defining a degree of excellence
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
Specifications subject to change without notice.
S556-5999-01
1CT:1CT
1CT:0.816CT
616
-16
-9
-0.5
-0.8
-1.1 -1.9
-35
-35
-20
1 5 0 1 5 0 1 0 0
MECHANICAL
SCHEMATIC
960042B
Designed for use with multiple Token Ring transceivers,
including Texas Instruments C380C30/C60
IEEE 802.5 compliant
For use with external on silicon integrated filtering
TOKEN RING NETWORKING
COMPONENTS
Low profile, miniature surface mount packaging
Cost efficient design approach
STP/UTP compatible impedances
Rated to meet 225C peak IR reflow temperature
ELECTRICALS AT 25C
Turns Ratio
OCL
Return Loss
Insertion Loss
Common to Common
1-2-8 to 1-2-8 to
(H) Min
(dB) Min
(dB Max)
Mode Rej (dB) Min
Ouput Impedance
Part No.
16-15-13-12 10-15-13-9
1-8
1-17MHz 17-25MHz
4MHz 8MHz 16MHz 24MHz
5MHz 20MHz 200MHz
1-3 16-12 10-9
defining a degree of excellence
Corporate Office
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302-4496
Tel: 201-432-0463
Fax: 201-432-9542
E-Mail: BelFuse@belfuse.com
Internet: http://www.belfuse.com
Far East Office
Bel Fuse Ltd.
8F/8 Luk Hop Street
San Po Kong
Kowloon, Hong Kong
Tel: 852-2328-5515
Fax: 852-2352-3706
European Office
Bel Fuse Europe Ltd.
Preston Technology Management Centre
Marsh Lane, Preston PR1 8UD
Lancashire, U.K.
Tel: 44-1772-556601
Fax: 44-1772-888366
960042B
APPLICATION NOTES
APPLICATION CIRCUIT
TOKEN RING NETWORKING
COMPONENTS
Bel has developed this product for use with token ring 4/16 Mbps transceivers in 150 ohm STP and 100 ohm UTP
media applications; however, both the 150 ohm and 100 ohm connections cannot be simultaneous. The Bel module
provides isolation and impedance matching transformers plus common mode choke for either a transmit or receive
channel. External filtering is required.
Suppression of board induced noise can be achieved with precision layout instructions, along with careful consideration
of the selection and placement of discrete components for the interface circuit.
Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on
tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility
with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each
part is optically inspected to meet rigid coplanarity requirements.
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