PACDN1404C
PACDN1408C
PACDN1416C
2000 California Micro Devices Corp. All rights reserved.
8/4/2000
1
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
ESD Protection Arrays, Chip Scale Package
Features
4, 8, or 16 transient voltage suppressors in a
single package
In-system Electrostatic Discharge (ESD)
protection to 25kV contact discharge per
IEC 61000-4-2 international standard
Compact Chip Scale Package (0.65mm pitch) format
saves board space and eases layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages
Product Description
The PACDN1404C, PACDN1408C and PACDN1416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD.
These devices are designed and characterized to safely
dissipate ESD strikes at levels well beyond the maxi-
mum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact discharge).
All I/Os are rated at 25kV using the IEC 61000-4-2
contact discharge method. Using the MIL-STD-883D
Applications
ESD protection of I/O port connections,
such as cellular phone, PDA, internet appliance
and PC ports
Protection of interface ports or IC pins which are
exposed to high levels of ESD
C1230700
(Method 3015) specification for Human Body Model
(HBM) ESD, all pins are protected for contact discharges
to greater than 30kV.
The Chip Scale Package format of these devices enable
extremely small footprints that are necessary in portable
electronics such as cellular phones, PDAs, internet
appliances and PCs. The large solder bumps allow for
standard attachment to laminate boards without the use
of underfill.
SCHEMATIC DIAGRAMS
A1
B1
A2
B2
A3
B3
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
PACDN1404C
PACDN1408C
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
C1
D1
C2
D2
C3
D3
C4
D4
C5
D5
PACDN1416C
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PACDN1404C
PACDN1408C
PACDN1416C
2000 California Micro Devices Corp. All rights reserved.
8/4/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
2
CALIFORNIA MICRO DEVICES
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* ESD applied between channel pin and ground, one at a time. All other channels are open. All GND pins grounded. This
parameter is guaranteed by design and characterization.
`GND' in this document refers to the lower supply voltage.
Typical Solder Reflow Thermal Profile (No Clean Flux)
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Time (s)
T
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mperature (
o
C)
194
242
290
339
387
435
EXH
RF
Z5
Z4
EXH
PH
Z2
Z3
CD
PACDN1404C
PACDN1408C
PACDN1416C
2000 California Micro Devices Corp. All rights reserved.
8/4/2000
3
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Package Diagrams
Pin Orientation
Components are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part
may be rotated 180 without affecting operation.
1
A
B
2
3
1.154mm
0.381mm
0.65
mm
0.65
mm
0.643mm
0.252
mm
0.35mm Dia.
Bumps
0.252
mm
1.804mm
PACDN1404C
PACDN1408C
PACDN1416C
1
A
B
2
3
4
5
0.65
mm
0.65
mm
1.154mm
0.381mm
0.643mm
0.252
mm
0.35mm Dia.
Bumps
0.252
mm
3.104mm
1
A
B
2
3
4
5
2.454mm
0.381mm
0.65
mm
0.65
mm
0.643mm
0.252
mm
0.35mm Dia.
Bumps
0.252
mm
3.104mm
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