2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1300
4 Channel EMI Filter Network
Features
Functionally and pin compatible with CSPRC032A
OptiGuard
TM
coated for improved reliability at
assembly
4 EMI filter lines per device
Filters attenuate to 30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small footprint suitable for portable devices
Lead-free version available
Applications
EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
PDAs
Laptop computers
Product Description
The CM1300 is a 4-channel low pass EMI filter (R-C-R
configuration) manufactured in a Chip Scale Package
(CSP). Many portable applications require the attenua-
tion of signals in the 800-3000 MHz band. California
Micro Devices' unique thin film technology provides a
minimum of 25dB of attenuation over this frequency
band.
The bump size and pitch of these filters are selected
such that the device can be placed directly on an FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
`flow through' design, allowing optimal PCB signal rout-
ing. The solder bump contacts are a 63/37 Sn/Pb alloy
(Sn/Ag/Cu for lead-free finish) and are 0.30 mm in
diameter.
The CM1300 incorporates OptiGuard
TM
coating which
results in improved reliability at assembly. The device
is available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.
Electrical Schematic
R
50
C
43pF
50
R
B1
A1
GND
R
50
C
43pF
50
R
B2
A2
GND
R
50
C
43pF
50
R
B4
A4
GND
R
50
C
43pF
50
R
B5
A5
GND
B3
GND
2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/07/05
CM1300
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
Specifications
B3
B4
B5
A4
A5
B1
A1
B2
A2
A
Orientation
Marking
PACKAGE / PINOUT DIAGRAMS
Notes:
CM1300
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
M003
3
2
5
4
1
B
A
Orientation
Marking
(see note 2)
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
9
CSP
CM1300-03CS
M003
CM1300-03CP
M003
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-55 to +150
C
Power Rating per Resistor
25
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1300
Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified.
Note 2: Parameters guaranteed by design or characterization.
Filter Performance
CM1300 Filter Typical Measured Frequency Response (S21) Measurement
The measurement is done with 50
-source and 50-load impedance using a HP8753C Network Analyzer with a
HP85047A S-parameter Test Set.
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
I
LEAK
Leakage Current, An or Bn to GND
V
IN
=6.0V
1
A
R
Resistance
45
50
55
C
Capacitance
34
43
52
pF
TOL
R
Resistor Absolute Tolerance
R = 50
+10
%
TOL
C
Capacitor Absolute Tolerance
C=43pF
+20
%
TCR
Temperature Coefficient of
Resistance
Note 2
+150
ppm/C
TCC
Temperature Coefficient of
Capacitance
Note 2
+500
ppm/C
F
C
Filter Cutoff Frequency
Z
SOURCE
=0
, Z
LOAD
=
Z
SOURCE
=50
, Z
LOAD
=50
R=50
, C=43pF;
74
82
MHz
MHz
2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/07/05
CM1300
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
240C
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1300
Mechanical Details
CSP Mechanical Specifications
The CM1300 is offered in a custom Chip Scale Pack-
age (CSP). Dimensions are presented below. For com-
plete information on CMD's Chip Scale Packaging, see
the California Micro Devices CSP Package Information
document.
.
Package Dimensions for
CM1300 9-bump Chip Scale Package
CSP Tape and Reel Specifications
Figure 4. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
0.940
0.985
1.030
0.0370 0.0388 0.0406
A2
2.440
2.485
2.530
0.0961 0.0978 0.0996
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
C1
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
4
5
B
C1
B1
A1
B2
C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
DIMENSIONS IN MILLIMETERS
A
B
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
PART NUMBER
PKG. SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P
0
P
1
CM1300
2.485 X 0.985 X 0.644
2.62 X 1.12 X 0.762
8mm
178mm (7")
3500
4mm
4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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