Aluminum Nitride Terminations
25 Watts, 50
Model RFP-250375N4Z50-2
Outline Drawing
TAPE DETAIL
SCALE: NONE
DESPOOLING DIRECTION
R
F
P
.
3
9
0
3
4
.320
.070
.
6
0
0
.280
N
4
Z
X
X
X
2
5
0
3
7
5
.
3
9
0
.160
.
0
7
0
.080
.060
DIA.
ORIENTATION
DEVICE
.010
.058
.135
.250
.375
.060
.060
.058
.135
.040
RFP
N4ZXXX
250375
DENOTES LOCATION OF
RF PAD ON
BACKSIDE OF CHIP
SIDE VIEW
TOP VIEW
BACK VIEW
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE COATING
Aluminum Nitride SMD T
e
rminations
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Features
DC 3.0 GHz
25 Watts
Aluminum Nitride (AlN) Ceramic
Surface Mountable
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
Note: XXX denotes value.
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +125C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 2%
Frequency Range:
DC - 3.0 GHz
Power:
25 Watts
V.S.W.R.:
1.25:1
General Specifications
Resistive Element:
Thick film
Substrate:
Aluminum nitride ceramic
Terminals:
Tin/Lead, 90/10 over nickel
Available on Tape and Reel for Pick and Place Manufacturing.
VER. 12/5/01
Aluminum Nitride SMD T
e
rminations
Model RFP-250375N4Z50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
FILLED VIA
SOLDER
(2 PLS.)
SCREW
HEATSINK
PASTE
SOLDER
PC BOARD
TAPE DETAIL
SCALE: NONE
DESPOOLING DIRECTION
R
F
P
.
3
9
0
3
4
.320
.070
.
6
0
0
.280
N
4
Z
X
X
X
2
5
0
3
7
5
.
3
9
0
.160
.
0
7
0
.080
.060
DIA.
ORIENTATION
DEVICE
.010
P.C.B. SOLDER INTERFACE TEMPERATURE --
C
% OF RATED POWER
125
100
75
50
25
100
75
25
50
0
Available on Tape and Reel for Pick and Place Manufacturing.
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
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