defining a degree of excellence
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
Specifications subject to change without notice.
S553-2793-03
1100
-0.8 -1.0
-1.8
N/A
-16
-9
-30 -30
-20
-50
-50
-40
A
1
S556-5999-51
1100
-0.8 -1.0
-1.8
-10
-16
-9
-30 -30
-20
-50
-50
-40
B
2
MECHANICALS
SCHEMATICS
960037A
Designed for use with Microlinear ML6680 Token Ring
to Fiber chipset
Available with additional differential filtering
Robust surface mount packaging, rated for 225C peak
IR reflow temperature
100 ohms UTP output impedance
2000 Vrms isolation
TOKEN RING/FIBER APPLICATION
FILTER MODULE
A
B
1
2
ELECTRICALS AT 25C
OCL
Insertion Loss
Attenuation
Return Loss
Common to Common
Crosstalk
(H)
(dB Max)
(dB) Min
(dB) Min
Mode Rej (dB) Typ
(dB) Min
Package
Part No.
Min
8MHz 16MHz 24MHz
30MHz
1-17MHz 17-25MHz
5MHz 20MHz 200MHz
5MHz 16MHz 24MHz
Schematic
Style
defining a degree of excellence
Corporate Office
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302-4496
Tel: 201-432-0463
Fax: 201-432-9542
E-Mail: BelFuse@belfuse.com
Internet: http://www.belfuse.com
Far East Office
Bel Fuse Ltd.
8F/8 Luk Hop Street
San Po Kong
Kowloon, Hong Kong
Tel: 852-2328-5515
Fax: 852-2352-3706
European Office
Bel Fuse Europe Ltd.
Preston Technology Management Centre
Marsh Lane, Preston PR1 8UD
Lancashire, U.K.
Tel: 44-1772-556601
Fax: 44-1772-888366
960037A
APPLICATION NOTES
APPLICATION CIRCUIT
TOKEN RING/FIBER APPLICATION
FILTER MODULE
Bel has developed a series of transformer modules for Microlinear's Token Ring to Fiber conversion chipsets. Each
module includes 400 ohm transmit and 100 ohm impedance matched, high voltage isolation transformers, in addition
to EMI and noise suppression common mode chokes.
Optional filtering available to suppress unwanted noise in the differential signal above 30MHz.
Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on
tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility with
high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is
optically inspected to meet rigid coplanarity requirements.
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