AT89C51RD2 / AT89C51ED2 QualPack
2 Rev. 0 2003 July
1 Table of contents
1
TABLE OF CONTENTS............................................................................................................................................. 2
2
GENERAL INFORMATION...................................................................................................................................... 3
3
TECHNOLOGY INFORMATION ............................................................................................................................ 4
3.1
W
AFER
P
ROCESS
T
ECHNOLOGY
.............................................................................................................................. 4
3.2
P
RODUCT
D
ESIGN
................................................................................................................................................... 5
3.3
D
EVICE CROSS SECTION
.......................................................................................................................................... 6
4
QUALIFICATION ...................................................................................................................................................... 7
4.1
Q
UALIFICATION
M
ETHODOLOGY
............................................................................................................................ 7
4.2
Q
UALIFICATION
T
EST
M
ETHODS
............................................................................................................................. 8
4.3
W
AFER
L
EVEL
R
ELIABILITY
................................................................................................................................... 9
4.3.1
Electromigration ............................................................................................................................................... 9
4.3.2
Hot Carriers Injection ..................................................................................................................................... 11
4.3.3
Time Dependent Dielectric Breakdown ............................................................................................................ 12
4.3.4
FLASH Characteristics.................................................................................................................................... 14
4.4
D
EVICE
R
ELIABILITY
............................................................................................................................................ 18
4.4.1
Operating Life Testing..................................................................................................................................... 18
4.4.2
ESD / Latch-up................................................................................................................................................ 18
4.4.3
FLASH and EEPROM Data Retention and Endurance Cycling ........................................................................ 18
4.4.4
AT89C51ED2 Operating Reliability Calculation.............................................................................................. 20
4.5
AT89C51ED2 P
ACKAGING RELIABILITY
............................................................................................................... 21
4.6
AT89C51ED2 Q
UALIFICATION STATUS
................................................................................................................ 21
5
ENVIRONMENTAL INFORMATION .................................................................................................................... 22
6
OTHER DATA .......................................................................................................................................................... 23
6.1
ISO / TS16949 : 2002 C
ERTIFICATE
..................................................................................................................... 23
6.2
D
ATA
B
OOK
R
EFERENCE
...................................................................................................................................... 24
6.3
R
EVISION
H
ISTORY
.............................................................................................................................................. 24
AT89C51RD2 / AT89C51ED2 QualPack
Rev. 0 2003 July
3
2 General Information
Product Name:
AT89C51RD2
Function:
8-bit Microcontroller with 64 Kbytes FLASH
SPI Interface
Product Name:
AT89C51E2
Function:
8-bit Microcontroller with 64 Kbytes FLASH, 2 Kbytes EEPROM
SPI Interface
Wafer Process:
Logic CMOS 0.35 um with embedded FLASH
Available Package Types
PLCC 44, VQFP 44, PLCC 68, VQFP 68 ,PDIL 40
Other Forms:
Die, Wafer
Locations:
Process Development,
Atmel Colorado Springs, USA
Product Development
Atmel Nantes, France
Wafer Plant
Atmel Colorado Springs, USA
QC Responsibility
Atmel Nantes, France
Probe Test
Atmel Colorado Springs, USA
Assembly
Depending on package
Final Test
Atmel TSTI Manila, Philippines
Lot Release
Atmel Nantes, France
Shipment Control
Global Logistic Center, Philippines
Quality Assurance
Atmel Nantes, France
Reliability Testing
Atmel Nantes, France
Failure Analysis
Atmel Nantes, France
Quality Management
Atmel Nantes, France
Signed: Pascal LECUYER
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