INTRODUCTION
Fast and easy breadboarding of circuits using the PA60DK
is possible with the EK54 evaluation kit. The EK54 includes
both the universal EVAL36 board and the EVAL46 substrate.
The use of EVAL36 and EVAL46 allows for a large area of
breadboarding space to work with while allowing a surface
mount substrate for the PA60DK. The PA60DK amplifier may be
surface mounted directly to the EVAL46, a thermally conductive
but electrically isolated substrate. The PA60DK is soldered to
a DUT foil footprint area the size of the heatslug as shown in
Figure 1. The metal substrate is cost effective and can allow
the PA60DK to dissipate power up to the datasheet rating.
Part#
Description
Quantity
EVAL36
Universal PC Board
1
EVAL46
Evaluation substrate, PA60DK
1
TSM-116-01-T-SV Terminal Strip, 16 PIN
2
SSW-116-01-T-S Socket Strip, 16 PIN
2
PCE2055CT-ND
CAP, 47uF, 50V
2
OX7R105KWN
Cap, 200V, 1uF, Ceramic
2
*031606
5V, 10mA, 3.4C/W
heatsink with fan, AAVID
1
* Parts are not supplied. Parts are application dependant.
Suggested part numbers are provided.
Figure 1
BEFORE YOU GET STARTED
All Apex amplifiers should be handled using ESD precau-
tion.
Review the Apex product datasheet and operating condi-
tions.
Always provide the appropriate heat sinking. Power dis-
sipation must be considered to ensure maximum junction
temperature (T
J
) is not exceeded.
Always use adequate power supply bypass capacitors, Apex
recommends at least 10F per amp of output current.
Do not change connections while the circuit is powered
In case -Vs is disconnected before +Vs, a diode between
-Vs and ground is recommended to avoid damage.
Initially set all power supplies to the minimum operating
levels allowed in the product datasheet.
Check for oscillations up to and above the unity gain band-
width of the amplifier.
ASSEMBLY
The PA60DK is a surface mount device and should be
assembled to the EVAL46 substrate using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat slug on the back of the PA60DK
provides maximum heat dissipation capabilities when soldered
to the foil footprint area. The PA60DK should be reflowed
to the substrate using a solder reflow furnace. If this is not
available, a heat plate capable of solder reflow temperatures
may be used.
Once the amplifier is mounted on the
top of the substrate, the heat sink fan or
selected heat sink can then be mounted
to the back of the substrate. A heat sink
is not supplied with the kit, but several
options are available through AAVID
Thermal Product, Inc. High thermal con-
ductive thermal grease should be used
when mounting the heat sink fan or heat
sink to the evaluation board.
Review Figure 2 on next page for other
possible assembly methods to construct
this evaluation kit.
APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
1
Figure 2
APEX MICROTECHNOLOGY CORPORATION 5980 NORTH SHANNON ROAD TUCSON, ARIZONA 85741 USA APPLICATIONS HOTLINE: 1 (800) 546-2739
2
EVALUATION KIT FOR
PA60DK
EK54
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
EK54U REV A JUNE 2003 2003 Apex Microtechnology Corp.
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