2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1423
Secure Digital (SD) Card EMI Filter Array with ESD Protection
Features
Provides EMI filtering and ESD protection for an
SD port on a mobile device
Six channels of EMI filtering with ESD protection
Four channels of ESD protection
15kV ESD protection on all I/O pins (IEC 61000-
4-2, contact discharge)
30kV ESD protection (HBM)
Better than 25dB of attenuation at 1GHz for 12pF-
100
-12pF filter configuration
Integrates 34 components into small form factor
CSP solution
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
Available with OptiGuard
TM
coated version for
improved reliability at assembly
Lead-free version available
Applications
Secure Digital (SD) Card data lines in mobile
handsets
SD Card interface protection for other mobile elec-
tronics such as MP3 players, PDAs and digital
cameras
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Product Description
California Micro Devices's CM1423 is an EMI filter
array with ESD protection, which integrates six Pi- fil-
ters (C-R-C) and four channels of ESD protection. The
CM1423's filters have component values of 12pF-
100
-12pF. The part includes ESD protection diodes
on every pin, which provide a very high level of protec-
tion for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). All the
ESD diodes are designed and characterized to safely
dissipate ESD strikes of
15kV, beyond the maximum
requirement of the IEC 61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than
30kV.
This device is particularly well suited for portable elec-
tronics (e.g. mobile handsets, PDAs, notebook com-
puters) because of its small package format and easy-
to-use pin assignments. In particular, the CM1423 is
ideal for EMI filtering and protecting data lines from
ESD for the Secure Digital (SD) Card interface slot in
mobile handsets. The CM1423 is an all-inclusive solu-
tion for the SD card interface since its EMI filters pro-
vide the proper cut-off frequency to attenuate
unwanted signals.
The CM1423 is manufactured in a space-saving, low-
profile, chip-scale package, and is optionally available
with OptiGuard
TM
coating for improved reliability. It is
also available with lead-free finishing.
Electrical Schematic
100
12pF
12pF
CLK
A5
C5
VDD*
A4
C4
VSS1*
100
12pF
12pF
DAT 0
A7
C7
100
12pF
12pF
DAT 1
A8
C8
100
12pF
12pF
DAT 2
A1
C1
100
12pF
12pF
DAT 3
A2
C2
100
12pF
12pF
CMD
A3
C3
VSS2*
A6
C6
DAT 2
DAT 3
CMD
CLK
DAT 0
DAT 1
ESD*
* In a typical SD Card application, A4 (A6)
is connected to C4 (C6). See example
given in applications section.
2005 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/12/05
CM1423
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
CLK
ESD
GND
CLK
VSS2
A6
A5
Orientation
Marking
B3
C6
C5
DAT0
DAT1
GND
DAT0
DAT1
A8
A7
B4
C8
C7
CMD
VSS1
GND
CMD
VDD
A4
A3
B2
C4
C3
DAT2
DAT3
GND
DAT2
DAT3
A2
A1
B1
C2
C1
A1
CLK
ESD
GND
CLK
VSS2
A6
A5
Orientation
Marking
B3
C6
C5
DAT0
DAT1
GND
DAT0
DAT1
A8
A7
B4
C8
C7
CMD
VSS1
GND
CMD
VDD
A4
A3
B2
C4
C3
DAT2
DAT3
GND
DAT2
DAT3
A2
A1
B1
C2
C1
A1
N233
4
3
2
6
7
8
5
1
C
B
A
Orientation
Marking
(see note 2)
N231
4
3
2
6
7
8
5
1
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1423-01 Chip Scale Package (non-coated)
CM1423-03 Chip Scale Package (OptiGuard
TM
coated)
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
DAT2
DATA2 Filter+ESD Channel, System Side
C1
DAT2
DATA2 Filter+ ESD Channel, SD Card Side
A2
DAT3
DATA3 Filter+ESD Channel, System Side
C2
DAT3
DATA3 Filter+ ESD Channel, SD Card Side
A3
CMD
CMD Signal Filter+ESD Channel, System
Side
C3
CMD
CMD Signal Filter+ESD Channel, SD Card Side
A4
VSS1
ESD-only Channel, Supply Voltage Ground
C4
VDD
ESD-only Channel, Supply Voltage
A5
CLK
Clock Filter + ESD Channel
C5
CLK
Clock Filter + ESD Channel
A6
ESD
ESD-only Channel
C6
VSS2
Supply Voltage Ground
A7
DAT0
DATA0 Filter+ ESD Channel, System Side
C7
DAT0
DATA0 Filter+ ESD Channel, SD Card Side
A8
DAT1
DATA1 Filter+ ESD Channel, System Side
C8
DAT1
DATA1 Filter+ ESD Channel, SD Card Side
B1-B4
GND
Device Ground
PART NUMBERING INFORMATION
Bumps
PKG
Standard Finish
Lead-free Finish
2
No Coating
Optiguard
TM
Coated
No Coating
Optiguard
TM
Coated
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
20
CSP
CM1423-01CS
N231
CM1423-03CS
N233
CM1423-01CP
N231
CM1423-03CP
N233
2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1423
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance 80
100
120
C
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
9
12
15
pF
V
DIODE
Diode Standoff Voltage
I
DIODE
= 10
A
5.5
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
= 3.3V
100
nA
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
I
LOAD
= -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
30
15
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+12
-7
V
V
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
R = 100
, C = 12pF;
Note 5
145
MHz
2005 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/12/05
CM1423
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1423
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. A5-C5 EMI Filter Performance
2005 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/12/05
CM1423
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. A7-C7 EMI Filter Performance
Figure 6. A8-C8 EMI Filter Performance
2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1423
Performance Information
Figure 7. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25C)
2005 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/12/05
CM1423
Application Information
Figure 8. Typical SD Card Application
100k
FILTER+ESD
A1
C1
DAT2
100k
FILTER+ESD
A2
C2
CD/DAT3
10k
FILTER+ESD
A3
C3
CMD
100k
FILTER+ESD
A5
C5
CLK
100k
FILTER+ESD
A7
C7
DAT0
100k
FILTER+ESD
A8
C8
DAT1
A4
C4
VDD
A6
C6
VSS2
9 = DAT2
1 = CD/DAT3
2 = CMD
3 = VSS1 (GND)
4 = VDD
5 = CLK
6 = VSS2 (GND)
7 = DAT0
8 = DAT1
SD Memory Card
(top view, card contacts
are on the bottom side)
Note: 100k
and 10k pull-up resistors are not included in CM1423. Designer will
need to determine the appropriate pull-up resistor value for each design.
CM1423
DAT2
DAT3
CMD
CLK
DAT0
DAT1
VSS1
ESD
CONNECTOR SIDE
CHIPSET SIDE
2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
CM1423
Application Information (cont'd)
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 9. Recommended Non-Solder Mask Defined Pad Illustration
Figure 10. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 11. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2005 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/12/05
CM1423
Mechanical Details
CM1423Mechanical Specifications
The package dimensions for the CM1423-01 and the
CM1423-03 are presented below.
Package Dimensions for CM1423
Chip Scale Package
CSP Tape and Reel Specifications
Figure 12. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.561 0.605 0.649 0.0221 0.0238 0.0255
D2
0.355 0.380 0.405 0.0140 0.0150 0.0159
D3
0.600 0.670 0.739 0.0236 0.0264 0.0291
D4
0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
C
3
4
5
6
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D3
D4
A2
BOTTOM VIEW
SIDE
VIEW
1
2
B2
B4
7
8
B
A
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
A
C
3
4
5
6
C1
B1
A1
B3
C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
1
2
B2
B4
7
8
B
A
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
CM1423-01 (non-coated CSP)
CM1423-03 (OptiGuard
TM
-coated CSP)
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1423-01
4.00 X 1.46 X 0.60
4.11 X 1.57 X 0.76
12mm
330mm (13")
3500
4mm
4mm
CM1423-03
4.00 X 1.46 X 0.67
4.11 X 1.57 X 0.76
12mm
330mm (13")
3500
4mm
4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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