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Электронный компонент: CSPST16-510J

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2000 California Micro Devices Corp. All rights reserved.
11/10/2000
1
CSPST
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Chip Scale Series Termination Array
Features
8 or 16 integrated high frequency series
terminations
Ultra small footprint Chip Scale Package
Ceramic substrate
0.35mm Eutectic Solder Bumps, 0.65mm pitch
Product Description
The CSPST is a high performance Integrated Passive
Device (IPD) which provides series terminations suitable
for use in high speed bus applications. Eight (8) or
sixteen (16) series termination versions are provided.
These resistors provide excellent high frequency
performance in excess of 3GHz and are manufactured to
an absolute tolerance as low as 1%. The Chip Scale
Applications
Series resistive bus termination
Isolated resistor array
C1300700
SCHEMATIC DIAGRAMS
Package provides an ultra small footprint for this IPD
and provides minimal parasitics compared to conven-
tional packaging. Typical bump inductance is less than
25pH. The large solder bumps and ceramic substrate
allow for standard attachment to laminate printed circuit
boards without the use of underfill.
CSPST08
R1
R1
D
C
B
A
1
2
3
4
R1
R1
R1
R1
R1
R1
R1
R1
D
C
B
A
1
2
3
4
R1
R1
R1
R1
R1
R1
5
R1
R1
6
R1
R1
7
R1
R1
8
R1
R1
CSPST16
S
E
U
L
A
V
D
R
A
D
N
A
T
S
e
u
l
a
V
r
o
t
s
i
s
e
R
2
2
=
1
R
,
3
3
,
9
3
,
7
4
,
1
5
,
6
5
,
R
e
c
n
a
r
e
l
o
T
e
t
u
l
o
s
b
A
%
5
,
%
1
s
r
o
t
s
i
s
e
R
f
o
R
C
T
m
p
p
0
0
1
r
o
t
s
i
s
e
R
/
g
n
i
t
a
R
r
e
w
o
P
W
m
0
0
1
e
g
n
a
R
e
r
u
t
a
r
e
p
m
e
T
g
n
i
t
a
r
e
p
O
C
5
8
o
t
C
0
4
2000 California Micro Devices Corp. All rights reserved.
11/10/2000
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
2
CSPST
CALIFORNIA MICRO DEVICES
Package Diagram (Bumps Up View)
1
A
B
C
D
2
3
4
2.3968mm
0.381mm
0.65
mm
0.65
mm
0.643mm
0.35mm
Dia.
Bumps
0.2234mm
2.3968mmmm
1
A
B
C
D
2
3
4
5
6
7
8
2.3968mm
0.381mm
0.65
mm
0.65
mm
0.643mm
0.35mm
Dia.
Bumps
0.2234mm
4.9968mm
CSPST08
CSPST16
S
N
O
I
T
A
D
N
E
M
M
O
C
E
R
D
R
A
O
B
T
I
U
C
R
I
C
D
E
T
N
I
R
P
B
C
P
n
o
e
z
i
S
d
a
P
m
m
0
0
3
.
0
e
p
a
h
S
d
a
P
d
n
u
o
R
n
o
i
t
i
n
i
f
e
D
d
a
P
)
D
M
S
N
(
s
d
a
P
d
e
n
i
f
e
D
k
s
a
M
r
e
d
l
o
S
n
o
N
g
n
i
n
e
p
O
k
s
a
M
r
e
d
l
o
S
m
m
0
5
3
.
0
s
s
e
n
k
c
i
h
T
li
c
n
e
t
S
r
e
d
l
o
S
m
m
2
5
1
.
0
g
n
i
n
e
p
O
e
r
u
t
r
e
p
A
li
c
n
e
t
S
r
e
d
l
o
S
)
.
q
s
(
m
m
0
6
3
.
0
o
i
t
a
R
x
u
l
F
r
e
d
l
o
S
0
5
/
0
5
e
t
s
a
P
r
e
d
l
o
S
n
a
e
l
C
o
N
h
s
i
n
i
F
e
c
a
r
T
d
n
o
B
)
A
6
0
1
s
u
l
P
u
C
k
e
t
n
E
(
P
S
O
2000 California Micro Devices Corp. All rights reserved.
11/10/2000
3
CSPST
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Typical PCB Routing Diagram (Bumps Down View)
Typical Solder Reflow Thermal Profile (No Clean Flux)
250
225
200
175
150
125
100
75
50
25
0
48
97
145
Time (s)
T
e
mperature (
o
C)
194
242
290
339
387
435
EXH
RF
Z5
Z4
EXH
PH
Z2
Z3
CD
D
C
B
A
1
8
2000 California Micro Devices Corp. All rights reserved.
11/10/2000
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
4
CSPST
CALIFORNIA MICRO DEVICES
PART NUMBER KEY
N
O
I
T
A
M
R
O
F
N
I
G
N
I
R
E
D
R
O
T
R
A
P
D
R
A
D
N
A
T
S
e
g
a
k
c
a
P
r
e
b
m
u
N
t
r
a
P
g
n
i
r
e
d
r
O
e
l
y
t
S
s
n
o
i
t
a
n
i
m
r
e
T
l
e
e
R
&
e
p
a
T
g
n
i
k
r
a
M
t
r
a
P
e
l
a
c
S
p
i
h
C
8
F
0
2
2
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
J
0
2
2
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
F
0
3
3
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
J
0
3
3
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
F
0
9
3
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
J
0
9
3
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
F
0
7
4
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
J
0
7
4
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
F
0
1
5
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
J
0
1
5
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
F
0
6
5
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
8
J
0
6
5
-
8
0
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
F
0
2
2
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
J
0
2
2
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
F
0
3
3
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
J
0
3
3
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
F
0
9
3
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
J
0
9
3
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
F
0
7
4
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
J
0
7
4
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
F
0
1
5
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
J
0
1
5
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
F
0
6
5
-
6
1
T
S
P
S
C
e
n
o
N
e
l
a
c
S
p
i
h
C
6
1
J
0
6
5
-
6
1
T
S
P
S
C
e
n
o
N
E
G
A
K
C
A
P
N
O
I
T
A
M
R
O
F
N
I
G
N
I
R
E
D
R
O
T
R
A
P
D
R
A
D
N
A
T
S
-
N
O
N
s
e
i
r
e
S
t
r
a
P
s
n
o
i
t
a
n
i
m
r
e
T
)
X
X
X
(
1
R
:
e
d
o
C
e
u
l
a
V
e
c
n
a
r
e
l
o
T
)
T
S
P
S
C
(
e
l
p
m
a
x
E
)
8
(
)
1
0
2
(
)
J
(
T
S
P
S
C
8
.
e
u
l
a
v
t
n
a
c
if
i
n
g
i
s
e
r
a
s
ti
g
i
d
2
t
s
r
i
F
f
o
r
e
b
m
u
n
s
t
n
e
s
e
r
p
e
r
ti
g
i
d
d
r
i
h
T
w
o
ll
o
f
o
t
s
o
r
e
z
%
1
=
F
%
5
=
J
T
S
P
S
C
6
1
PACKAGE TYPE
APPLICATION
Tolerance
CSP = Chip Scale
Package
Series
Termination
Number of
Terminations
08 = 8
16 = 16
F = 1%
J = 5%
Resistor
Value Code
R1 Value
First 2 digits
are significant
value. 3rd digit
represents number
of zeros
CSP
ST
YY
XXX
T