Data
sheet
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Thinking RF solutions
5 BIT Digital Attenuator
DC - 16GHz
The P35-4307-000-200 is a high performance broadband
Gallium Arsenide monolithic 5 bit digital attenuator offering
an attenuation range of 15.5dB in 0.5dB steps. It is suitable
for use in broadband communications, instrumentation and
electronic warfare applications. The attenuator is controlled
by the application of complimentary 0V/-5V or 0/-8V signals
to the control lines in accordance with the truth tables
below. The full attenuation range is achieved by modifying
the control lines in combination.
The die is fabricated using Bookham Technology's 0.5m
gate length MESFET process (S20). It is fully protected using
Silicon Nitride passivation for excellent performance and
reliability.
Features
Broadband DC - 16GHz
Low insertion loss; 3dB typ at
8GHz
Attenuation 0.5dB steps to
15.5dB
Fast switching speed
Through GaAs vias for
improved performance
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Thinking RF solutions
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Notes
1. Insertion Loss measured in low loss state.
2. Return Loss measured in low loss switch state
Parameter Conditions
Min
Typ
Max
Units
Insertion Loss
1
50MHz - 8GHz
-
3
3.5
dB
(reference state)
8GHz - 16GHz
-
4
4.5
dB
Attenuation Range
50MHz - 16GHz
-
15.5
-
dB
Step Size
50MHz - 16GHz
-
0.5
-
dB
Attenuation Accuracy
50MHz - 8GHz
-
-
0.2 3%
dB
8GHz - 16GHz
-
-
0.310%
dB
Input Return Loss
2
50MHz - 16GHz
12
20
-
dB
Output Return Loss
2
50MHz - 16GHz
15
25
-
dB
Switching Speed
50% Control to1 0% or 90%RF
-
5
10
nS
Electrical Performance
Ambient temperature = 223C , Zo = 50
, Control voltages = 0V/-5V unless otherwise stated
Schematic
P35-4307-000-200
Absolute Maximum Ratings
Max control voltage
-8V
Max I/P power
+25 dBm
Operating temperature
-60C to +125C
Storage temperature
-65C to +150C
Attenuation - cardinal states
Nominal Attenuation
reference states
Attenuation - all states
Truth Table
Chip Outline
Chip size:
2.05 x 1.37 mm
Bond pad size: 120m x 120m
Chip thickness: 200m
Pad Details
Control Line
Attenuation
0.5dB bit
1dB bit
2dB bit
4dB bit
8dB bit
A1
B1 A2
B2 A3 B3 A4 B4 A5
B5
0V
-5V 0V
-5V
0V -5V
0V -5V
0V
-5V
Reference
-5V
0V
0V
-5V
0V -5V
0V -5V
0V
-5V
+0.5dB
0V
-5V -5V
0V 0V -5V
0V -5V
0V
-5V
+1dB
0V -5V 0V -5V -5V 0V 0V -5V 0V -5V
+2dB
0V -5V
0V -5V 0V -5V -5V 0V 0V -5V
+4dB
0V
-5V 0V
-5V
0V -5V
0V -5V
-5V
0V
+8dB
Pad
Function
1 RF
Input
2 B1
3 A1
4 B2
5 A2
6 B3
7 A3
8 RF
Input
9 A4
10 B4
11 A5
12 B5
P35-4307-000-200
Thinking RF solutions
www.bookham.com
Handling, Mounting and Bonding Instructions
The back of the die is gold metallized and can be die-attached manually onto
gold, eutectically with Au-Sn (80:20) or with low temperature conductive epoxy.
The maximum allowable die temperature is 310C for 2 minutes. Bonds should
be made onto the exposed gold pads with 17 or 25 microns pure gold or half-
hard gold wire. Bonding should be achieved with the die face at 225C to 275C
with a heated thermosonic wedge (approx. 125C) and a maximum force of 60
grams. Ball bonds may be used but care must be taken to ensure the ball size is
compatible with the bonding pads shown. The length of the bond wires should
be minimised to reduce parasitic inductance, particularly those to the RF and
ground pads.
Ordering Information
P35-4307-000-200
MMICS
Bookham Technology plc
Caswell
Towcester
Northamptonshire
NN12 8EQ
UK
Tel: +44 (0) 1327 356 789
Fax: +44 (0) 1327 356 698
rfsales@bookham.com
Important Notice
Bookham Technology has a policy of
continuous improvement. As a result
certain parameters detailed on this flyer
may be subject to change without notice.
If you are interested in a particular product
please request the product specification
sheet, available from any RF sales
representative.
P35-4307-000-200
www.bookham.com
462/SM/01303/200 Issue 1/2
Bookham Technology 2003 Bookham is a registered trademark of Bookham Technology plc
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