2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1441
4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array
Features
Four channels of EMI filtering with integrated ESD
protection
Four channels of ESD-only protection
0.4mm pitch, 15-bump, 2.360mm X 1.053mm foot-
print Chip Scale Package (CSP)
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
30kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Greater than 35dB attenuation (typical) at 1 GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
OptiGuard
TM
coated for improved reliability at
assembly
Lead-free version available
Applications
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
Product Description
The CM1441 is a multichannel EMI/ESD array consist-
ing of four low-pass filter + ESD channels to reduce
EMI emissions on data ports and lines and four dedi-
cated ESD-only channels. Each EMI filter channel inte-
grates a high quality pi-style filter (30pF-100
-30pF)
which provides greater than 30dB of attenuation in the
800MHz to 2.7GHz frequency range. The parts include
avalanche-type ESD diodes on every pin, which pro-
vide a very high level of protection for sensitive elec-
tronic components that may be subjected to
electrostatic discharge (ESD). All ESD protection
diodes safely dissipate ESD strikes of
30kV, beyond
the maximum requirement of the IEC61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than
30kV.
This device is particularly well suited for portable elec-
tronics (e.g. wireless handsets, PDAs, notebook com-
puters) because of its small package format and easy-
to-use pin assignments. In particular, the CM1441 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
The CM1441 incorporates OptiGuard
TM
which results
in improved reliability at assembly. The CM1441 is
available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing. It is manu-
factured with a 0.40mm pitch and 0.25mm CSP solder
ball to provide up to 28% board space saving vs. com-
peting CSP devices with 0.50mm pitch and 0.30mm
CSP solder ball.
100
30pF
30pF
FILTER+ESDn*
GND
FILTER+ESDn*
1 of 4 EMI/RFI + ESD Channels.
(Pins B1-B3)
30pF
ESDn*
1 of 4 ESD-only Channels
Electrical Schematic
* See Package/Pinout Diagram for expanded pin information.
(Pins A2-A5)
(Pins C2-C5)
(Pins A1, A6,
C1, C6)
2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
ESD1
ESD Channel 1
A2
FILTER1
Filter + ESD Channel 1
A3
FILTER2
Filter + ESD Channel 2
A4
FILTER3
Filter + ESD Channel 3
A5
FILTER4
Filter + ESD Channel 4
A6
ESD2
ESD Channel 2
B1-B3
GND
Device Ground
C1
ESD3
ESD Channel 3
C2
FILTER1
Filter + ESD Channel 1
C3
FILTER2
Filter + ESD Channel 2
C4
FILTER3
Filter + ESD Channel 3
C5
FILTER4
Filter + ESD Channel 4
C6
ESD4
ESD Channel 4
FILTER4
ESD2
GND
FILTER4
ESD4
A6
A5
Orientation
Marking
B3
C6
C5
FILTER2
FILTER3
GND
FILTER2
FILTER3
A4
A3
B2
C4
C3
ESD1
FILTER1
GND
ESD3
FILTER1
A2
A1
B1
C2
C1
A1
N417
4
3
2
6
5
1
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
CM1441-07CS/CP
15 Bump CSP Package
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
15
CSP
CM1441-07CS
N417
CM1441-07CP
N417
2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1441
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open
Note 4: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
C
TOTAL
Total Channel Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
48
60
72
pF
C
Capacitance C1
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
24
30
36
pF
V
DIODE
Standoff Voltage
I
DIODE
=10
A
6.0
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
=
+
3.3V
0.1
1
A
V
SIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
I
LOAD
= -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level 4
Notes 2, 3 and 4
30
30
kV
kV
R
DYN
Dynamic Resistance
Positive
Negative
2.3
0.9
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
R=100
, C=30pF
60
MHz
2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Performance Information
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2)
2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1441
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B3)
2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Performance Information (cont'd)
Typical Diode Capacitance vs. Input Voltage
Figure 5. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25C)
C
apacitanc
e
(
Normaliz
ed)
DC Voltage
2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
7
CM1441
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous (183C)
60 seconds
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
240C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
260C
Solder Mask Opening
0.290mm DIA.
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Mechanical Details
CSP Mechanical Specifications
CM1441 devices are supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
Package Dimensions for
CM1441 Chip Scale Package
CSP Tape and Reel Specifications
Figure 9. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
2.315
2.360
2.405
0.911 0.0929 0.0947
A2
1.008
1.053
1.098 0.0397 0.0415 0.0432
B1
0.395 0.4000 0.405 0.0156 0.0157 0.0159
B2
0.195 0.2000 0.205 0.0076 0.0078 0.0080
B3
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
B4
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
C1
0.130 0.1800 0.230 0.0051 0.0071 0.0091
C2
0.130 0.1800 0.230 0.0051 0.0071 0.0091
D1
0.575
0.644
0.714 0.0226 0.0254 0.0281
D2
0.368
0.419
0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
3
4
5
6
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
1
2
B2
B4
0.25 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1441
2.36 x 1.053 x 0.644
2.62 x 1.12 x 0.76
8mm
178mm (7")
3500
4mm
4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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