defining a degree of excellence
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
Specifications subject to change without notice.
S558-0139-00
-1.0
-16
16-20log((f/30MHz)
-10
A
S558-3855-00
-1.0
-16
16-20log((f/30MHz)
-10
B
S558-5999-02
-1.0
-16
16-20log((f/30MHz)
-10
A
S558-5999-19
-1.0
-16
16-20log((f/30MHz)
-10
B
MECHANICAL
SCHEMATICS
960025A
A
B
For use in 100Base-TX, 10/100Base-TX, ATM 155 or
100 Mbps TP-FDDI applications
Compatible with multiple PHY transceivers
350 H min OCL (inductance) with 8mA DC bias
Low profile, surface mount packaging available
Low cost, transmit or receive channel solution
2000 Vrms isolation
HIGH SPEED LAN MAGNETICS
ELECTRICALS AT 25C
Insertion Loss
Return Loss
(dB) Typ
(dB) Min
Part No.
1MHz-100MHz
1MHz-30MHz 30MHz-60MHz 60MHz-80MHz
Schematic
defining a degree of excellence
Corporate Office
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302-4496
Tel: 201-432-0463
Fax: 201-432-9542
E-Mail: BelFuse@belfuse.com
Internet: http://www.belfuse.com
Far East Office
Bel Fuse Ltd.
8F/8 Luk Hop Street
San Po Kong
Kowloon, Hong Kong
Tel: 852-2328-5515
Fax: 852-2352-3706
European Office
Bel Fuse Europe Ltd.
Preston Technology Management Centre
Marsh Lane, Preston PR1 8UD
Lancashire, U.K.
Tel: 44-1772-556601
Fax: 44-1772-888366
960025A
APPLICATION NOTES
APPLICATION CIRCUIT
HIGH SPEED LAN MAGNETICS
These Bel part types have been designed for use in 100 Mbps TP-FDDI, 100Base-TX, 10/100Base-TX and ATM
155 Mbps applications over Category 5 UTP or STP cable.
Each Bel part type is designed with high voltage isolation transformers and common mode chokes and can be
used on both the transmit and receive channels. The designs have been created to provide 350H OCL with 8mA
DC bias applied. Consult the Bel short form catalog and applicable application circuit for the specific configuration
of each individual part type.
Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped
on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility
with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability.
Each part is optically inspected to meet rigid coplanarity requirements.
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