193
18
Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
T
J
, T
STG
Symbol
Typ
Max
R
JA
41
50
R
JC
2.1
3
A
mJ
Junction and Storage Temperature Range
T
C
=100C
Avalanche Current
C
W
A
P
D
C
50
25
-55 to 175
30
I
D
50
50
150
Pulsed Drain Current
C
Power Dissipation
B
T
C
=25C
45
Continuous Drain
Current
G
T
C
=25C
T
C
=100C
Repetitive avalanche energy L=0.1mH
C
Absolute Maximum Ratings T
A
=25C unless otherwise noted
V
V
20
Gate-Source Voltage
Drain-Source Voltage
25
Maximum
Units
Parameter
Maximum Junction-to-Case
B
Steady-State
C/W
Thermal Characteristics
Parameter
Units
Maximum Junction-to-Ambient
A
Steady-State
C/W
AOU456
N-Channel Enhancement Mode Field Effect Transistor
Features
V
DS
(V) = 25V
I
D
= 50A (V
GS
= 10V)
R
DS(ON)
<7 m
(V
GS
= 10V)
R
DS(ON)
<10 m
(V
GS
= 4.5V)
General Description
The AOU456 uses advanced trench technology and
design to provide excellent R
DS(ON)
with low gate
charge. This device is suitable for use in PWM, load
switching and general purpose applications. Standard
Product AOU456 is Pb-free (meets ROHS & Sony
259 specifications). AOU456L is a Green Product
ordering option. AOU456 and AOU456L are
electrically identical.
G
D
S
G D S
Top View
Drain Connected
to Tab
TO-251
Alpha & Omega Semiconductor, Ltd.
AOU456
Symbol
Min
Typ
Max
Units
BV
DSS
25
V
0.01
1
T
J
=55C
5
I
GSS
100
nA
V
GS(th)
1
1.74
3
V
I
D(ON)
100
A
5.5
7
T
J
=125C
8
8.5
10
g
FS
45
S
V
SD
0.74
1
V
I
S
50
A
C
iss
1850
2220
pF
C
oss
472
pF
C
rss
275
pF
R
g
0.86
1.2
Q
g
(10V)
31.7
38
nC
Q
g
(4.5V)
15.7
19
nC
Q
gs
5.8
nC
Q
gd
8.2
nC
t
D(on)
7.5
ns
t
r
14
ns
t
D(off)
30
ns
t
f
11.5
ns
t
rr
30.9
37
ns
Q
rr
20.3
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Charge I
F
=20A, dI/dt=100A/
s
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Turn-Off DelayTime
V
GS
=10V, V
DS
=12.5V,
R
L
=0.625
, R
GEN
=3
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=12.5V, I
D
=20A
Gate Source Charge
Gate Drain Charge
Total Gate Charge
m
Forward Transconductance
Diode Forward Voltage
Static Drain-Source On-Resistance
I
S
=1A, V
GS
=0V
V
DS
=5V, I
D
=20A
V
GS
=4.5V, I
D
=20A
R
DS(ON)
I
DSS
A
Gate Threshold Voltage
V
DS
=V
GS
,
I
D
=250
A
V
DS
=20V, V
GS
=0V
V
DS
=0V, V
GS
=20V
Zero Gate Voltage Drain Current
Gate-Body leakage current
Electrical Characteristics (T
J
=25C unless otherwise noted)
STATIC PARAMETERS
Parameter
Conditions
Body Diode Reverse Recovery Time
Drain-Source Breakdown Voltage
On state drain current
I
D
=250uA, V
GS
=0V
V
GS
=10V, V
DS
=5V
V
GS
=10V, I
D
=20A
Reverse Transfer Capacitance
I
F
=20A, dI/dt=100A/
s
V
GS
=0V, V
DS
=12.5V, f=1MHz
SWITCHING PARAMETERS
A: The value of R
JA
is measured with the device in a still air environment with T
A
=25C.
B. The power dissipation P
D
is based on T
J(MAX)
=175C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=175C.
D. The R
JA
is the sum of the thermal impedence from junction to case R
JC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300
s pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=175C.
G. The maximum current rating is limited by bond-wires. Rev1: August 2005
Alpha & Omega Semiconductor, Ltd.
AOU456
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
4.63
494
593
692
830
193
18
59
142
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
0
10
20
30
40
50
60
1
2
3
4
5
V
GS
(Volts)
Figure 2: Transfer Characteristics
I
D
(A)
2
4
6
8
10
0
10
20
30
40
50
60
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
R
DS(
O
N)
(m
)
0.00001
0.0001
0.001
0.01
0.1
1
10
100
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
(Volts)
Figure 6: Body-Diode Characteristics
I
S
(A)
25C
125C
0.8
1
1.2
1.4
1.6
1.8
0
25
50
75
100
125
150
175
Temperature (C)
Figure 4: On-Resistance vs. Junction Temperature
N
o
r
m
aliz
ed O
n
-R
esistance
V
GS
=10V, 20A
V
GS
=4.5V, 20A
4
6
8
10
12
3
4
5
6
7
8
9
10
V
GS
(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
R
DS(
O
N)
(m
)
25C
125C
V
DS
=5V
V
GS
=10V
I
D
=20A
25C
125C
0
20
40
60
80
100
0
1
2
3
4
5
V
DS
(Volts)
Fig 1: On-Region Characteristics
I
D
(A)
V
GS
=3.5
5V
4.0V
10V
6V
4.5V
V
GS
=4.5V
Alpha & Omega Semiconductor, Ltd.
AOU456
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
4.63
494
593
692
830
193
18
59
142
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
0
2
4
6
8
10
0
5
10
15
20
25
30
35
40
Q
g
(nC)
Figure 7: Gate-Charge Characteristics
V
GS
(Volts)
0
500
1000
1500
2000
2500
3000
0
5
10
15
20
25
V
DS
(Volts)
Figure 8: Capacitance Characteristics
C
a
pacitance (pF)
C
iss
0
40
80
120
160
200
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Case (Note F)
Pow
e
r (W)
0.01
0.1
1
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Z
JC
No
rm
aliz
ed
T
r
an
sien
t
T
h
e
rm
al Resist
an
ce
C
oss
C
rss
V
DS
=12.5V
I
D
=20A
Single Pulse
D=T
on
/T
T
J,PK
=T
C
+P
DM
.Z
JC
.R
JC
R
JC
=3C/W
T
on
T
P
D
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
T
J(Max)
=175C
T
A
=25C
0.1
1
10
100
1000
0.1
1
10
100
V
DS
(Volts)
I
D
(Am
p
s)
Figure 9: Maximum Forward Biased
Safe Operating Area (Note E)
10
s
100
s
1ms
DC
R
DS(ON)
limited
T
J(Max)
=175C, T
A
=25C
Alpha & Omega Semiconductor, Ltd.
AOU456
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
4.63
494
593
692
830
193
10
20
30
40
50
60
0.000001
0.00001
0.0001
0.001
Time in avalanche, t
A
(s)
Figure 12: Single Pulse Avalanche capability
I
D
(A
), P
e
ak A
valanche C
u
r
r
e
nt
0
10
20
30
40
50
60
0
25
50
75
100
125
150
175
T
CASE
(C)
Figure 13: Power De-rating (Note B)
P
o
w
e
r
D
i
ssipation (W)
0
10
20
30
40
50
60
0
25
50
75
100
125
150
175
T
CASE
(C)
Figure 14: Current De-rating (Note B)
Cu
rre
n
t
ra
ti
n
g
I
D
(A)
DD
D
A
V
BV
I
L
t
-
=
T
A
=25C
Alpha & Omega Semiconductor, Ltd.
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