General Specifications
Flanged Resistors
800 Watts, 100
Model RFP-800-100R
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Cover:
Alumina ceramic
Mounting Flange:
Copper, nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005" thk)
Outline Drawing
RFP
800-100R
.95
(4 PLACES)
.25
.45
(MAX)
.19
.125
.22
.15 MIN.
.250
.166 DIA. THRU.
.50
.27
1.04
1.00
1.65
1.90
Flanged Resistors
Features
DC - 250 MHz
800 Watts
BeO Ceramic
Welded Silver Leads
Non-Nichrome Resistive
Element
100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +150C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15" minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
100 ohms, 5%
Frequency Range:
DC - 250 MHz
Power:
800 Watts
Capacitance:
14 pF
RFP
800-100R
VER. 12/5/01
Flanged Resistors
Model RFP-800-100R
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
MIN.
.025
(2 PLACES)
SUGGESTED STRESS RELIEF METHODS
BOARD LOWER
THAN LEAD.
WITH LEAD.
BOARD EVEN
SCALE:
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to
be used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001" max. thickness).
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210C).
SCALE:
BOARD HIGHER
THAN LEAD.
THAN LEAD.
BOARD LOWER
NOT RECOMMENDED APPLICATION
CASE TEMPERATURE -- C
% OF RATED POWER
150
125
100
75
50
25
100
75
25
50
0
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