1
Features
Sensitive Layer Over a 0.8 m CMOS Array
Image Zone: 0.4 x 14 mm = 0.02" x 0.55"
Image Array: 8 x 280 = 2240 pixels
Pixel Pitch: 50 m x 50 m = 500 dpi
Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second
Die Size: 1.7 x 17.3 mm
Operating Voltage: 3V to 5.5V
Naturally Protected Against ESD: > 16 kV Air Discharge
Power Consumption: 20 mW at 3.3V, 1 MHz, 25C
Operating Temperature Range: 0C to +70C: C suffix
Resistant to Abrasion: >1 Million Finger Sweeps
Chip-On-Board (COB) package or 20-lead Ceramic DIP available for development, with
Specific Protective Layer
Applications
PDA (Access Control, Data Protection)
Cellular Phones, SmartPhone (Access e-business)
Notebook, PC-add on (Access Control, e-business)
PIN Code Replacement
Automated Teller Machine, POS
Building Access
Electronic Keys (Cars, Home,...)
Portable Fingerprint Imaging for Law Enforcement
TV Access
Figure 1. Fingerchip Packages
20-pin, 0.3" Dual-Inline
Ceramic Package
(DIP20)
Step for easy
integration
Sensing area
Wire protection
(not drawn)
Chip-on-Board Package
(COB)
Thermal
Fingerprint
Sensor with
0.4 mm x 14 mm
(0.02" x 0.55")
Sensing Area
and
Digital Output
(On-chip ADC)
FCD4B14
FingerChip
TM
Rev. 1962C01/02
2
FCD4B14
1962C01/02
Die Attach is connected to pin 1 and 16, and must be grounded. FPL pin must be
grounded.
Table 1. Pin Description For DIP Ceramic Package
Pin Number
Name
Type
1
GND
GND
2
AVE
Analog output
3
TPP
Power
4
VCC
Power
5
RST
Digital input
6
OE
Digital input
7
De0
Digital output
8
De1
Digital output
9
De2
Digital output
10
De3
Digital output
11
FPL
GND
12
Do3
Digital output
13
Do2
Digital output
14
Do1
Digital output
15
Do0
Digital output
16
GND
GND
17
ACKN
Digital output
18
PCLK
Digital input
19
TPE
Digital input
20
AVO
Analog output
GND
2
3
4
5
6
7
8
9
AVO
TPE
PCLK
ACKN
Do0
Do1
Do2
Do3
FPL
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
AVE
TPP
VCC
RST
OE
De0
De1
De2
De3
GND
3
FCD4B14
1962C01/02
Die Attach is connected to pin 1, 7 and 21, and must be grounded. FPL pin must be
grounded.
Table 2. Pin Description For Chip-On-Board Package
Pin Number
Name
Type
1
GND
GND
2
AVE
Analog output
3
AVO
Analog output
4
TPP
Power
5
TPE
Digital input
6
VCC
Power
7
GND
GND
8
RST
Digital input
9
PCLK
Digital input
10
OE
Digital input
11
ACKN
Digital output
12
De0
Digital output
13
Do0
Digital output
14
De1
Digital output
15
Do1
Digital output
16
De2
Digital output
17
Do2
Digital output
18
De3
Digital output
19
Do3
Digital output
20
FPL
GND
21
GND
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
GND
AVE
AVO
TPP
TPE
VCC
GND
RST
PCLK
OE
ACKN
De0
Do0
De1
Do1
De2
Do2
De3
Do3
FPL
GND
4
FCD4B14
1962C01/02
Description
FCD4B14 is part of the FingerChip Atmel monolithic fingerprint sensor family for which
no optics, no prism and no light source are required.
FCD4B14 is a single chip, high performance, low cost sensor based on temperature
physical effects for fingerprint sensing.
FCD4B14 has a linear shape, allowing for the capture of a fingerprint image by sweep-
ing the finger across the sensing area. After capturing several images, Atmel proprietary
software can reconstruct a full 8-bit fingerprint image, if needed.
FCD4B14 has a small surface combined with CMOS technology, and a Chip-On-Board
or ceramic dual-in-line package assembly. These facts contribute to a low-cost device.
FCD4B14 delivers a programmable number of images per second, while an integrated
Analog to Digital Converter delivers a digital signal adapted to interfaces such as an
EPP parallel port, USB microcontroller or directly to micro-processors. Thus, no frame
grabber or glue interface is necessary to send the frames. These facts make FCD4B14
an easy device to include in any system for identification or verification applications.
Note:
1. Absolute maximum ratings are limiting values, to be applied individually, while other parameters are within specified operat-
ing conditions. Long exposure to maximum ratings may affect device reliability.
Table 3. Absolute Maximum Ratings
(1)
Parameter
Symbol
Comments
Value
Unit
Positive supply voltage
V
CC
GND to 6.5
V
Temperature stabilization power
TPP
GND to 6.5
V
Front plane
FPL
GND to V
CC
V
Digital input voltage
RST PCLK
GND to V
CC
V
Storage temperature
T
stg
-50 to +85
C
Lead temperature (soldering, 10 seconds.)
T
leads
Do not solder
DIP: socket mandatory
Forbidden
C
Table 4. Recommended Conditions Of Use
Parameter
Symbol
Comments
Min
Typ
Max
Unit
Positive supply voltage
V
CC
3V
5V
5.5V
V
Front plane
FPL
Must be grounded
GND
V
Digital input voltage
CMOS levels
V
Digital output voltage
CMOS levels
V
Digital load
C
L
50
pF
Analog load
C
A
R
A
Not connected
pF
k
Operating temperature range
T
amb
Civil: "C" grade
0 to +70
C
Maximum current on TPP
ITPP
0
100
mA
5
FCD4B14
1962C01/02
Table 5. Resistance
Parameter
Min Value
Standard Method
ESD
On pins. HBM (Human Body Model) CMOS I/O
2 kV
MIL-STD-883- method 3015.7
On die surface (Zapgun)
Air discharge
16 kV
NF EN 6100-4-2
MECHANICAL ABRASION
Number of cycles without lubricant multiply by a
factor of 20 for correlation with a real finger
200 000
MIL E 12397B
CHEMICAL RESISTANCE
Cleaning agent, acid, grease, alcohol, diluted
acetone
4 hours
Internal method
Table 6. Specifications
Explanation Of Test Levels
I
100% production tested at +25C
II
100% production tested at +25C, and sample tested at specified temperatures (AC testing done on sample)
III
Sample tested only
IV
Parameter is guaranteed by design and/or characterization testing
V
Parameter is a typical value only
VI
100% production tested at temperature extremes
D
100% probe tested on wafer at T
amb
= +25C
Parameter
Symbol
Test Level
Min
Typ
Max
Unit
Resolution
IV
50
micron
Size
IV
8x280
pixel
Yield: number of bad pixels
I
15
bad pixels
Equivalent resistance on TPP pin
I
23
30
47
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