Aluminum Nitride Terminations
30 Watts, 50
Model RFP-375375N6Z50-2
Outline Drawing
.375
.375
.100
.175
.040
.040
.100
.175
.060
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE COATING
ZN
RFP
XXX
BOTTOM VIEW
SIDE VIEW
TOP VIEW
Aluminum Nitride SMD T
e
rminations
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Features
DC 2.0 GHz
30 Watts
Aluminum Nitride (AlN) Ceramic
Surface Mountable
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
Note: XXX denotes value.
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +125C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 2%
Frequency Range:
DC - 2.0 GHz
Power:
30 Watts
V.S.W.R.:
1.25:1
General Specifications
Resistive Element:
Thick film
Substrate:
Aluminum nitride ceramic
Terminals:
Tin/Lead, 90/10 over nickel
Available on Tape and Reel for Pick and Place Manufacturing.
VER. 12/5/01
Aluminum Nitride SMD T
e
rminations
Model RFP-375375N6Z50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
FILLED VIA
SOLDER
(2 PLS.)
SCREW
HEATSINK
PASTE
SOLDER
PC BOARD
TAPE DETAIL
SCALE: NONE
DESPOOLING DIRECTION
R
F
P
.
3
9
0
3
4
.320
.070
.
6
0
0
.280
N
4
Z
X
X
X
2
5
0
3
7
5
.
3
9
0
.160
.
0
7
0
.080
.060
DIA.
ORIENTATION
DEVICE
.010
P.C.B. SOLDER INTERFACE TEMPERATURE --
C
% OF RATED POWER
125
100
75
50
25
100
75
25
50
0
Available on Tape and Reel for Pick and Place Manufacturing.
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
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