Dimensions
General Specifications
Chip Terminations
50
Alumina Terminations
Alumina Chip T
e
rminations
Features
DC - 6.0 GHz
10-40 Watts
Low Cost
Alumina Ceramic
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
4.8.3
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Available on Tape and Reel for Pick and Place Manufacturing.
Note: See table for dimensions.
PRELIMINAR
PRELIMINAR
Y
Y
PART NUMBER
WIDTH
LENGTH
THK.
A
RFP-060120A25X50
0.060
0.120
0.025
0.030
RFP-100200A25X50
0.100
0.200
0.025
0.030
RFP-250250A4X50
0.250
0.250
0.040
0.040
RFP-250375A4X50
0.250
0.375
0.040
0.040
RFP-375250A4X50
0.375
0.250
0.040
0.050
RFP-375375A4X50
0.375
0.375
0.040
0.050
Resistive Element:
Thick film
Substrate:
Alumina ceramic
Terminals:
Thick film silver
Resistance Value:
50 ohms, 2%
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +125C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches.
Specifications subject to change without notice.
Outline Drawing
Alumina Chip T
e
rminations
Alumina Terminations
4.8.4
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Suggested Mounting Procedures
BOARD HIGHER
THAN LEAD.
BOARD LOWER
THAN LEAD.
SCALE:
NOT RECOMMENDED APPLICATION
Available on Tape and Reel for Pick and Place Manufacturing.
Typical Performance
PRELIMINAR
PRELIMINAR
Y
Y
PART NUMBER
VALUE (OHM)
POWER (WATTS)
MAX VSWR
FREQ. (GHz)
RFP-060120A25X50
50
10
1.25:1
6.0
RFP-100200A25X50
50
20
1.25:1
6.0
RFP-250250A4X50
50
30
1.25:1
3.0
RFP-250375A4X50
50
40
1.25:1
3.0
RFP-375250A4X50
50
40
1.20:1
2.5
RFP-375375A4X50
50
40
1.20:1
2.5
Power Derating
100
125
100
75
50
25
50
0
25
HEAT SINK TEMPERATURE --
C
75
% OF RATED POWER
MIN.
SCALE:
WITH LEAD.
BOARD EVEN
.025
BOARD LOWER
THAN LEAD.
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder.
3. Solder leads in place using a 60/40 type solder with a
controlled temperature iron (700F).
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