APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
1
INTRODUCTION
The EK51 evaluation kit provides a fast and easy breadboard
solution for all devices in Apex's PSOP1 package (24 PIN PSOP).
The EK51 includes the EVAL43 board shown in Figure 1, as
well as the universal EVAL36 board. The combination of the
two boards provides a large area for breadboard circuit space
while also providing an effective method of thermal management
of the surface mount package. The device under evaluation is
surface mounted directly to the EVAL43 PC board which provides
a foil footprint area the size of the heat slug. This foil heat slug
connection area consists of plated through thermal vias. The
thermal vias offer a cost-effective way to decrease the thermal
resistance between one side of the PC board which allows for
the direct mounting of a heat sink or heat sink surface mount
fan on the back side of the PC board.
PARTS LIST
Part#
Description
Qty
EVAL36
Universal PC Board, Apex
1
EVAL43
PC Board, PSOP1, Apex
1
TSM-116-01-T-SV Terminal Strip, 16pin, Samtec
2
SSW-116-01-T-S
Socket Strip, 16pin, Samtec
2
OX7R105KWN
Cap, 200V, 1F, Ceramic
4
*ERJ-6GEYOR00V Res, 0.0, 0805SMD, Panasonic
4
*AVS336M2AG24T Cap, 100V, 33F, CDE
4
*031606
Heat Sink w/ Fan, 3.4C/W, AAVID 1
or
or
*031613
Heat Sink, 11.0C/W, AAVID
1
* Parts not supplied. Parts are application dependent. Sug-
gested part numbers are provided.
Figure 1: EVAL 43
ASSEMBLY
The PSOP1 should be assembled to the EVAL43 PC board
using surface mount processes. Solder paste may be dispensed
or screen-printed on the DUT pads as well as the foil heat slug
pad. The heat slug on the bottom surface of the PSOP1 pro-
vides maximum heat dissipation capabilities when soldered to
the PCB foil footprint area. However, for prototype purposes,
the tab can be thermally connected to the PCB foil area using
thermal grease.
If soldering the heat slug, ideally the PSOP1 should be soldered
to the PCB using a solder reflow furnace. If a reflow furnace is
not available, a heat plate capable of solder reflow temperatures
may be used. Otherwise, the leads may be carefully soldered
individually to the PCB with a thin tip soldering iron. However,
in this case, the use of thermal grease under the heat tab is
recommended instead of solder for thermal connection through
the thermal vias.
The kit comes with ceramic bypass capacitors, which should
be soldered on the space provided on the EVAL43 board.
Also, space is provided for the appropriate electrolytic by-pass
capacitors. Although these capacitors are not provided in the
kit, a recommended capacitor is listed for 100V applications.
For higher voltage applications, a larger electrolytic capacitor
can be mounted on the EVAL36 board.
The EVAL43 is a generic evaluation board for the PSOP1.
Jumpers are required to make appropriate connection to +Vs,
-Vs and ground. When applicable, surface mount 0805 0
resistors can be used in the locations provided.
Once all the surface mount components are installed, the
heat sink can then be mounted to the back of the PC board.
High thermal conductive grease should be used when mounting
the heat sink to the PC board. Note: A heat sink is not supplied
with the kit, but several options are listed which are produced
by AAVID Thermal Product, Inc.
Review Figure 2 on the next page for all other assemblies
needed to construct this evaluation kit.
BEFORE YOU GET STARTED
* All Apex amplifiers should be handled using proper ESD
precautions.
* Always provide the appropriate heat sinking.
* Always use adequate power supply bypass capacitors.
* Do not change connections while the circuit is powered.
* Initially set all power supplies to the minimum operating levels
allowed in the device data sheet.
* Check for oscillations.
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