General Specifications
Flangeless Terminations
30 Watts, 50
Model RFP-30-50T
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Cover:
Alumina ceramic
Lead(s):
99.99% pure silver (.005" thk)
Outline Drawing
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +150C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15" minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 5%
Frequency Range:
DC - 3.0 GHz
Input Power:
30 Watts
V.S.W.R.:
1.25:1
Flangeless T
e
rminations
Features
DC - 3.0 GHz
30 Watts
BeO Ceramic
Welded Silver Leads
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
VER. 12/5/01
Flangeless T
e
rminations
Model RFP-30-50T
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210C).
% OF RATED POWER
150
125
100
75
50
25
100
75
25
50
0
CASE TEMPERATURE -- C
.025
(2 PLACES)
MIN.
BOARD EVEN
WITH LEAD.
SCALE:
THAN LEAD.
BOARD LOWER
SUGGESTED STRESS RELIEF METHODS
SCALE:
BOARD LOWER
THAN LEAD.
NOT RECOMMENDED APPLICATION
THAN LEAD.
BOARD HIGHER
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