2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1430
LCD and Camera EMI Filter Array with ESD Protection
Features
Four, six and eight channels of EMI filtering with
integrated ESD protection
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Greater than 20dB attenuation (typical) at 1 GHz
TDFN package with 0.40mm lead pitch:
4-ch. = 8-lead TDFN
6-ch. = 12-lead TDFN
8-ch. = 16-lead TDFN
Tiny TDFN package size:
8-lead: 1.7mm x 1.35mm
12-lead: 2.5mm x 1.35mm
16-lead: 3.3mm x 1.35mm
Increased robustness against vertical impacts
during manufacturing process
Lead-free version available
Applications
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
Product Description
The CM1430 is a family of pi-style EMI filter arrays with
ESD protection, which integrates four, six and eight fil-
ters (C-R-C) in small form factor TDFN 0.40mm pitch
packages. The CM1430 has component values of
8.5pF-100
-8.5pF per channel. The CM1430 has a
cut-off frequency of 200MHz and can be used in appli-
cations with data rates up to 80Mbps. The parts
include ESD diodes on every pin, which provide a very
high level of protection for sensitive electronic compo-
nents that may be subjected to electrostatic discharge
(ESD). The ESD protection diodes safely dissipate
ESD strikes of
15kV, well beyond the maximum
requirement of the IEC61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than
30kV.
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-
to-use pin assignments. In particular, the CM1430 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
The CM1430 is housed in space-saving, low-profile 8-,
12- and 16-lead TDFN packages with a 0.4mm pitch
and is available with lead-free finishing. This new
small TDFN package provides up to 42% board space
savings vs. the 0.50mm pitch TDFN packages.
100
8.5pF
8.5pF
FILTER+ESDn*
GND
FILTER+ESDn*
Electrical Schematic
1 of 4, 6 or 8 EMI/RFI Filter Channels
* See Package/Pinout Diagram
for expanded pin information.
with Integrated ESD Protection
2006 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
03/02/06
CM1430
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
PIN DESCRIPTIONS
DEVICE PIN(s)
NAME
DESCRIPTION
DEVICE PIN(s)
NAME
DESCRIPTION
-04
-06
-08
-04
-06
-08
1
1
1
FILTER1 Filter + ESD Channel 1
8
12
16
FILTER1 Filter + ESD Channel 1
2
2
2
FILTER2 Filter + ESD Channel 2
7
11
15
FILTER2 Filter + ESD Channel 2
3
3
3
FILTER3 Filter + ESD Channel 3
6
10
14
FILTER3 Filter + ESD Channel 3
4
4
4
FILTER4 Filter + ESD Channel 4
5
9
13
FILTER4 Filter + ESD Channel 4
5
5
FILTER5 Filter + ESD Channel 5
8
12
FILTER5 Filter + ESD Channel 5
6
6
FILTER6 Filter + ESD Channel 6
7
11
FILTER6 Filter + ESD Channel 6
7
FILTER7 Filter + ESD Channel 7
10
FILTER7 Filter + ESD Channel 7
8
FILTER8 Filter + ESD Channel 8
9
FILTER8 Filter + ESD Channel 8
GND PAD
GND
Device Ground
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
CM1430-06DF/DE
12 Lead TDFN Package
(Pins Up View)
TOP VIEW
(Pins Down View)
1) These drawings are not to scale.
CM1430-08DF/DE
16 Lead TDFN Package
CM1430-04DF/DE
8 Lead TDFN Package
GND
PAD
XXXX
GND
4
3
2
1
4
3
2
1
8
9
10
11
PAD
9
10
11
12
8
5
5
12
6
7
7
6
4
3
2
1
5 6 7 8
XXXXX
GND
4
3
2
1
12
13
14
15
PAD
13
14
15
16
12
5
16
11
11
6 7
10 9
8
10 9
4
3
2
1
5
6
7
8
BOTTOM VIEW
(Pins Up View)
TOP VIEW
(Pins Down View)
BOTTOM VIEW
(Pins Up View)
TOP VIEW
(Pins Down View)
Pin 1
XX
4
3
2
1
5
6
7
8
Marking
Pin 1
Marking
Pin 1
Marking
PART NUMBERING INFORMATION
Pins
Package
Standard Finish
Lead-free Finish
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
8
TDFN-8
CM1430-04DF
VF
CM1430-04DE
VE
12
TDFN-12
CM1430-06DF
N30F
CM1430-06DE
N30E
16
TDFN-16
CM1430-08DF
N308F
CM1430-08DE
N308E
2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1430
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
C
TOTAL
Total Channel Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
14
17
22
pF
C
Capacitance C1
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
7
8.5
11
pF
V
DIODE
Standoff Voltage
I
DIODE
=10
A
6.0
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
=+3.3V
0.1
1.0
A
V
SIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
I
LOAD
= -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level 4
Notes 2 and 3
30
15
kV
kV
R
DYN
Dynamic Resistance
Positive
Negative
2.3
0.9
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
Channel R = 100
,
Channel C = 8.5pF
200
MHz
2006 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
03/02/06
CM1430
Performance Information
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND)
Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND)
2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1430
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND)
Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND)
2006 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
03/02/06
CM1430
Performance Information (cont'd)
Typical Diode Capacitance vs. Input Voltage
Figure 5. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25C)
C
apacitanc
e
(
Normaliz
ed)
DC Voltage
2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
7
CM1430
Mechanical Details
CM1430-04DF/DE Mechanical Specifications
Dimensions for the CM1430-04DF/DE suplied in a 8-
lead, 0.4mm pitch TDFN package are presented
below.
For complete information on the TDFN-8, see the Cali-
fornia Micro Devices TDFN Package Information docu-
ment.
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 8-Lead, 0.4mm pitch
TDFN package
PACKAGE DIMENSIONS
Package
TDFN
JEDEC
No.
MO-229C
Leads
8
Dim.
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A
0.70
0.75
0.80
0.028 0.030 0.031
A1
0.00
0.02
0.05
0.000 0.001 0.002
A3
0.20 REF
0.008 REF
b
0.15
0.20
0.25
0.006 0.008 0.010
D
1.60
1.70
1.80
0.063 0.067 0.071
D2
1.10
1.20
1.30
0.043 0.047 0.051
E
1.25
1.35
1.45
0.049 0.053 0.057
E2
0.30
0.40
0.50
0.012 0.016 0.020
e
0.40 BSC
0.016 BSC
K
0.20
0.008
L
0.15
0.25
0.35
0.006 0.010 0.014
# per
tape and
reel
3000 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
b
L
0.10
C A B
M
8X
D2
E2
e
GND
K
7
8
1
2
3
6
Pin 1
C0.2
4
5
Locator
TOP VIEW
D
E
Pin 1
Marking
4
3
2
1
5
7
8
6
PAD
A
A3
A1
0.10 C
0.08 C
SIDE VIEW
2006 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
03/02/06
CM1430
Mechanical Details (cont'd)
CM1430-06DF/DE Mechanical Specifications
Dimensions for the CM1430-06DF/DE suplied in a 12-
lead, 0.4mm pitch TDFN package are presented
below.
For complete information on the TDFN-12, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 12-Lead, 0.4mm pitch
TDFN package
PACKAGE DIMENSIONS
Package
TDFN
JEDEC
No.
MO-229C
Leads
12
Dim.
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A
0.70
0.75
0.80
0.028 0.030 0.031
A1
0.00
0.02
0.05
0.000 0.001 0.002
A3
0.20 REF
0.008 REF
b
0.15
0.20
0.25
0.006 0.008 0.010
D
2.40
2.50
2.60
0.094 0.098 0.102
D2
1.90
2.00
2.10
0.075 0.079 0.083
E
1.25
1.35
1.45
0.049 0.053 0.057
E2
0.30
0.40
0.50
0.012 0.016 0.020
e
0.40 BSC
0.016 BSC
K
0.20
0.008
L
0.15
0.25
0.35
0.006 0.010 0.014
# per
tape and
reel
3000 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
b
L
0.10
C A B
M
8X
D2
E2
e
GND PAD
K
10
11
12
2
1
3
4
9
Pin 1
C0.1
5
6
8
7
Locator
TOP VIEW
D
E
Pin 1
Marking
4
3
2
1
9
11
12
5
8
6
10
7
A
A3
A1
0.10 C
0.08 C
SIDE VIEW
2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
9
CM1430
Mechanical Details (cont'd)
CM1430-08DF/DE Mechanical Specifications
Dimensions for the CM1430-08DF/DE supplied in a
16-lead, 0.4mm pitch TDFN package are presented
below.
For complete information on the TDFN-16, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 16-Lead, 0.4mm pitch
TDFN package
PACKAGE DIMENSIONS
Package
TDFN
JEDEC
No.
MO-229C
Leads
16
Dim.
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A
0.70
0.75
0.80
0.028 0.030 0.031
A1
0.00
0.02
0.05
0.000 0.001 0.002
A3
0.200 REF
0.008 REF
b
0.15
0.20
0.25
0.006 0.008 0.010
D
3.20
3.30
3.40
0.126 0.130 0.134
D2
2.70
2.80
2.90
0.106 0.110 0.114
E
1.25
1.35
1.45
0.049 0.053 0.057
E2
0.30
0.40
0.50
0.012 0.016 0.020
e
0.40 BSC
0.016 BSC
K
0.20
0.008
L
0.15
0.25
0.35
0.006 0.010 0.014
# per
tape and
reel
3000 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A
A3
A1
0.10 C
0.08 C
SIDE VIEW
b
L
0.10
C A B
M
8X
D2
E2
e
GND PAD
K
13
14
15
16
3
2
1
4
5
12
Pin 1
C0.2
6
7
8
11 10
9
Locator
TOP VIEW
D
E
Pin 1
Marking
4
3
2
1
13
15
16
5
12
8
7
6
14
9
11 10
PDF 
ZIP