Flanged Terminations
50
Alumina Terminations
Outline Drawing
Alumina Flanged T
e
rminations
Features
DC - 6.0 GHz
20-40 Watts
Low Cost
Alumina Ceramic
Non-Nichrome Resistive
Element
100% Tested
4.8.9
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
General Specifications
Dimensions
Note: See table for dimensions.
PRELIMINAR
PRELIMINAR
Y
Y
PART NUMBERTYPE
A
B
C
D
E
F
G
H
RFP-20A50TV
HF
0.300 0.200 0.050 0.100 0.100 0.116 0.062 0.090
RFP-20A50TVR HF
0.300 0.200 0.050 0.100 0.100 0.116 0.062 0.090
RFP-30A50TP
HF
0.515 0.250 0.125 0.125 0.125 0.116 0.062 0.105
RFP-30A50TPR HF
0.515 0.250 0.125 0.125 0.125 0.116 0.062 0.105
RFP-30A50TPC HF
0.515 0.250 0.125 0.125 0.125 0.116 0.062 0.105
RFP-40A50TE
FF
0.870 0.375 0.250 0.560 0.187 0.161 0.062 0.105
RFP-40A50TBF FF
0.975 0.250 0.375 0.725 0.125 0.130 0.062 0.105
RFP-40A50TC
FF
0.975 0.375 0.375 0.725 0.187 0.130 0.110 0.168
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +125C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15" minimum.
Specifications subject to change without notice.
Resistive Element:
Thick film
Substrate:
Alumina ceramic
Mounting Flange:
Copper, nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005" thk)
Resistance Value:
50 ohm, 2%
Alumina Flanged T
e
rminations
Alumina Terminations
4.8.10
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Typical Performance
Suggested Mounting Procedures
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD.
THAN LEAD.
BOARD HIGHER
SCALE:
PRELIMINAR
PRELIMINAR
Y
Y
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to be
used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001" max. thickness).
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210C).
SCALE:
BOARD EVEN
WITH LEAD.
THAN LEAD.
BOARD LOWER
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
.025
MIN.
100
125
100
75
50
25
50
0
25
CASE TEMPERATURE --
C
75
% OF RATED POWER
PART NUMBER
VALUE (OHM)
POWER (WATTS)
MAX VSWR
FREQ. (GHz)
RFP-20A50TV
50 20
1.25:1
6.0
RFP-20A50TVR
50 20
1.25:1
6.0
RFP-30A50TP
50 30
1.25:1
3.0
RFP-30A50TPR
50 30
1.25:1
3.0
RFP-30A50TPC
50 30
1.25:1
3.0
RFP-40A50TE
50 40
1.25:1
3.0
RFP-40A50TBF
50 40
1.20:1
2.5
RFP-40A50TC
50 40
1.20:1
2.5
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