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2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CSPEMI204
2 Channel Headset EMI Filter with ESD Protection
Features
Two channels of EMI filtering, one for a micro-
phone and one for an earpiece speaker
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
Chip Scale Package features extremely low para-
sitic inductance for optimum filter performance
Greater than 30dB relative attenuation in the 800-
2700MHz range
8kV ESD protection on each channel (IEC 61000-
4-2 Level 4, contact discharge)
15kV ESD protection on each channel (HBM)
5-bump, 0.930mm X 1.410mm footprint
Chip Scale Package (CSP)
Lead-free version available
Applications
EMI filtering and ESD protection for headset micro-
phone and earpiece speaker ports
Cellular / Mobile Phones
Notebooks and Personal Computers
Handheld PCs / PDAs / Tablets
Wireless Handsets
Digital Camcorders
Product Description
The CSPEMI204 is a low-pass filter array designed
specifically to reduce EMI/RFI emissions and provide
ESD protection for a headset port on a cellular and
mobile devices. The CSPEMI204 integrates two high
quality, pi-style filters (C-R-C) filters, one for a micro-
phone and one for an earpiece or speaker, each pro-
viding more than 30dB attenuation relative to the pass
band attenuation in the 800-2700 MHz range. These
filters support bidirectional filtering, reducing EMI both
to and from the headset port and support bipolar audio
signals without distortion.
In addition, the CSPEMI204 provides a very high level
of protection for sensitive electronic components that
may be subject to electrostatic discharge (ESD). The
CSPEMI204 can safely dissipate ESD strikes of
8kV,
the maximum requirement of the IEC 61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the device provides protection for contact dis-
charges to greater than
15kV. The CSPEMI204 pro-
tects sensitive components such as CPU and DSPs
that have much weaker internal ESD protection cir-
cuitry usually only intended for mechanical handling
protection.
The CSPEMI204 is particularly well-suited for portable
electronics because of its small package format and
low weight. The CSPEMI204 is available in a space-
saving, low-profile Chip Scale Package with optional
lead-free finishing.
Electrical Schematic
10
100pF
100
pF
Earpiece
C1
B2
GND
A1
Input
Earpiece
Output
68
47pF
47pF
Microphone
C3
A3
Input
Microphone
Output
2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/28/05
CSPEMI204
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
EAR_IN
Earpiece Input (from audio circuitry)
A3
MIC_IN
Microphone Input (from microphone)
B2
GND
Device Ground
C1
EAR_OUT
Earpiece Output (to earpiece)
C3
MIC_OUT
Microphone Output (to audio circuitry)
AE
3
1 2
C
B
A
Orientation
Marking
(see note 2)
MIC_OUT
EAR_OUT
GND
MIC_IN
EAR_IN
C3
Orientation
Marking
C1
B2
A1
A3
A1
PACKAGE / PINOUT DIAGRAMS
Notes:
TOP VIEW
CSPEMI204
CSP Package
BOTTOM VIEW
(Bumps Down View)
(Bumps Up View)
1) These drawings are not to scale.
2)
Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
5
CSP
CSPEMI204
AE
CSPEMI204G
AE
2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CSPEMI204
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: The parameters are guaranteed by design.
Note 5: Z
SOURCE
=50
, Z
LOAD
=50
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
1
Resistance
9
10
11
R
2
Resistance
54
68
75
C
1
Capacitance
80
100
120
pF
C
2
Capacitance
38
47
57
pF
I
LEAK
Diode Leakage Current
V
IN
=5.0V
1.0
A
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
5
-15
7
-10
15
-5
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 4
15
8
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3 and 4
+15
-19
V
V
f
C1
Cut-off frequency 1; Note 5
R = 10
, C = 100pF
33
MHz
f
C2
Cut-off frequency 2; Note 5
R = 68
, C = 47pF
61
MHz
2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/28/05
CSPEMI204
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance
2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CSPEMI204
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous (183C)
60 seconds
Maximum Soldering Temperature for EutecticDevices using Eutectic Solder Paste
240C
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
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