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Электронный компонент: RFP-30N50T

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Aluminum Nitride Terminations
30 Watts, 50
Model RFP-30N50T
Outline Drawing
.200
.042
.075
.100
.050
.050
N50
Aluminum Nitride Flangeless T
e
rminations
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Features
DC 4.0 GHz
30 Watts
Aluminum Nitride (AlN) Ceramic
Welded Silver Leads
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +150C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches. Lead
length 0.15" minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 5%
Frequency Range:
DC - 4.0 GHz
Power:
30 Watts
V.S.W.R.:
1.25:1
General Specifications
Resistive Element:
Thick film
Substrate:
Aluminum nitride ceramic
Cover:
Alumina ceramic
Lead(s):
99.99% pure silver (.005" thk)
VER. 12/5/01
Aluminum Nitride Flangeless T
e
rminations
Model RFP-30N50T
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
SCALE:
BOARD EVEN
WITH LEAD.
THAN LEAD.
BOARD LOWER
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
.025
MIN.
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an SN96 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (700F).
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD.
THAN LEAD.
BOARD HIGHER
SCALE:
CASE TEMPERATURE --
C
% OF RATED POWER
150
125
100
75
50
25
100
75
25
50
0