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Электронный компонент: TISPPBL2SDR

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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
P R O D U C T I N F O R M A T I O N
1
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
OVERVOLTAGE PROTECTION FOR ERICSSON COMPONENTS LINE INTERFACE CIRCUITS
q
Overvoltage Protector for:-
PBL 3762A
PBL 3764A/4, PBL 3764A/6
PBL 3766, PBL 3766/6
PBL 3767, PBL 3767/6
PBL 3796, PBL 3796/2
PBL 3798, PBL 3798/2
PBL 3798/5
PBL 3798/6
PBL 3799
PBL 3860A/1, PBL 3860A/6
PBL 386 10/2
PBL 386 11/2
PBL 386 20/1
PBL 386 21/1
PBL 386 30/1
PBL 386 40/1
PBL 386 50/1
PBL 3898/M
q
Rated for International Surge Wave Shapes
q
Single-Lead Line Connection Version of
Feed-Through TISPPBL2D
- Ground Lead Creepage Distance . . > 3 mm
WAVE SHAPE
STANDARD
I
TSP
A
2/10 s
GR-1089-CORE
100
1.2/50 s
ITU-T K22
100
0.5/700 s
I3124
40
10/700 s
ITU-T K20, K21
40
10/1000 s
GR-1089-CORE
30
q
Small Outline Surface Mount Package
- Available Ordering Options
CARRIER
ORDER #
Tube
TISPPBL2SD
Taped and reeled
TISPPBL2SDR
description
The TISPPBL2S is a dual forward-conducting buffered p-gate overvoltage protector. It is designed to protect
the Ericsson Components PBL 3xxx family of SLICs (Subscriber Line Interface Circuits) against overvoltages
on the telephone line caused by lightning, a.c. power contact and induction. The TISPPBL2S limits voltages
that exceed the SLIC supply rail levels.
The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage in the region of
-10 V to -85 V. The protector gate is connected to this negative supply. This references the protection
(clipping) voltage to the negative supply voltage. As the protection voltage will track the negative supply
voltage the overvoltage stress on the SLIC is minimised.
Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially
clipped close to the SLIC negative supply rail value. If sufficient current is available from the overvoltage, then
the protector will crowbar into a low voltage ground referenced on-state condition. As the overvoltage
device symbol
K1
K2
A
A
G1,G2
Terminals K1, K2 and A correspond to the alternative
line designators of T, R and G or A, B and C. The
negative protection voltage is controlled by the
voltage, V
GG,
applied to the G terminal.
SD6XAP
MD6XBA
D PACKAGE
(TOP VIEW)
NC - No internal connection
Terminal typical application names shown in
parenthesis
1
2
3
4
5
6
7
8
A
A
G
K1
K2
NC
(Ground)
(Ground)
(Gate)
(Tip)
(Ring)
NC
NC
Customers are advised to obtain the latest version of the relevant Ericsson Components SLIC information to verify, before placing orders, that
the information being relied on is current.
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
2
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
subsides the high holding current of the crowbar prevents d.c. latchup. The TISPPBL2S buffered gate design
reduces the loading on the SLIC supply during overvoltages caused by power cross and induction.
These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high
reliability and in normal system operation they are virtually transparent. The TISPPBL2S is the TISPPBL2D
with a different pinout. The feed-through Ring (leads 4 -- 5) and Tip (leads 1 -- 8) connections have been
replaced by single Ring (lead 4) and Tip (lead 1) connections. This increases package creepage distance of
the biased to ground connections from about 0.7 mm to over 3 mm.
NOTES: 1. Initially the protector must be in thermal equilibrium with -40 C
T
J
85 C. The surge may be repeated after the device returns to
its initial conditions.
2. These non-repetitive rated currents are peak values for either polarirty. The rated current values may be applied either to the Ring
to Ground or to the Tip to Ground terminal pairs. Additionally, both terminal pairs may have their rated current values applied
simultaneously (in this case the Ground terminal current will be twice the rated current value of an individual terminal pair). Above
85 C, derate linearly to zero at 150 C lead temperature.
absolute maximum ratings
RATING
SYMBOL
VALUE
UNIT
Repetitive peak off-state voltage, I
G
= 0, -40C
T
J
85C
V
DRM
-100
V
Repetitive peak gate-cathode voltage, V
KA
= 0, -40C
T
J
85C
V
GKRM
-90
V
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
I
TSP
A
10/1000 s (Bellcore GR-1089-CORE, Issue 1, November 1994, Section 4)
30
0.2/310 s (I3124, open-circuit voltage wave shape 0.5/700 s)
5/310 s (ITU-T K20 & K21, open-circuit voltage wave shape 10/700 s)
1/20 s (ITU-T K22, open-circuit voltage wave shape 1.2/50 s)
40
40
100
2/10 s (Bellcore GR-1089-CORE, Issue 1, November 1994, Section 4)
100
Non-repetitive peak on-state current, 50/60 Hz (see Notes 1 and 2)
I
TSM
A
100 ms
11
1 s
5 s
300 s
900 s
4.5
2.4
0.95
0.93
Non-repetitive peak gate current, 1/2 s pulse, cathodes commoned (see Note 1)
I
GSM
40
A
Operating free-air temperature range
T
A
-40 to +85
C
Junction temperature
T
J
-40 to +150
C
Storage temperature range
T
stg
-40 to +150
C
recommended operating conditions
MIN
TYP
MAX
UNIT
C
G
Gate decoupling capacitor
100
220
nF
R
1
TISPPBL2S series resistor for GR-1089-CORE first-level and second-level surge survival
TISPPBL2S series resistor for GR-1089-CORE first-level surge survival
TISPPBL2S series resistor for ITU-T recommendation K20/21
40
25
10
electrical characteristics, T
amb
= 25 C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
I
D
Off-state current
V
D
= V
DRM
, V
GK
= 0
T
J
= -40 C
-5
A
T
J
= 85 C
-50
A
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
3
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
V
(BO)
Breakover voltage
I
T
= -20 A, 0.5/700 generator, Figure 3 test circuit (See Note 3 and
Figure 2)
-70
V
t
(BR)
Breakdown time
I
T
= -20 A, 0.5/700 generator, Figure 3 test cir-
cuit (See Note 3 and Figure 2)
V
(BR)
< -50 V
1
s
V
F
Forward voltage
I
F
= 5 A, t
w
= 500 s
3
V
V
FRM
Peak forward recovery
voltage
I
F
= 20 A, 0.5/700 generator, Figure 3 test circuit (See Note 4 and Fig-
ure 2)
8
V
t
FR
Forward recovery time
I
F
= 20 A, 0.5/700 generator, Figure 3 test cir-
cuit (See Note 4 and Figure 2)
V
F
> 5 V
V
F
> 1 V
1
10000
s
I
H
Holding current
I
T
= -1 A, di/dt = 1A/ms, V
GG
= -50 V, -40 C
T
J
85 C
-150
mA
I
GAS
Gate reverse current
V
GG
= V
GKRM
, V
AK
= 0
T
J
= -40 C
-5
A
T
J
= 85 C
-50
A
I
GAT
Gate reverse current,
on state
I
T
= -0.5 A, t
w
= 500 s, V
GG
= -50 V
-1
mA
I
GAF
Gate reverse current,
forward conducting
state
I
F
= 1 A, t
w
= 500 s, V
GG
= -50 V
-10
mA
I
GT
Gate trigger current
I
T
= -5 A, t
p(g)
20 s, V
GG
= -50 V
5
mA
V
GT
Gate trigger voltage
I
T
= -5 A, t
p(g)
20 s, V
GG
= -50 V
2.5
V
C
AK
Anode-cathode off-
state capacitance
f = 1 MHz, V
d
= 1 V, I
G
= 0, (see Note 5)
V
D
= -3 V
110
pF
V
D
= -50 V
60
pF
NOTES: 3. For the required TIPX and RINGX terminal negative pulse performance refer to the respective Ericsson Components SLIC data
sheet. The PBL 379x family of SLICs has ratings of -120 V for 0.25 s, -90 V for 1 s, -70 V for 10 ms and -70 V for d.c. The PBL
376x family together with the PBL 3860A SLIC have the same maximum ratings when the applied battery voltage is -50 V. As the
FLEXI-SLICTM PBL 386 xx family is specified in terms of current pulses, a minimum value of 2
for R
P
should be used.
Compliance to these conditions is guaranteed by the maximum breakover voltage and the breakdown times of the TISPPBL2S.
4. For the required TIPX and RINGX terminal positive pulse performance refer to the respective Ericsson Components SLIC data
sheet. The PBL 379x family of SLICs has ratings of 15 V for 0.25 s, 10 V for 1 s, 5 V for 10 ms and 1 V for d.c. The PBL 376x
family together with the PBL 3860A SLIC have similar ratings. As the FLEXI-SLICTM PBL 386 xx family is specified in terms of
current pulses, a minimum value of 2
for R
P
should be used. Compliance to these conditions is guaranteed by the peak forward
recovery voltage and the forward recovery times of the TISPPBL2S
5. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
thermal characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
R
JA
Junction to free air thermal resistance
P
tot
= 0.8 W, T
A
= 25 C
5 cm
2
, FR4 PCB
D Package
160
C/W
electrical characteristics, T
amb
= 25 C (unless otherwise noted) (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
4
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
PARAMETER MEASUREMENT INFORMATION
Figure 1. PRINCIPAL TERMINAL AND GATE TRANSFER CHARACTERISTICS
Figure 2. TRANSIENT LIMITS FOR TISPPBL2S LIMITING VOLTAGE
PM6XAIA
-v
I
S
V
S
V
GG
V
D
I
H
I
T
V
T
I
TSM
I
TSP
V
(BO)
I
(BO)
I
D
Quadrant I
Forward
Conduction
Characteristic
+v
+i
I
F
V
F
I
FSM
(= |I
TSM
|)
I
FSP
(= |I
TSP
|)
-i
Quadrant III
Switching
Characteristic
V
GK(BO)
PRINCIPAL TERMINAL V-I CHARACTERISTIC
I
GT
I
GAT
I
GAF
I
F
+i
K
-i
K
I
T
-i
G
+i
G
GATE TRANSFER
CHARACTERISTIC
I
K
I
G
PROTECTOR MAXIMUM LIMITING VOLTAGE
vs
TIME
0
5
10
1 s
V
BAT
= -50 V
-50
-60
-70
-80
10 ms
1 s
VOLTAGE - V
Time
PM6XAL
MAX V
FRM
= 8 V
MAX V
(BO)
= -70 V
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
5
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
Figure 3. TEST CIRCUIT FOR MEASUREMENT OF LIMITING VOLTAGE
Figure 4. CURRENT WAVEFRONT
Figure 5. CURRENT WAVEFRONT di/dt
R1
50
Hi
V
GG
-50 V
(V
BAT
)
AI6XBAS
15
I
G
Th4
Th5
20 nF
20 F
25
IMPULSE
CURRENT
I
T
, I
F
LIMITING
VOLTAGE
V
K
, V
F
1960 V
S1
Lo
DUT
(TISPPBL2S)
220 nF
R1 = ONE SECTION OF A PBR 530 01/1 LPC LINE
RESISTOR NETWORK
ECAT WITH E502 0.5/700 SURGE NETWORK
E502 0.5/700 WAVEFRONT CURRENT
vs
TIME
Time - s
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
i - Wavefront Current - A
0
5
10
15
20
AI6XAY
E502 0.5/700 WAVEFRONT di/dt
vs
TIME
Time - s
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
di/dt - Rate of Rise of Wavefront Current - A/s
0
10
20
30
40
50
60
70
80
AI6XAZ
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
6
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
THERMAL INFORMATION
Figure 6.
PEAK NON-RECURRING A.C.
vs
CURRENT DURATION
t - Current Duration - s
01
1
10
100
1000
I
TSM
- Peak Non-Recurrent 50 Hz Current - A
1
10
TI6LACA
V
G
= -48 V, T
AMB
= 85C

R
GEN
= 70 to 950
V
GEN
= 600 Vrms
RING AND TIP CONNECTIONS -
Equal I
TSM
values were applied to both
GROUND CONNECTION -
Current is twice I
TSM
value
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
7
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
TYPICAL CHARACTERISTICS
Figure 7.
Figure 8.
Figure 9.
Figure 10.
DISTRIBUTION LIMITS OF
THYRISTOR LIMITING VOLTAGE
vs
TIME
Time - s
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
V
K
- Cathode Voltage - V
-70
-60
-50
-40
-30
-20
-10
0
AI6XAW
50 devices tested from 10 wafer lots
0.5/700 Waveform
I
T
= -20 A
T
A
= 25C
V
GG
= -50 V
DISTRIBUTION LIMITS OF
DIODE FORWARD VOLTAGE
vs
TIME
Time - s
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
V
F
- Forward Voltage - V
0
1
2
3
4
5
6
AI6XAX
50 devices tested from 10 wafer lots
0.5/700 Waveform
I
F
= 20 A
T
A
= 25C
V
GG
= -50 V
CUMULATIVE POPULATION %
vs
PEAK LIMITING VOLTAGE
Peak Limiting Voltage - V
4
5
6
7
8
9
15
10
Cumulative Population - %
0001
001
01
1
10
30
50
70
90
99
999
9999
99999
TC6XAB
50 devices tested from 10 wafer lots
I
F
= 20 A, I
T
= -20 A, 0.5/700 Waveform
T
A
= 25C, V
GG
= -50 V
THYRISTOR
V
GG
- V
(BO)
DIODE
V
FRM
TC61AD
DIODE FORWARD CURRENT
vs
FORWARD VOLTAGE
V
F
- Forward Voltage - V
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
I
F
- Forward Current - A
0.02
0.04
0.07
0.2
0.4
0.7
0.01
0.1
1
-40C
25C
85C
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
8
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
APPLICATIONS INFORMATION
operation of gated protectors
Figure 13 and Figure 14 show how the TISPPBL2S limits overvoltages. The TISPPBL2S thyristor sections
limit negative overvoltages and the diode sections limit positive overvoltages.
Negative overvoltages (Figure 13) are initially clipped close to the SLIC negative supply rail value (V
BAT
) by
the conduction of the transistor base-emitter and the thyristor gate-cathode junctions. If sufficient current is
available from the overvoltage, then the thyristor will crowbar into a low voltage ground referenced on-state
condition. As the overvoltage subsides the high holding current of the crowbar thyristor prevents d.c. latchup.
Figure 11.
Figure 12.
Figure 13. NEGATIVE OVERVOLTAGE CONDITION
Figure 14. POSITIVE OVERVOLTAGE CONDITION
CUMULATIVE POPULATION %
vs
LIMITING TIME
t
(BR)
, t
FR
- Breakdown and Forward Recovery Times - s
0.001
0.01
0.1
1
Cumulative Population - %
0001
001
01
1
10
30
50
70
90
99
999
9999
99999
TC6XAC
50 devices tested from 10 wafer lots
I
F
= 20 A, I
T
= -20 A, 0.5/700 Waveform
T
A
= 25C, V
GG
= -50 V
THYRISTOR t
(BR)
for V
(BR)
< V
GG
DIODE t
FR
for V
F
> 5 V
Outliers
(2) @ 0 s
0.004
0.04
0.4
NORMALISED PEAK LIMITING VOLTAGES
vs
JUNCTION TEMPERATURE
T
J
- Junction Temperature - C
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Normalised Peak Limiting Voltages
0.90
0.95
1.00
1.05
1.10
TC6XAA
Normalised to 25C values
of V
(BO)
and V
FRM
I
F
= 20 A, I
T
= -20 A
0.5/700 Waveform
V
GG
= -50 V
THYRISTOR
V
(BO)
DIODE
V
FRM
C1
I
G
Th5
SLIC
SLIC
PROTECTOR
TISP
PBL2S
I
K
AI6XANS
V
GG
C2
D1
V
Bat
Th5
SLIC
SLIC
PROTECTOR
TISP
PBL2S
I
F
AI6XAOS
C1
V
GG
C2
D1
V
Bat
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
9
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
The negative protection voltage will be the sum of the gate supply (V
BAT
) and the peak gate(terminal)-cathode
voltage (V
GK(BO)
). Under a.c. overvoltage conditions V
GK(BO)
will be less than 3 V. The integrated transistor
buffer in the TISPPBL2S greatly reduces protectors source and sink current loading on the V
BAT
supply.
Without the transistor, the thyristor gate current would charge the V
BAT
supply. An electronic power supply is
not usually designed to be charged like a battery. As a result, the electronic supply would switch off and the
thyristor gate current would provide the SLIC supply current. Normally the SLIC current would be less than
the gate current, which would cause the supply voltage to increase and destroy the SLIC by a supply
overvoltage. The integrated transistor buffer removes this problem.
Fast rising impulses will cause short term overshoots in gate-cathode voltage. The negative protection
voltage under impulse conditions will also be increased if there is a long connection between the gate
decoupling capacitor, C1, and the gate terminal. During the initial rise of a fast impulse, the gate current (I
G
) is
the same as the cathode current (I
K
). Rates of 60 A/s can cause inductive voltages of 0.6 V in 2.5 cm of
printed wiring track. To minimise this inductive voltage increase of protection voltage, the length of the
capacitor to gate terminal tracking should be minimised. Inductive voltages in the protector cathode wiring
can increase the protection voltage. These voltages can be minimised by routing the SLIC connection via the
protector as shown in Figure 13 and Figure 14.
Positive overvoltages (Figure 14) are clipped to ground by forward conduction of the diode section in the
TISPPBL2S. Fast rising impulses will cause short term overshoots in forward voltage (V
FRM
).
TISPPBL2S limiting voltages
This clause details the TISPPBL2S voltage limiting levels under impulse conditions.
test circuit
Figure 3 shows the basic test circuit used for the measurement of impulse limiting voltage. During the
impulse, the high levels of electrical energy and rapid rates of change cause electrical noise to be induced or
conducted into the measurement system. It is possible for the electrical noise voltage to be many times the
wanted signal voltage. Elaborate wiring and measurement techniques where used to reduce the noise
voltage to less than 2 V peak to peak.
impulse generator
A Keytek ECAT E-Class series 100 with an E502 surge network was used for testing. The E502 produces a
0.5/700 voltage impulse. This particular waveform was used as it has the fastest rate of current rise (di/dt) of
the commonly used lightning surge waveforms. This maximises the measured limiting voltage. Figure 4
shows the current wavefront through the DUT. To produce a peak test current level of 20 A, the E502
charging voltage was set to 1960 V. Figure 5 shows the DUT current di/dt. Initially the wavefront current rises
at 60 A/s, this rate then reduces as the peak current is approached. At the TISPPBL2S V
(BO)
condition the
di/dt is about 50 A/s.
limiting voltage levels
Fifty devices were measured in the test circuit of Figure 3. The 50 devices were made up from groups of 5
devices taken from 10 separately processed device lots. Figure 7 shows the total waveform variation of the
thyristor limiting voltage across the 50 devices. This shows that the largest peak limiting voltage (Breakover
voltage, V
(BO)
) is -62 V, a 12 V overshoot beyond the -50 V gate reference supply, V
GG
. The limiting voltage
exceeds the gate reference supply voltage level for a period (t
(BR)
) of about 0.4 s.
Figure 9 and Figure 11 show these two waveform parameters in terms of device population. In Figure 9, the
limiting voltage is shown in terms of the overshoot beyond the gate reference supply (V
GG
- V
(BO)
). Removing
the gate reference voltage level magnifies the thyristor limiting voltage variation and shows the data
stratification caused by the oscilloscope digitisation. Extrapolating the data trend indicates that the overshoot
is less than 14 V at the 99.997% level (equal to 30 ppm of the population exceeding 14 V, equivalent to +4
sigma point of a normal distribution). In Figure 11, extrapolating the thyristor data trend to the 99.997% level
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
10
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
indicates a maximum breakdown time, t
(BR)
, of 0.5 s. Figure 12 shows that increasing the temperature up to
85C increases the thyristor peak limiting voltage by 2.4%, giving a maximum 85C peak limiting voltage of
1.024x(-50-14) = -65.5. Over the -40C to 85C temperature range the TISPPBL2S is specified to have a
maximum V
(BO)
value of -70 V and a breakdown time, t
(BR)
, of 1 s.
Figure 8 shows the total waveform variation of the diode limiting voltage across the 50 devices. The peak
limiting voltage (Peak Forward Recovery Voltage V
FRM
) is less than 6 V, and this value includes the 2 V of
magnetically induced noise in the probe. Figure 9 shows that extrapolated 99.997% level is about 5.5 V. In
Figure 11, extrapolating the diode data trend to the 99.997% level indicates a maximum forward recovery
time, t
FR
, of 0.1 s. Figure 12 indicates that there is about a 10% uplift by increasing the temperature to 85C.
This gives a maximum 85C peak limiting voltage of 1.1x(5.5) = 6.1 V. Over the -40C to 85C temperature
range, the TISPPBL2S is specified to have a maximum V
FRM
value of 8 V and a maximum forward recovery
time of 1 s.
Diodes do not switch to a much lower voltage like thyristors, so the diode limiting voltage applies for the whole
impulse duration. Forward voltages of 1 V or less are normally considered safe. Figure 10 shows that the
lowest current 1 V condition occurs at -40C with a current of 0.3 A. When the TISPPBL2S is tested with the
rated 10/1000 impulse it would take about 8 ms for the current to decay from 30 A to 0.3 A. Over the -40C to
85C temperature range, the TISPPBL2S is specified to have a V
F
below 1 V within 10 ms.
SLIC protection requirements
This clause discusses the various requirements of the Ericsson Components SLICs detailed on the first page
of this data sheet and compares these to the TISPPBL2S protector parameters. Some SLICs are rated for
0C to 70C operation, others for -40C to 85C operation. The TISPPBL2S protector is specified for -40C to
85C operation and so covers both temperature ranges.
normal operation
Depending on the SLIC type, the maximum SLIC supply voltage rating (V
Bat
) will be -70 V, -80 V or -85 V. The
-85V rating of the TISPPBL2S gate-cathode (V
GKRM
) matches the highest SLIC voltage rating.
To restore normal operation after the TISPPBL2S has switched on, the minimum switch-off current (holding
current I
H
) needed is equal to the maximum SLIC short circuit current to ground (d.c. line current together
with the maximum longitudinal current). For the SLICs listed on the first page of this data sheet, the
TISPPBL2S minimum holding current of 140 mA will ensure switch-off after an overvoltage.
overvoltage protection
Ericsson Components specify SLIC withstand capability as a series of stress-time values. Figure 15 shows
the voltage withstand limits of the PBL 3762A SLIC.
In the positive polarity, the PBL 3762A RING or TIP voltage must not exceed +15 V. For 250 ns, the PBL
3762A will be able to withstand a voltage between +10 V and +15 V. For 1 s, the PBL 3796 will be able to
withstand a voltage between +5 V and +10 V. For 10 ms, the PBL 3796 will be able to withstand a voltage
between +2 V and +5 V. To protect against positive overvoltage, the TISPPBL2S positive limiting voltage must
be equal to or less than these voltage values during the specified time periods.
In the negative polarity, the PBL 3762A RING or TIP voltage must not exceed V
BAT
- 70. Continuously the
PBL 3762A can withstand a V
BAT
of -70 V and this implies a maximum peak voltage of -140 V. Figure 15 is
drawn for a V
BAT
of -50 V and so that the peak voltage becomes -120 V.
For 250 ns, the PBL 3762A will be able to withstand a voltage between V
BAT
-40V and V
BAT
-70 V or -90 V
and -120 V in this case. For 1 s, the PBL 3796 will be able to withstand a voltage between V
BAT
-20V and
V
BAT
-40 V or -70 V and -90 V in this case. For 10 ms, the PBL 3796 will be able to withstand a voltage
between V
BAT
and V
BAT
-20 V or -50 V and -70 V in this case. By adding a series feed diode in the battery
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
11
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
feed the d.c. and 10 ms voltage withstands increase to -70 V, independent of the actual V
BAT
value.To protect
against negative overvoltage, the TISPPBL2S negative limiting voltage must be equal to or less than these
voltage values during the specified time periods.
The following table lists the protection requirements of three selections from different SLIC families. Two, the
PBL 3796 and the PBL 3762A, specify voltage withstand. The PBL 3796 specifies the negative voltages in
absolute terms and the PBL 3762A specifies the negative voltages in terms of voltage relative to the battery
supply voltage, V
BAT
.
Tertiary protection is incorporated in the PBL 386 20/1 SLIC and the withstand is specified in terms of current
into this protection. This type of SLIC also has more time periods specified for the current withstand values.
To co-ordinate the SLIC external secondary protection (TISPPBL2S) and the internal tertiary protection, a
series resistor, R
P
, is required between the two. The tertiary protection will develop about 1 V and the
withstand current through resistor R
P
will also develop a voltage. The sum of these voltages will determine
the required limiting voltage level of the TISPPBL2S. A suitable value for R
P
is 2
.
Figure 15. TRANSIENT LIMITS FOR PBL 3762A WITHSTAND VOLTAGE
SLIC withstand comparison
SLIC
PBL 3796
PBL 3762A
PBL 386 20/1
CONDITION
V
V
V
V
A
A
continuous
-70
Note 1
+1
Note 1
V
Bat
(-70 V)
Note 3
+2
-0.1
Note 6
+0.1
pulse < 10 ms
-70
Note 1
+5
Note 1
V
Bat
- 20
Note 3
+5
-2
Note 5
+2
Note 5
10 ms
1 s
0.25 s
PBL 3762A SLIC RING AND TIP VOLTAGE WITHSTAND
vs
TIME
0
5
10
15
Voltages (with V
BAT
set to -50 V) - V
Time
0.25 s
1 s
10 ms
-120
-110
-100
-90
-80
-70
-60
-50
D.C. and 10 ms pulse rating increased
to -70 V (independent of V
BAT
value)
by use of series battery feed diode
V
BAT
- 40 V
V
BAT
- 70 V
V
BAT
- 20 V
V
BAT
AI6XBC
background image
TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
12
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
The negative limiting voltage of the TISPPBL2S is defined as a 1 s, -20 V pulse below the battery voltage
(Figure 2). This value does not exceed any of the voltage withstand levels listed in the SLIC withstand table.
In the positive polarity the TISPBL2S limits the maximum voltage to 8 V in a 1 s period and between 1 V and
5 V for a 10 ms period. These values do not exceed the values listed in the SLIC withstand table.
A graphical representation is shown in Figure 16. In the positive polarity, the three line types correspond to
the three SLIC types discussed (R
P
is 2
for the PBL 386 20/1). The two shaded areas represent the
positive and negative maximum limiting voltage levels of the TISPPBL2S as per Figure 2. The negative
voltage withstand capability of the three SLICs is shown relative to their maximum rated battery supply
voltage, V
BATM
. Figure 16 shows that the TISPPBL2S maximum limiting voltage levels do not exceed the
SLIC voltage withstand ratings.
application circuit
Figure 17 shows a typical TISPPBL2S SLIC card protection circuit. The incoming line conductors, R and T,
connect to the relay matrix via the series over-current protection. Fusible resistors, fuses and positive
temperature coefficient (PTC) resistors can be used for over-current protection. Resistors will reduce the
prospective current from the surge generator for both the TISPPBL2S and the ring/test protector. The
TISP7xxxF3 protector has the same protection voltage for any terminal pair. This protector is used when the
ring generator configuration may be ground or battery-backed. For dedicated ground-backed ringing
generators, the TISP3xxxF3 gives better protection as its inter-conductor protection voltage is twice the
conductor to ground value.
Relay contacts 3a and 3b connect the line conductors to the SLIC via the TISPPBL2S protector. Closing
contacts 3a and 3b connects the TISPPBL2S protector in parallel with the ring/test protector. As the ring/test
protector requires much higher voltages than the TISPPBL2S to operate, it will only operate when the
contacts 3a and 3b are open. Both protectors will divert the same levels of peak surge current and their
required current ratings should be similar. The TISPPBL2S protector gate reference voltage comes from the
SLIC negative supply (V
BAT
). A 220 nF gate capacitor sources the high gate current pulses caused by fast
pulse < 1 ms
-5
Note 5
+5
Note 5
pulse < 10 s
-15
Note 5
+15
Note 5
pulse < 1 s
-90
Note 1
+10
Note 1
V
Bat
- 40
Note 3
+10
-20
Note 5
+20
Note 5
pulse < 250 ns
-120
Note 1, 2
+15
Note 1, 2
V
Bat
- 70
Note 4
+15
-20
Note 5
+20
Note 5
Notes:
1. These voltage rating require a diode to be installed in series with the V
Bat
pin.
2. R
F1
, R
F2
20
is also required. Pulse supplied to TIP and RING outside R
F1
, R
F2
3. A diode in series with the V
Bat
input increases the permitted continuous voltage and pulse < 10 ms to -70 V.
A pulse
1 s is increased to the greater of |-70 V| or |V
Bat
- 40 V|
4. R
F1
, R
F2
20
is also required. Pulse supplied to TIP and RING outside R
F1
, R
F2
5. Pulse is applied to TIP and RING outside R
P1
and R
P2
6. Permitted continuous voltage for V
Bat
is -75 V
SLIC withstand comparison
SLIC
PBL 3796
PBL 3762A
PBL 386 20/1
CONDITION
V
V
V
V
A
A
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TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
13
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
rising impulses. When the SLIC has internal tertiary protection (e.g. PBL 386 21/1), then the two R
P
resistors
need to be added for protection co-ordination.
Figure 16. SLIC VOLTAGE WITHSTAND AND TISPPBL2S PROTECTION LEVELS
Figure 17. TYPICAL APPLICATION CIRCUIT
Time
10 ms
1 ms
10 s
1 s
PBL 3xxx SLIC VOLTAGE WITHSTAND
AND TISPPBL2S VOLTAGE LIMITING
vs
TIME
0
10
20
30
40
AI6XBDS
Voltage - V
V
BATM
- 70
V
BATM
- 60
V
BATM
- 50
V
BATM
- 40
V
BATM
- 30
V
BATM
- 20
V
BATM
- 10
V
BATM
PBL 3762A
PBL 386 20/1
PBL 3796
0.25 s
PBL 386 20/1
PBL 3762A
PBL 3796
TISPPBL2S
TISPPBL2S
TEST
RELAY
RING
RELAY
SLIC
RELAY
TEST
EQUIP-
MENT
RING
GENERATOR
S1a
S1b
R1a
R1b
RING
WIRE
TIP
WIRE
Th1
Th2
Th3
Th4
Th5
PBL
3xxx
SLIC
SLIC
PROTECTION
RING/TEST
PROTECTION
OVER-
CURRENT
PROTECTION
S2a
S2b
TISP
PBL2S
TISP
3xxxF3
OR
7xxxF3
S3a
S3b
V
BAT
C1
220 nF
AI6XAPS
R
P
IS USED WHEN THE SLIC
HAS TERTIARY PROTECTION
R
P
R
P
background image
TISPPBL2SD
PROGRAMMABLE OVERVOLTAGE PROTECTORS
FOR ERICSSON COMPONENTS PBL 3xxx SLICS
14
P R O D U C T I N F O R M A T I O N
AUGUST 1999 - REVISED AUGUST 2002
Specifications are subject to change without notice.
MECHANICAL DATA
D008
plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
5,21 (0.205)
4,60 (0.181)
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within 0,051 (0.002).
1,75 (0.069)
1,35 (0.053)
6,20 (0.244)
5,80 (0.228)
5,00 (0.197)
4,80 (0.189)
D008
8
7
6
5
4
3
2
1
4,00 (0.157)
3,81 (0.150)
7 NOM
3 Places
7 NOM
4 Places
0,51 (0.020)
0,36 (0.014)
8 Places
Pin Spacing
1,27 (0.050)
(see Note A)
6 Places
1,12 (0.044)
0,51 (0.020)
4 4
0,79 (0.031)
0,28 (0.011)
0,203 (0.008)
0,102 (0.004)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
0,50 (0.020)
0,25 (0.010)
x 45NOM
0,229 (0.0090)
0,190 (0.0075)
MDXXAAC
INDEX