, 2001, Version 0.2)
1
AMIC Technology, Inc.
NC
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
I/O
1
I/O
2
I/O
3
GND
I/O
4
I/O
5
I/O
6
I/O
7
A10
A9
A8
A13
CE2
A15
VCC
A11
A62S7308BM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
OE
CE1
WE
A10
7
6
5
4
3
GND
OE
CE1
2
1
0
A16
A62S7308BV
(A62S7308BX)
1
9
32
24
A11
A9
2
3
4
5
6
7
8
10
11
12
13
14
15
16
A8
A13
VCC
NC
A14
A12
A7
A6
A5
A4
31
30
29
28
27
26
25
23
22
21
20
19
18
17
I/O
I/O
I/O
I/O
I/O
A0
A1
A2
A3
A15
WE
CE2
I/O
I/O
I/O
~~
~~
A16
1
2
3
4
5
6
A
A0
A1
CE2
A3
A6
A8
B
I/O
4
A2
WE
A4
A7
I/O
0
C
I/O
5
NC
A5
I/O
1
D
VSS
VCC
E
VCC
VSS
F
I/O
6
NC
NC
I/O
2
G
I/O
7
OE
CE1
A16
A15
I/O
3
H
A9
A10
A11
A12
A13
A14
Features
n
Power supply range: 2.7V to 3.6V
n
Access times: 55ns (max.): for VCC = 3.0V to 3.6V
70ns (max.): for VCC = 2.7V to 3.6V
n
Current:
A62S7308B-S series: Operating: 30mA (max.)
Standby: 5
A (max.)
A62S7308B-SI series: Operating: 30mA (max.)
Standby: 10
A (max.)
n
Extended operating temperature range: -25
C to 85
C
for -SI series
n
Full static operation, no clock or refreshing required
n
All inputs and outputs are directly TTL compatible
n
Common I/O using three-state output
n
Output enable and two chip enable inputs for easy
application
n
Data retention voltage: 2V (min.)
n
Available in 32-pin SOP, TSOP, sTSOP (8X
13.4mm) forward type and 36-ball Mini BGA (6X8)
packages
n
Interfaces directly with 3.3V typ. logic chip
General Description
The A62S7308B is a low operating current 1048,576-bit
static random access memory organized as 131,072
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for power down and
a device enable and an output enable input are included
for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
n
n
SOP
n
n
TSOP/(sTSOP)
n
n
Mini BGA (6X8) Top View
(forward type)
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
2
AMIC Technology, Inc.
Block Diagram
ROW
DECODER
512 X 2048
MEMORY ARRAY
INPUT DATA
CIRCUIT
COLUMN I/O
CONTROL
CIRCUIT
CE2
CE1
WE
I/O
7
I/O
0
A16
A15
A14
A0
VCC
GND
OE
Pin Descriptions - SOP
Pin No.
Symbol
Description
1
NC
No Connection
2 - 12, 23,
25 - 28, 31
A0 - A16
Address Inputs
13 - 15,
17 - 21
I/O
0
- I/O
7
Data Inputs/Outputs
16
GND
Ground
22
CE1
Chip Enable 1
24
OE
Output Enable
29
WE
Write Enable
30
CE2
Chip Enable 2
32
VCC
Power Supply
Pin Description - TSOP/sTSOP
Pin No.
Symbol
Description
1 - 4, 7,
10 - 20, 31
A0 - A16
Address Inputs
5
WE
Write Enable
6
CE2
Chip Enable 2
8
VCC
Power Supply
9
NC
No Connection
21 - 23,
25 - 29
I/O
0
- I/O
7
Data Inputs/Outputs
24
GND
Ground
30
CE1
Chip Enable 1
32
OE
Output Enable
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
3
AMIC Technology, Inc.
Recommended DC Operating Conditions
(T
A
= 0
C to + 70
C or -25
C to 85
C)
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Supply Voltage
2.7
3.0
3.6
V
GND
Ground
0
0
0
V
V
IH
Input High Voltage
2.4
-
VCC + 0.3
V
V
IL
Input Low Voltage
-0.3
-
+0.6
V
C
L
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
Absolute Maximum Ratings*
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25
C to + 85
C
Storage Temperature, Tstg . .. . . . . . . . -55
C to + 125
C
Power Dissipation, P
T
. . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260
C, 10 sec
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
(T
A
= 0
C to + 70
C or -25
C to 85
C, VCC = 2.7V to 3.6V, GND = 0V)
Symbol
Parameter
A62S7308B-55S/70S A62S7308B-55SI/70SI Unit
Conditions
Min.
Max.
Min.
Max.
I
LI
Input Leakage
Current
-
1
-
1
A
V
IN
= GND to VCC
I
LO
Output Leakage
Current
-
1
-
1
A
CE1
= V
IH
or CE2 = V
IL
or
OE
= V
IH
or WE = V
IL
V
I/O
= GND to VCC
I
CC
Active Power Supply
Current
-
3
-
3
mA
CE1
= V
IL
, CE2 = V
IH
I
I/O
= 0mA
I
CC1
Dynamic Operating
Current
-
30
-
30
mA
Min. Cycle, Duty = 100%
CE1
= V
IL
, CE2 = V
IH
I
I/O
= 0mA
I
CC2
Dynamic Operating
Current
-
3
-
3
mA
CE1
= V
IL
, CE2 = V
IH
V
IH
= VCC
, V
IL
= 0V
F = 1MHz,
I
I/O
= 0mA
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
4
AMIC Technology, Inc.
{
DC Electrical Characteristics
(continued)
Symbol
Parameter
A62S7308B-55S/70S A62S7308B-55SI/70SI
Unit
Conditions
Min.
Max.
Min.
Max.
I
SB
-
0.3
-
0.3
mA
CE1
= V
IH
or
CE2 = V
IL
I
SB1
Standby Power
Supply Current
-
5
-
10
A
CE2
0.2V,
or
CE1
VCC - 0.2V
CE2
VCC - 0.2V
V
OL
Output Low Voltage
-
0.4
-
0.4
V
I
OL
= 2.1mA
V
OH
Output High Voltage
2.4
-
2.4
-
V
I
OH
= -1.0mA
Truth Table
Mode
CE1
CE2
OE
WE
I/O Operation
Supply Current
Standby
H
X
X
X
High Z
I
SB
, I
SB1
X
L
X
X
High Z
I
SB
, I
SB1
Output Disable
L
H
H
H
High Z
I
CC,
I
CC1,
I
CC2
Read
L
H
L
H
D
OUT
I
CC,
I
CC1,
I
CC2
Write
L
H
X
L
D
IN
I
CC,
I
CC1,
I
CC2
Note: X = H or L
Capacitance
(T
A
= 25
C, f = 1.0MHz)
Symbol
Parameter
Min.
Max.
Unit
Conditions
C
IN
*
Input Capacitance
6
pF
V
IN
= 0V
C
I/O
*
Input/Output Capacitance
8
pF
V
I/O
= 0V
* These parameters are sampled and not 100% tested.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
5
AMIC Technology, Inc.
AC Characteristics
(T
A
= 0
C to + 70
C or -25
C to 85
C)
Symbol
Parameter
A62S7308B-55S/SI
(VCC = 3.0V to 3.6V)
A62S7308B-70S/SI
(VCC = 2.7V to 3.6V) Unit
Min.
Max.
Min.
Max.
Read Cycle
t
RC
Read Cycle Time
55
-
70
-
ns
t
AA
Address Access Time
-
55
-
70
ns
t
ACE1
Chip Enable Access Time
CE1
-
55
-
70
ns
t
ACE2
CE2
-
55
-
70
ns
t
OE
Output Enable to Output Valid
-
30
-
35
ns
t
CLZ1
Chip Enable to Output in Low Z
CE1
10
-
10
-
ns
t
CLZ2
CE2
10
-
10
-
ns
t
OLZ
Output Enable to Output in Low Z
10
-
5
-
ns
t
CHZ1
Chip Disable to Output in High Z
CE1
0
20
0
25
ns
t
CHZ2
CE2
0
20
0
25
ns
t
OHZ
Output Disable to Output in High Z
0
20
0
25
ns
t
OH
Output Hold from Address Change
5
-
10
-
ns
Write Cycle
t
WC
Write Cycle Time
55
-
70
-
ns
t
CW
Chip Enable to End of Write
50
-
60
-
ns
t
AS
Address Setup Time
0
-
0
-
ns
t
AW
Address Valid to End of Write
50
-
60
-
ns
t
WP
Write Pulse Width
40
-
50
-
ns
t
WR
Write Recovery Time
0
-
0
-
ns
t
WHZ
Write to Output in High Z
0
25
0
30
ns
t
DW
Data to Write Time Overlap
25
-
30
-
ns
t
DH
Data Hold from Write Time
0
-
0
-
ns
t
OW
Output Active from End of Write
5
-
5
-
ns
Notes: t
CHZ1
, t
CHZ2
, t
OHZ
and t
WHZ
are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
6
AMIC Technology, Inc.
Timing Waveforms
Read Cycle 1
(1)
t
RC
Address
CE2
D
OUT
t
AA
t
OE
t
OLZ5
t
ACE1
t
CLZ15
t
ACE2
t
CLZ25
t
CHZ25
t
OHZ5
t
CHZ15
t
OH
OE
CE1
Read Cycle 2
(1, 2, 4)
t
RC
t
OH
t
AA
t
OH
Address
D
OUT
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
7
AMIC Technology, Inc.
Timing Waveforms (continued)
Read Cycle 3
(1, 3, 4, 6)
t
CLZ15
t
ACE1
t
CHZ15
CE1
D
OUT
Read Cycle 4
(1, 4, 7, 8)
t
CLZ25
t
ACE2
t
CHZ25
CE2
D
OUT
Notes: 1. WE is high for Read Cycle.
2. Device is continuously enabled CE1 = V
IL
and CE2 = V
IH
.
3. Address valid prior to or coincident with CE1 transition low.
4. OE = V
IL
.
5. Transition is measured
500mV from steady state. This parameter is sampled and not 100% tested.
6. CE2 is high.
7. CE1 is low.
8. Address valid prior to or coincident with CE2 transition high.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
8
AMIC Technology, Inc.
Timing Waveforms (continued)
Write Cycle 1
(6)
(Write Enable Controlled)
t
WC
Address
CE1
CE2
D
IN
t
OW
t
DH
t
DW
t
WHZ
t
WP2
t
AS1
(4)
t
CW5
t
AW
t
WR3
WE
D
OUT
(4)
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
9
AMIC Technology, Inc.
Timing Waveforms (continued)
Write Cycle 2
(6)
(Chip Enable Controlled)
t
WC
Address
CE1
CE2
D
IN
t
DH
t
DW
(4)
(4)
t
CW5
t
AW
t
WR3
WE
D
OUT
t
WHZ7
t
WP2
t
CW5
t
AS1
Notes: 1. t
AS
is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (t
WP
) of a low CE1, a high CE2 and a low WE .
3. t
WR
is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. t
CW
is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = V
IL
)
7. Transition is measured
500mV from steady state. This parameter is sampled and not 100% tested.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
10
AMIC Technology, Inc.
{
{
AC Test Conditions
Input Pulse Levels
0V to 3V
Input Rise and Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
30pF
* Including scope and jig.
* Including scope and jig.
C
L
TTL
5pF
C
L
TTL
Figure 1. Output Load Figure 2. Output Load for t
CLZ1
,
t
CLZ2
, t
OHZ
, t
OLZ
, t
CHZ1
,
t
CHZ2
, t
WHZ
, and t
OW
Data Retention Characteristics
(T
A
= 0
C to + 70
C or -25
C to 85
C)
Symbol
Parameter
Min.
Max.
Unit
Conditions
V
DR
VCC for Data Retention
2.0
3.6
V
CE2
0.2V,
or CE1
VCC - 0.2V,
CE2
VCC - 0.2V
I
CCDR
Data Retention Current
S-Version
-
2*
A
SI-Version
-
5**
VCC = 2.0V, CE2
0.2V,
or CE1
VCC - 0.2V
CE2
VCC - 0.2V
t
CDR
Chip Disable to Data Retention Time
0
-
ns
t
R
Operation Recovery Time
t
RC
-
ns
See Retention Waveform
* A62S7308B-55S/70S I
CCDR
: Max. 1
A at T
A
= 0
C to + 40
C
** A62S7308B-55SI/70SI I
CCDR
: Max. 1
A at T
A
= 0
C to + 40
C
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
11
AMIC Technology, Inc.
Low VCC Data Retention Waveform (1) (
CE1
Controlled)
VCC
CE1
t
CDR
V
IH
2.7V
t
R
V
IH
2.7V
DATA RETENTION MODE
V
DR
2V
CE1
V
DR
- 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
VCC
CE2
t
CDR
V
IL
2.7V
t
R
V
IL
2.7V
DATA RETENTION MODE
V
DR
2V
CE2
0.2V
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
12
AMIC Technology, Inc.
Ordering Information
Part No.
Access Time
(ns)
Operating Current
Max. (mA)
Standby Current
Max. (
A)
Package
A62S7308BM-55S
5
32L SOP
A62S7308BM-55SI
10
32L SOP
A62S7308BV-55S
5
32L TSOP
A62S7308BV-55SI
10
32L TSOP
A62S7308BX-55S
5
32L sTSOP
A62S7308BX-55SI
10
32L sTSOP
A62S7308BG-55S
5
36B Mini BGA
A62S7308BG-55SI
55
30
10
36B Mini BGA
A62S7308BM-70S
5
32L SOP
A62S7308BM-70SI
10
32L SOP
A62S7308BV-70S
5
32L TSOP
A62S7308BV-70SI
10
32L TSOP
A62S7308BX-70S
5
32L sTSOP
A62S7308BX-70SI
10
32L sTSOP
A62S7308BG-70S
5
36B Mini BGA
A62S7308BG-70SI
70
30
10
36B Mini BGA
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
13
AMIC Technology, Inc.
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
1
E
H
E
L
L
E
c
16
See Detail F
Detail F
17
32
A
1
A
2
A
S
D
Seating Plane
D
y
e
b
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.118
-
-
3.00
A
1
0.004
-
-
0.10
-
-
A
2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
c
0.006
0.008
0.012
0.15
0.20
0.31
D
-
0.805
0.817
-
20.45
20.75
E
0.440
0.445
0.450
11.18
11.30
11.43
e
0.044
0.050
0.056
1.12
1.27
1.42
H
E
0.546
0.556
0.566
13.87
14.12
14.38
L
0.023
0.031
0.039
0.58
0.79
0.99
L
E
0.047
0.055
0.063
1.19
1.40
1.60
S
-
-
0.036
-
-
0.91
y
-
-
0.004
-
-
0.10
0
-
10
0
-
10
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
14
AMIC Technology, Inc.
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
e
L
E
L
A
A
2
c
D
y
Detail "A"
S
A
1
b
H
D
D
E
Detail "A"
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.047
-
-
1.20
A
1
0.002
-
0.006
0.05
-
0.15
A
2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.009
0.011
0.18
0.22
0.27
c
0.004
-
0.008
0.11
-
0.20
D
0.720
0.724
0.728
18.30
18.40
18.50
E
-
0.315
0.319
-
8.00
8.10
e
0.020 BSC
0.50 BSC
H
D
0.779
0.787
0.795
19.80
20.00
20.20
L
0.016
0.020
0.024
0.40
0.50
0.60
L
E
-
0.032
-
-
0.80
-
S
-
-
0.020
-
-
0.50
y
-
-
0.003
-
-
0.08
0
-
5
0
-
5
Notes:
1. The maximum value of dimension D
includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
15
AMIC Technology, Inc.
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
unit: inches/mm
e
Detail "A"
D
0.076MM
Detail "A"
S
b
D
1
E
D
L
E
L
A
A
2
c
A
1
SEATING PLANE
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.049
-
-
1.25
A
1
0.002
-
-
0.05
-
-
A
2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.008
0.009
0.17
0.20
0.23
c
0.0056 0.0059 0.0062
0.142
0.150
0.158
E
0.311
0.315
0.319
7.90
8.00
8.10
e
0.020 TYP
0.50 TYP
D
0.520
0.528
0.535
13.20
13.40
13.60
D
1
0.461
0.465
0.469
11.70
11.80
11.90
L
0.012
0.020
0.028
0.30
0.50
0.70
L
E
0.0275 0.0315 0.0355
0.700
0.800
0.900
S
0.0109 TYP
0.278 TYP
0
3
5
0
3
5
Notes:
1. The maximum value of dimension D
1
includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S7308B Series
PRELIMINARY (March, 2001, Version 0.2)
16
AMIC Technology, Inc.
Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions
unit : millimeter(mm)
Symbol
Min
Typ
Max
A
-
0.75
-
B
5.90
6.00
6.10
B1
-
3.75
-
C
7.90
8.00
8.10
C1
-
5.25
-
D
0.30
0.35
0.40
E
1.00
1.10
1.20
E1
-
0.36
-
E2
-
0.22
-
1
2
3
4
5
6
A
B
C
D
E
F
G
H
Bottom View
Pin A1 Index
Diameter D
Solder Ball
A
B1
A
C1
Top View
Pin A1 Index
B
C
0.10
E1
E
E2
D
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