Microsoft Word - A67P8318

A67P8318/A67P7336

Preliminary

256K X 18, 128K X 36 LVTTL, Pipelined ZeBL

SRAM

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Features

Fast access time:

2.6/2.8/3.2/3.5/3.8/4.2 (250/227/200/166/150/133MHz)

Zero Bus Latency between READ and WRITE cycles
allows 100% bus utilization

Signal +2.5V

5% power supply

Individual Byte Write control capability

Clock enable (

CEN

) pin to enable clock and suspend

operations

Clock-controlled and registered address, data and

control signals

Registered output for pipelined applications

Three separate chip enables allow wide range of
options for CE control, address pipelining

Internally self-timed write cycle

Selectable BURST mode (Linear or Interleaved)

SLEEP mode (ZZ pin) provided

Available in 100 pin LQFP package

General Description

The AMIC Zero Bus Latency (ZeBL

) SRAM family

employs high-speed, low-power CMOS designs using an
advanced CMOS process.
The A67P8318, A67P7336 SRAMs integrate a 256K X 18,
128K X 36 SRAM core with advanced synchronous
peripheral circuitry and a 2-bit burst counter. These SRAMs
are optimized for 100 percent bus utilization without the
insertion of any wait cycles during Write-Read alternation.
The positive edge triggered single clock input (CLK) controls
all synchronous inputs passing through the registers. The
synchronous inputs include all address, all data inputs,
active low chip enable (

), two additional chip enables for

easy depth expansion (CE2,

CE2

), cycle start input

(ADV/ LD ), synchronous clock enable (

CEN

), byte write

enables (

BW1

BW2

BW3

BW4

) and read/write (R/

Asynchronous inputs include the output enable (

), clock

(CLK), SLEEP mode (ZZ, tied LOW if unused) and burst
mode (MODE). Burst Mode can provide either interleaved or
linear operation, burst operation can be initiated by
synchronous address Advance/Load (ADV/LD ) pin in Low

state. Subsequent burst address can be internally
generated by the chip and controlled by the same input pin
ADV/LD in High state.

Write cycles are internally self-time and synchronous with
the rising edge of the clock input and when R/

is Low.

The feature simplified the write interface. Individual Byte
enables allow individual bytes to be written.

BW1

controls

I/Oa pins;

BW2

controls I/Ob pins;

BW3

controls I/Oc pins;

and

BW4

controls I/Od pins. Cycle types can only be

defined when an address is loaded.
The SRAM operates from a +2.5V power supply, and all
inputs and outputs are LVTTL-compatible. The device is
ideally suited for high bandwidth utilization systems.

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Pin Configuration

17
18

100

256Kx18

128Kx36

I/Ob

I/Oa

A10

VCCQ

VSSQ

VCCQ

VSS

VCC

VCCQ

VSSQ

VCCQ

I/Oa

VCCQ

VSSQ

VCCQ

VCC

VSS

VCCQ

VSSQ

VCCQ

I/Ob

VCC

I/Ob

VCCQ

VSSQ

VCCQ

VSS

VCC

VCCQ

VSSQ

VCCQ

I/Ob

BW2

BW1

A67P8318E
A67P7336E

I/Ob

VCCQ

VSSQ

VCCQ

VCC

VSS

VCCQ

VSSQ

VCCQ

VCC

I/Oc

I/Od

I/Oa

I/Ob

I/Oa

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Block Diagram (128K X 36)

128Kx9x4

MEMORY

ARRAY

MODE

LOGIC

CLK

LOGIC

ADDRESS

REGISTERS

BURST

LOGIC

ADDRESS

COUNTER

CLR

WRITE

REGISTRY

CONTROL

LOGIC

BYTEa
WRITE
DRIVER

BYTEb
WRITE
DRIVER

BYTEc
WRITE
DRIVER

BYTEd
WRITE
DRIVER

OUTPUT

REGISTERS

OUTPUT

BUFFERS

DATA-IN

REGISTERS

CHIP

ENABLE

LOGIC

PIPELINED

ENABLE

LOGIC

OUTPUT

ENABLE

LOGIC

MODE

ADV/LD

CLK

A0-A16

R/W

BW1
BW2
BW3
BW4

CE2
CE2

CEN

WRITE

ADDRESS

WRITE

ADDRESS

ADV/LD

DATA-IN

REGISTERS

I/O

SENSE

AMPS

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Block Diagram (256K X 18)

DATA-IN

REGISTERS

MODE

LOGIC

CLK

LOGIC

ADDRESS

REGISTERS

BURST

LOGIC

ADDRESS

COUNTER

CLR

WRITE

REGISTRY

CONTROL

LOGIC

BYTEa
WRITE
DRIVER

BYTEb
WRITE
DRIVER

256KX9X2

MEMORY

ARRAY

OUTPUT

REGISTERS

OUTPUT

BUFFERS

CHIP

ENABLE

LOGIC

PIPELINED

ENABLE

LOGIC

OUTPUT

ENABLE

LOGIC

MODE

ADV/LD

CLK

A0-A17

R/W

BW1

BW2

CE2
CE2

CEN

WRITE

ADDRESS

WRITE

ADDRESS

ADV/LD

I/O

SENSE

AMPS

DATA-IN

REGISTERS

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Pin Description

Pin No.

Symbol

Description

LQFP (X18)

LQFP (X36)

37
36

35, 34, 33, 32,

100, 99, 82, 81,

44, 45, 46, 47,

48, 49, 50

37
36

35, 34, 33, 32,

100, 99, 82, 81,

45, 46, 47, 48,

49, 50

A0
A1

A2 - A9

A11 - A17

A10

Synchronous Address Inputs : These inputs are registered
and must meet the setup and hold times around the rising
edge of CLK. A0 and A1 are the two lest significant bits
(LSB) of the address field and set the internal burst counter if
burst is desired.

93 (

BW1

)

94 (

BW2

)

93 (

BW1

)

94 (

BW2

)

95 (

BW3

)

96 (

BW4

)

BW1

BW2

BW3

BW4

Synchronous Byte Write Enables : These active low inputs
allow individual bytes to be written when a WRITE cycle is
active and must meet the setup and hold times around the
rising edge of CLK. BYTE WRITEs need to be asserted on
the same cycle as the address, BWs are associated with
addresses and apply to subsequent data.

BW1

controls I/Oa

pins;

BW2

controls I/Ob pins;

BW3

controls I/Oc pins;

BW4

controls I/Od pins.

89 89

CLK

Clock: This signal registers the address, data, chip enables,
byte write enables and burst control inputs on its rising edge.
All synchronous inputs must meet setup and hold times
around the clock are rising edge.

98 98

Synchronous Chip Enable : This active low input is used to
enable the device. This input is sampled only when a new
external address is loaded (ADV/LD LOW).

92 92

CE2

Synchronous Chip Enable : This active low input is used to
enable the device and is sampled only when a new external
address is loaded (ADV/LD LOW). This input can be used
for memory depth expansion.

CE2

Synchronous Chip Enable : This active high input is used to
enable the device and is sampled only when a new external
address is loaded (ADV/LD LOW). This input can be used
for memory depth expansion.

86 86

Output Enable : This active low asynchronous input enables
the data I/O output drivers.

85 85

ADV/LD

Synchronous Address Advance/Load : When HIGH, this
input is used to advance the internal burst counter,
controlling burst access after the external address is loaded.
When HIGH, R/

is ignored. A LOW on this pin permits a

new address to be loaded at CLK rising edge.

87 87

CEN

Synchronous Clock Enable : This active low input permits
CLK to propagate throughout the device. When HIGH, the
device ignores the CLK input and effectively internally
extends the previous CLK cycle. This input must meet setup
and hold times around the rising edge of CLK.

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Pin Description (continued)

Pin No.

Symbol

Description

LQFP (X18)

LQFP (X36)

Snooze Enable : This active high asynchronous input causes
the device to enter a low-power standby mode in which all
data in the memory array is retained. When active, all other
inputs are ignored.

88 88

Read/Write : This active input determines the cycle type
when ADV/LD is LOW. This is the only means for
determining READs and WRITEs. READ cycles may not be
converted into WRITEs (and vice versa) other than by
loading a new address. A LOW on this pin permits BYTE
WRITE operations and must meet the setup and hold times
around the rising edge of CLK. Full bus width WRITEs occur
if all byte write enables are LOW.

74, 73, 72, 69, 68,

63, 62, 59, 58,

24, 23, 22, 19, 18

13, 12, 9, 8

51, 52, 53, 56, 57,

58, 59, 62, 63

68, 69, 72, 73, 74,

75, 78, 79, 80

1, 2, 3, 6, 7, 8, 9,

12, 13,

18, 19, 22, 23, 24,

25, 28, 29, 30

I/Oa

I/Ob

I/Oc

I/Od

SRAM Data I/O : Byte "a" is I/Oa pins; Byte "b" is I/Ob pins;
Byte "c" is I/Oc pins; Byte "d" is I/Od pins. Input data must
meet setup and hold times around CLK rising edge.

31 31

MODE

Mode : This input selects the burst sequence. A LOW on this
pin selects linear burst. NC or HIGH on this pin selects
interleaved burst. Do not alter input state while device is
operating.

1, 2, 3, 6, 7, 25, 28,

29, 30, 38, 39,

42,43 51, 52, 53,

56, 57, 75, 78, 79,

95, 96

38,39,42,43

No Connect : These pins can be left floating or connected to
GND to minimize thermal impedance.

15, 41, 65, 91

VCC

Power Supply : See DC Electrical Characteristics and
Operating Conditions for range.

14, 16, 66

VCC

These pins do not have to be connected directly to VCC as
long as the input voltage is

. This input is not connected

to VCC bus internally.

4, 11, 20, 27,

54, 61, 70, 77

4, 11, 20, 27, 54,

61, 70, 77

VCCQ

Isolated Output Buffer Supply : See DC Electrical
Characteristics and Operating Conditions for range.

17, 40, 90

VSS

Ground : GND.

5,10,21,26,

55,60,71,76

5,10,21,26,

55,60,71,76

VSSQ

Isolated Output Buffer Ground

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Truth Table (Notes 5 - 7)

Operation

Address

Used

CE2

ADV/

BWx

CEN

CLK I/O Notes

Deselected Cycle,
Power-down

None H

X X L L X X X L L

H High-Z

Deselected Cycle,
Power-down

None X

H X L L X X X L L

H High-Z

Deselected Cycle,
Power-down

None X

X L L L X X X L L

H High-Z

Continue Deselect
Cycle

None X

X X L H X X X L L

H High-Z

READ Cycle
(Begin Burst)

External L L H L L H X L L L

H Q

READ Cycle
(Continue Burst)

Next X

X X L H X X L L

H Q 1,7

NOP/Dummy READ
(Begin Burst)

External L L H L L H X H L L

H High-Z

Dummy READ
(Continue Burst)

Next X

X X L H X X H L

H High-Z

1,2,7

WRITE Cycle
(Begin Burst)

External

L H L L L L X L

H D

WRITE Cycle
(Continue Burst)

Next X

X X L H X L X L

H D 1,3,7

NOP/WRITE Abort
(Begin Burst)

None L L H L L L H X L

H High-Z

2,3

WRITE Abort
(Continue Burst)

Next X

X X L H X H X L

H High-Z

1,2,3,7

IGNORE Clock Edge
(Stall)

Current X X X L X X X X H L

H -

SLEEP Mode

None

High-Z

Notes:
1. Continue Burst cycles, whether READ or WRITE, use the same control inputs. The type of cycle performed (READ or

WRITE) is chosen in the initial Begin Burst cycle. A Continue Deselect cycle can only be entered if a Deselect cycle is
executed first.

2. Dummy READ and WRITE Abort cycles can be considered NOPs because the device performs no operation. A WRITE

Abort means a WRITE command is given, but no operation is performed.

3. OE may be wired LOW to minimize the number of control signals to the SRAM. The device will automatically turn off the

output drivers during a WRITE cycle. Some users may use OE when the bus turn-on and turn-off times do not meet their
requirements.

4. If an Ignore Clock Edge command occurs during a READ operation, the I/O bus will remain active (Low-Z). If it occurs

during a WRITE cycle, the bus will remain in High-Z. No WRITE operations will be performed during the Ignored Clock
Edge cycle.

5. X means "Don't Care." H means logic HIGH. L means logic LOW.

BWx

= H means all byte write signals (

BW1

BW2

BW3

and

BW4

) are HIGH.

BWx

= L means one or more byte write signals are LOW.

BW1

enables WRITEs to Byte "a" (I/Oa pins);

BW2

enables WRITEs to Byte "b" (I/Ob pins);

BW3

enables WRITEs to

Byte "c" (I/Oc pins);

BW4

enables WRITEs to Byte "d" (I/Od pins).

7. The address counter is incremented for all Continue Burst cycles.

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Partial Truth Table for READ/WRITE Commands (X18)

Operation R/

BW1

BW2

READ H

WRITE Byte "a"

WRITE Byte "b"

WRITE all bytes

WRITE Abort/NOP

Note : Using and BYTE WRITE(s), any one or more bytes may be written.

Partial Truth Table for READ/WRITE Commands (X36)

Operation R/

BW1

BW2

BW3

BW4

READ

H X X X X

WRITE Byte "a"

WRITE Byte "b"

WRITE Byte "c"

WRITE Byte "d"

WRITE all bytes

WRITE

Abort/NOP

L H H H H

Note : Using R/

and BYTE WRITE(s), any one or more bytes may be written.

Linear Burst Address Table (MODE = LOW)

First Address (External) Second

Address

(Internal)

Third Address (Internal) Fourth

Address

(Internal)

X . . . X00

X . . . X01

X . . . X10

X . . . X11

X . . . X01

X . . . X10

X . . . X11

X . . . X00

X . . . X10

X . . . X11

X . . . X00

X . . . X01

X . . . X11

X . . . X00

X . . . X01

X . . . X10

Interleaved Burst Address Table (MODE = HIGH or NC)

First Address (External) Second

Address

(Internal)

Third Address (Internal) Fourth

Address

(Internal)

X . . . X00

X . . . X01

X . . . X10

X . . . X11

X . . . X01

X . . . X00

X . . . X11

X . . . X10

X . . . X11

X . . . X00

X . . . X01

X . . . X11

X . . . X10

X . . . X01

X . . . X00

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Absolute Maximum Ratings*

Power Supply Voltage (VCC) . . . . . . . . . . -0.3V to +3.6V
Voltage Relative to GND for any Pin Except VCC (Vin,
Vout) . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Operating Temperature (Topr) . . . . . . . . . . . 0

C to 70

Storage Temperature (Tbias) . . . . . . . . . . -10

C to 85

Storage Temperature (Tstg) . . . . . . . . . . -55

C to 125

*Comments

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.

DC Electrical Characteristics and Operating Conditions

C, VCC, VCCQ = +2.5V

5% unless otherwise noted)

Symbol Parameter

Conditions

Min.

Max.

Unit

Note

Input High Voltage

1.7

VCC+0.3

1,2

Input Low Voltage

-0.3

0.8

1,2

Input Leakage Current

VCC

-2.0

2.0

Output Leakage Current

Output(s) disabled,

VCC

-2.0 2.0

Output High Voltage

= -1.0mA

2.0

1,3

Output Low Voltage

= 1.0mA

0.4

1,3

VCC Supply

Voltage

2.375 2.625

VCCQ

Isolated Output Buffer Supply

2.375

VCC

1,4

Capacitance

Symbol Parameter

Conditions

Typ.

Max.

Unit

Note

Control Input Capacitance

Input/Output Capacitance (I/O)

Address

Capacitance

= 25

C; f = 1MHz

VCC = 2.5V

3 3.5 pF

Note : 1. All voltages referenced to VSS (GND).

2. Overshoot : V

+4.6V for t

KHKH

/2 for I

20mA

Undershoot : V

-0.7V for t

KHKH

/2 for I

20mA

Power-up :

+2.625V and VCC

2.625V for t

200ms

3. The load used for V

, V

testing is shown in Figure 2. AC load current is higher than the shown DC values.

AC I/O curves are available upon request.
4. VCC and VCCQ can be externally wired together to the same power supply.
5. This parameter is sampled.

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Operating Condition and Maximum Limits

Max.

Symbol Parameter

-2.6 -2.8

-3.2

-3.5

-3.8

-4.2

Unit

Conditions

Power Supply
Current : Operating

230 200

185

170

160

145

Device selected; All inputs

; Cycle time

(MIN);

VCC = MAX; Outputs open

Standby

30 30 30 30 30 30 mA

Device deselected; VCC = MAX;
All inputs

VSS+0.2 or

VCC-

0.2; Cycle time

(MIN)

SB1

Standby

30 30 30 30 30 30 mA

Device deselected; VCC = MAX;
All inputs

; or

;

All inputs static;

CLK frequency=MAX

VCC-0.2V

SB2

Standby

15 15 15 15 15 15 mA

Device deselected; VCC = MAX;
All inputs

VSS+0.2 or

VCC-

0.2; All inputs static; CLK
frequency=0
ZZ

0.2V

SB2Z

SLEEP

Mode

15 15 15 15 15 15 mA

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

AC Characteristics

(Note 4)

C, VCC = +2.5V

5%)

-2.6 -2.8 -3.2 -3.5 -3.8 -4.2

Unit

Note

Symbol Parameter

Min Max Min

Max

Min

Max

Min

Max

Min

Max Min Max

Clock

KHKH

Clock

cycle

time

4.0 - 4.4

- 5.0

- 6.0

- 6.7

- 7.5 - ns

Clock

frequency

- 250 - 227

- 200

- 166

- 150 - 133

KHKL

Clock

HIGH

time

1.7 - 2.0

- 2.0

- 2.2

- 2.5

- 3.0 - ns

KLKH

Clock

LOW

time

1.7 - 2.0

- 2.0

- 2.2

- 2.5

- 3.0 - ns

Output Times

KHQV

Clock to output valid

2.6

2.8

3.2

3.5

3.8

4.2

KHQX

Clock to output invalid

1.5

KHQX1

Clock to output in Low-Z

1.5

1,2,3

KHQZ

Clock to output in High-Z

1.5

2.6

1.5

2.8

1.5

3.0

1.5

3.0

1.5

3.0

1.5

3.5

1,2,3

GLQV

to output valid

- 2.6 - 2.8

- 3.2

- 3.5

- 3.8 - 4.2 ns 4

GLQX

to output in Low-Z

0 - 0 - 0 - 0 - 0 - 0 - ns

1,2,3

GHQZ

to output in High-Z

- 2.6 - 2.8

- 3.0

- 3.0 - 3.5 ns 1,2,3

Setup Times

AVKH

Address

1.2 - 1.4

- 1.4

- 1.5

- 1.5 - ns 5

EVKH

Clock enable (

CEN

)

1.2 - 1.4

- 1.4

- 1.5

- 1.5 - ns 5

CVKH

Control

signals

1.2 - 1.4

- 1.4

- 1.5

- 1.5 - ns 5

DVKH

Data-in

1.2 - 1.4

- 1.4

- 1.5

- 1.5 - ns 5

Hold Times

KHAX

Address

0.3 - 0.4

- 0.4

- 0.5

- 0.5 - ns 5

KHEX

Clock enable (

CEN

)

0.3 - 0.4

- 0.4

- 0.5

- 0.5 - ns 5

KHCX

Control

signals

0.3 - 0.4

- 0.4

- 0.5

- 0.5 - ns 5

KHDX

Data-in

0.3 - 0.4

- 0.4

- 0.5

- 0.5 - ns 5

Notes: 1. This parameter is sampled.

2. Output loading is specified with C1=5pF as in Figure 2.
3. Transition is measured

200mV from steady state voltage.

4. OE can be considered a "Don't Care" during WRITE; however, controlling OE can help fine-tune a system for

turnaround timing.

5. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of

CLK when ADV/LD is LOW and chip enabled. All other synchronous inputs meet the setup and hold times with
stable logic levels for all rising edges of clock (CLK) when the chip is enabled. Chip enable must be valid at each
rising edge of CLK (when ADV/LD is LOW) to remain enabled.

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

SLEEP Mode

SLEEP Mode is a low current "Power-down" mode in which
the device is deselected and current is reduced to I

SB2Z

. This

duration of SLEEP Mode is dictated by the length of time the
ZZ is in a HIGH state. After entering SLEEP Mode, all inputs
except ZZ become disabled and all outputs go to High-Z.
The ZZ pin is asynchronous, active high input that causes the
device to enter SLEEP Mode. When the ZZ pin becomes
logic HIGH, ISB2Z is guaranteed after the time t

ZZI

is met.

Any operation pending when entering SLEEP Mode is not
guaranteed to successfully complete. Therefore, SLEEP
Mode (READ or WRITE) must not be initiated until valid
pending operations are completed. Similarly, when exiting
SLEEP Mode during t

RZZ

, only a DESELECT or READ cycle

should be given while the SRAM is transitioning out of
SLEEP Mode.

SLEEP Mode Electrical Characteristics

(VCC, VCCQ = +2.5V

5%)

Symbol Parameter

Conditions

Min.

Max.

Unit

Note

SB2Z

Current during SLEEP Mode

ZZ active to input ignored

2(t

KHKH

) ns 1

RZZ

ZZ inactive to input sampled

2(t

KHKH

) ns 1

ZZI

ZZ active to snooze current

- 2(t

KHKH

) ns 1

RZZI

ZZ inactive to exit snooze current

Note : 1. This parameter is sampled.

SLEEP Mode Waveform

RZZ

ZZI

ISB2Z

High-Z

DESELECT or READ Only

Output

(Q)

ALL INPUTS

(except ZZ)

SUPPLY

CLK

: Don't Care

RZZI

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

READ/WRITE Timing

Note :

1. For this waveform, ZZ is tied LOW.
2. Burst sequence order is determined by MODE (0 = linear, 1 = interleaved). BRST operations are optional.
3.

represents three signals. When

= 0, it represents

= 0,

CE2

= 0, CE2 = 1.

4. Data coherency is provided for all possible operations. If a READ is initiated the most current data is used. The

most recent data may be from the input data register.

D(A1)

WRITE

D(A1)

WRITE

D(A2)

BURST

WRITE

D(A2+1)

READ

Q(A3)

READ

Q(A4)

BURST

READ

Q(A4+1)

WRITE

D(A5)

READ

Q(A6)

WRITE

D(A7)

DESELECT

: Don't Care

: Undefined

GLQX

KHKH

CLK

CEN

ADV/

R/W

BWx

ADDRESS

I/O

COMMAND

D(A2)

D(A2+1)

Q(A6)

D(A5)

Q(A4+1)

Q(A4)

Q(A3)

KLKH

EVKH

KHEX

KHKL

KHCX

CVKH

KHAX

AVKH

KHDX

DVKH

KHQZ

GLQV

KHQX

GHQZ

KHQX

KHQV

KHQX1

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

NOP, STALL and Deselect Cycles

Note :

1. The IGNORE CLOCK EDGE or STALL cycle (clock 3) illustrates

CEN

being used to create a "pause." A WRITE is

not performed during this cycle.

2. For this waveform, ZZ and

are tied LOW.

represents three signals. When

= 0, it represents

= 0,

= 0, CE2 = 1.

4. Data coherency is provided for all possible operations. If a READ is initiated, the most current data is used. The

most recent data may be from the input data register.

Q(A5)

D(A4)

Q(A3)

Q(A2)

D(A1)

WRITE

D(A1)

READ

Q(A2)

STALL

READ

Q(A3)

WRITE

D(A4)

STALL

NOP

READ

Q(A5)

DESELECT

CONTINUE

DESELECT

: Don't Care

: Undefined

KHQX

KHQZ

CLK

CEN

ADV/

R/W

BWx

ADDRESS

I/O

COMMAND

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Ordering Information

Part No.

Configure

Cycle Time / Access Time

Package

A67P8318E-4.2

7.5ns / 4.2ns

100L LQFP

A67P8318E-4.2F

7.5ns / 4.2ns

100L Pb-Free LQFP

A67P8318E-3.8

6.7ns / 3.8ns

100L LQFP

A67P8318E-3.8F

6.7ns / 3.8ns

100L Pb-Free LQFP

A67P8318E-3.5

6.0ns / 3.5ns

100L LQFP

A67P8318E-3.5F

6.0ns / 3.5ns

100L Pb-Free LQFP

A67P8318E-3.2

5.0ns / 3.2ns

100L LQFP

A67P8318E-3.2F

5.0ns / 3.2ns

100L Pb-Free LQFP

A67P8318E-2.8

4.4ns / 2.8ns

100L LQFP

A67P8318E-2.8F

4.4ns / 2.8ns

100L Pb-Free LQFP

A67P8318E-2.6

4.0ns / 2.6ns

100L LQFP

A67P8318E-2.6F

256K X 18

4.0ns / 2.6ns

100L Pb-Free LQFP

A67P7336E-4.2

7.5ns / 4.2ns

100L LQFP

A67P7336E-4.2F

7.5ns / 4.2ns

100L Pb-Free LQFP

A67P7336E-3.8

6.7ns / 3.8ns

100L LQFP

A67P7336E-3.8F

6.7ns / 3.8ns

100L Pb-Free LQFP

A67P7336E-3.5

6.0ns / 3.5ns

100L LQFP

A67P7336E-3.5F

6.0ns / 3.5ns

100L Pb-Free LQFP

A67P7336E-3.2

5.0ns / 3.2ns

100L LQFP

A67P7336E-3.2F

5.0ns / 3.2ns

100L Pb-Free LQFP

A67P7336E-2.8

4.4ns / 2.8ns

100L LQFP

A67P7336E-2.8F

4.4ns / 2.8ns

100L Pb-Free LQFP

A67P7336E-2.6

4.0ns / 2.6ns

100L LQFP

A67P7336E-2.6F

128K X 36

4.0ns / 2.6ns

100L Pb-Free LQFP

A67P8318/A67P7336

PRELIMINARY (March, 2006, Version 0.1)

AMIC Technology, Corp.

Package Information

LQFP 100L Outline Dimensions

unit: inches/mm

Symbol

Dimensions in inches

Dimensions in mm

Min.

Nom.

Max.

Min.

Nom.

Max.

0.002

0.006

0.05 - 0.15

0.053

0.055

0.057

1.35

1.40

1.45

b 0.009

0.012

0.015

0.22

0.30

0.38

c 0.004

0.008

0.09 - 0.20

0.866 BSC

22.00 BSC

0.787 BSC

20.00 BSC

0.630 BSC

16.00 BSC

0.551 BSC

14.00 BSC

0.026 BSC

0.65 BSC

L 0.018

0.024

0.030

0.45

0.60

0.75

0.039 REF

1.00 REF

y -

0.004

0.10

3.5

Notes:
1. Dimensions D and E do not include mold protrusion.
2. Dimensions b does not include dambar protrusion.

Total in excess of the b dimension at maximum material condition.

Dambar cannot be located on the lower radius of the foot.

100

D y

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: A67P7336E-2.6

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: A67P7336E-2.6