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Электронный компонент: NE55410G

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DESCRIPTION
The NE55410GR is an N-channel enhancement-mode LDMOS FET designed for driver 0.1 to 2.6 GHz PA, such
as, cellular base station amplifier, analog/digital TV-transmitters, and the other PA's. This product has two different
FET's on one die manufactured using our NEWMOS technology (our WSi gate lateral MOS FET), and its nitride
surface passivation and quadruple layer aluminum silicon metalization offer a high degree of reliability.
FEATURES
Two different FET's (Q1 : P
out
= 2 W, Q2 : P
out
= 10 W) in one package
Over 25 dB gain available by connecting two FET's in series
:
G
L (Q1)
= 13.5 dB TYP. (V
DS
= 28 V, I
Dset (Q1)
= 20 mA, f = 2 140 MHz)
:
G
L (Q2)
= 11.0 dB TYP. (V
DS
= 28 V, I
Dset (Q2)
= 100 mA, f = 2 140 MHz)
High 1 dB compression output power : P
O (1 dB) (Q1)
= 35.4 dBm TYP. (V
DS
= 28 V, I
Dset (Q1)
= 20 mA, f = 2 140 MHz)
:
P
O (1 dB) (Q2)
= 40.4 dBm TYP. (V
DS
= 28 V, I
Dset (Q2)
= 100 mA, f = 2 140 MHz)
High drain efficiency
:
d (Q1)
= 52% TYP. (V
DS
= 28 V, I
Dset (Q1)
= 20 mA, f = 2 140 MHz)
:
d (Q2)
= 46% TYP. (V
DS
= 28 V, I
Dset (Q2)
= 100 mA, f = 2 140 MHz)
Low intermodulation distortion
: IM
3 (Q1)
=
-
40 dBc TYP. (V
DS
= 28 V, I
Dset (Q1+Q2)
= 120 mA,
f = 2 132.5/2 147.5 MHz, P
out
= 33 dBm (2 tones) )
Single Supply (V
DS
: 3 V
<
V
DS
30 V)
Excellent Thermal Stability
Surface mount type and Super low cost plastic package : 16-pin plastic HTSSOP
Integrated ESD protection
Excellent stability against HCI (Hot Carrier Injection)
APPLICATION
Digital cellular base station PA : W-CDMA/GSM/D-AMPS/PDC/N-CDMA/PCS etc.
UHF-band TV transmitter PA
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
LDMOS FIELD EFFECT TRANSISTOR
NE55410GR
N-CHANNEL SILICON POWER LDMOS FET
FOR 2 W + 10 W VHF to L-BAND SINGLE-END POWER AMPLIFIER
Document No. PU10542EJ02V0DS (2nd edition)
Date Published June 2005 CP(K)
The mark shows major revised points.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
NE55410GR
NE55410GR-T3-AZ
16-pin plastic HTSSOP
(Pb-Free)
Note
55410
Embossed tape 12 mm wide
Pin 1 and 8 indicates pull-out direction of tape
Qty 1 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: NE55410GR
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
Pin No.
Pin Name
1 Source 9 Source
2
Drain (Q2)
10
Gate (Q1)
3 Drain
(Q2) 11 Source
4
Drain (Q2)
12
Drain (Q1)
5 Drain
(Q2) 13 Source
6 Source 14
Gate
(Q2)
7
Gate (Q1)
15
Gate (Q2)
8 Source 16 Source
9
10
11
12
13
14
15
16
8
(Top View)
7
6
5
4
3
2
1
Q1
Q2
S
S
S
S
S
S
S
S
S
S
S
Remark All the terminals of a Q2 connected to a
circuit. Backside : Source (S)
ABSOLUTE MAXIMUM RATINGS (T
A
= +25
C, unless otherwise specified)
Parameter Symbol
Test
Conditions
Ratings Unit
Drain to Source Voltage
V
DS
65
V
Gate to Source Voltage
V
GS
7 V
Drain Current (Q1)
I
D (Q1)
0.25
A
Drain Current (Q2)
I
D (Q2)
1.0
A
Total Device Dissipation (T
case
= 25
C) P
tot
40
W
Input Power (Q1)
P
in (Q1)
f = 2.14 GHz, V
DS
= 28 V
0.3
W
Input Power (Q2)
P
in (Q2)
f = 2.14 GHz, V
DS
= 28 V
1.5
W
Channel Temperature
T
ch
150
C
Storage Temperature
T
stg
-
65 to +150
C
Data Sheet PU10542EJ02V0DS
2
NE55410GR
THERMAL RESISTANCE (T
A
= +25
C)
Parameter Symbol
Test
Conditions MIN.
TYP.
MAX.
Unit
Channel to Case Resistance
R
th (ch-c)
-
2.5 3.0
C/W

RECOMMENDED OPERATING CONDITIONS (T
A
= +25
C)
Parameter Symbol
MIN.
TYP.
MAX.
Unit
Drain to Source Voltage
V
DS
-
28 30 V
Gate to Source Voltage
V
GS
2.7 3.3 3.7 V
Input Power (Q1), CW
P
in (Q1)
-
15 23 dBm
Input Power (Q2), CW
P
in (Q2)
-
20 30 dBm

ELECTRICAL CHARACTERISTICS (T
A
= +25
C)
Parameter Symbol
Test
Conditions MIN.
TYP.
MAX.
Unit
Q1
Gate to Source Leak Current
I
GSS (Q1)
V
GSS
= 5V
-
-
1
A
Drain to Source Leakage Current
I
DSS (Q1)
V
DSS
= 65 V
-
-
1 mA
Gate Threshold Voltage
V
th (Q1)
V
DS
= 10 V, I
DS
= 1 mA
2.2
2.8
3.4
V
Transconductance g
m (Q1)
V
DS
= 28 V, I
DS
= 20 mA
-
0.09
-
S
Drain to Source Breakdown Voltage
BV
DSS (Q1)
I
DSS
= 10
A 65
75
-
V
Q2
Gate to Source Leak Current
I
GSS (Q2)
V
GSS
= 5V
-
-
1
A
Drain to Source Leakage Current
I
DSS (Q2)
V
DSS
= 65 V
-
-
1 mA
Gate Threshold Voltage
V
th (Q2)
V
DS
= 10 V, I
DS
= 1 mA
2.0
2.6
3.2
V
Transconductance g
m (Q2)
V
DS
= 28 V, I
DS
= 100 mA
-
0.45
-
S
Drain to Source Breakdown Voltage
BV
DSS (Q2)
I
DSS
= 10
A 65
75
-
V
Data Sheet PU10542EJ02V0DS
3
NE55410GR
RF CHARACTERISTICS (T
A
= +25
C)
Parameter Symbol
Test
Conditions MIN.
TYP.
MAX.
Unit
Q1
Gain 1 dB Compression Output Power
P
O (1 dB)
f = 2 140 MHz, V
DS
= 28 V,
-
35.4
-
dBm
Drain Efficiency
d
I
Dset
= 20 mA
-
52
-
%
Linear Gain
G
L
P
in
= 15 dBm
12
13.5
-
dB
Q2
Gain 1 dB Compression Output Power
P
O (1 dB)
f = 2 140 MHz, V
DS
= 28 V,
-
40.4
-
dBm
Drain Efficiency
d
I
Dset
= 100 mA
-
46
-
%
Linear Gain
G
L
P
in
= 20 dBm
9.5
11
-
dB
Gain 1 dB Compression Output Power
P
O (1 dB)
f = 1 840 MHz, V
DS
= 28 V,
-
40.5
-
dBm
Drain Efficiency
d
I
Dset
= 100 mA
-
49
-
%
Linear Gain
G
L
P
in
= 20 dBm
-
14
-
dB
Q1 + Q2
Gain 1 dB Compression Output Power
P
O (1 dB)
f = 880 MHz, V
DS
= 28 V,
-
41.5
-
dBm
Drain Efficiency
d
I
Dset
= 120 mA (Q1 + Q2)
-
55
-
%
Linear Gain
G
L
P
in
= 5 dBm
-
30
-
dB
Gain 1 dB Compression Output Power
P
O (1 dB)
f = 2 140 MHz, V
DS
= 28 V,
-
40.0
-
dBm
Drain Efficiency
d
I
Dset
= 120 mA (Q1 + Q2)
34
42
-
%
Output Power
P
out
P
in
= 16 dBm
39
40
-
dB
Linear Gain
G
L
P
in
= 10 dBm
24
25
-
dB
3rd Order Intermodulation Distortion
IM
3
-
-
40
-
dBc
Drain Efficiency
d
f = 2 132.5/2 147.5 MHz, V
DS
= 28 V,
2 carrier W-CDMA 3GPP, Test Model1,
64DPCH, 67% Clipping,
I
Dset
= 120 mA (Q1 + Q2),
Ave P
out
= 33 dBm
-
21
-
%
Data Sheet PU10542EJ02V0DS
4
NE55410GR
TYPICAL CHARACTERISTICS (T
A
= +25
C, V
DS
= 28 V, I
Dset
= 120 mA, unless otherwise specified)
Gain G (dB)
Output Power P
out
(dBm)
10
30
40
60
50
70
25
15
20
35
40
45
3rd/5th Order Intermodulation Distortion IM
3
/IM
5
(dBc)
2 tones Output Power P
out
(dBm)
IM
3
/IM
5
vs. 2 TONES OUTPUT POWER
IM
3
Lower
Upper
20
Drain Efficiency
d
(%)
30
IM
5
CW, f = 960 MHz,
1 MHz Spacing
20
35
45
60
55
70
25
15
20
35
40
45
3rd/5th Order Intermodulation Distortion IM
3
/IM
5
(dBc)
2 tones Output Power P
out
(dBm)
IM
3
/IM
5
, DRAIN EFFICIENCY,
vs. 2 TONES OUTPUT POWER
IM
3
25
30
IM
5
30
40
50
65
Lower
Upper
d
100
70
50
20
30
0
90
80
60
40
10
Drain Efficiency
d
(%)
W-CDMA 3GPP, Test Model 1,
64 DPCH, 67% Clipping,
Center Frequency 2.14GHz,
15 MHz spacing
vs. OUTPUT POWER
GAIN, DRAIN EFFICIENCY,
Gain G (dB)
Output Power P
out
(dBm)
Drain Efficiency
d
(%)
vs. OUTPUT POWER
GAIN, DRAIN EFFICIENCY,
36
30
32
22
24
26
28
20
20
25
30
35
40
45
G
d
34
80
50
60
10
20
30
40
0
70
f = 840 MHz
860 MHz
880 MHz
900 MHz
920 MHz
30
24
26
16
18
20
22
14
20
25
30
35
40
45
G
d
28
80
50
60
10
20
30
40
0
70
f = 2.09 GHz
2.11 GHz
2.14 GHz
2.17 GHz
2.19 GHz
Remark The graphs indicate nominal characteristics.
Data Sheet PU10542EJ02V0DS
5
NE55410GR
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form
(S2P) that enables direct import to a microwave circuit simulator without keyboard input.
Click here to download S-parameters.
[RF and Microwave]
[Device Parameters]
URL http://www.ncsd.necel.com/


Data Sheet PU10542EJ02V0DS
6
NE55410GR
EVALUATION CIRCUIT (f = 840 to 960 MHz, V
DS
= 28 V, I
Dset
= 120 mA)
Q1
Q2
S
S
2
3
4
5
1 6 8 9 11 13 16
(Back side)
14
15
S S S S S S S S
NE55410GR
7
10
12
(open)
2.2 nH
18
TL8
TL9
TL10
TL11
15 pF
12 pF
9 pF
1 k
10
6.8 k
TL12
TL14
TL15
TL16
TL17
2 pF
6 pF
2 pF
TL13
0.22 F
A
47 pF
TL18
RFout
B
A
TL4
TL6
TL7
3 pF
47 pF
TL5
0.001 F
B
47 F
+
V
DS
(+28 V)
1 k
2.2 k
6.8 k
15
TL1
TL2
TL3
0.22 F
47 pF
RFin
0.047
F
56 nH
4 pF
TL19

Symbol
Width (mm) Length (mm)
Symbol
Width (mm) Length (mm)
TL1 1.0 3.0
TL11 1.0 3.0
TL2 4.5 10.0
TL12 1.0 5.0
TL3 0.5 16.0
TL13 0.8 48.0
TL4 0.5 5.0
TL14 1.0 6.5
TL5 1.0 48.0
TL15 1.0 10.5
TL6 1.0 4.0
TL16 1.0 9.5
TL7 1.0 3.0
TL17 1.0 10.0
TL8 1.0 6.0
TL18 1.0 6.0
TL9 1.0 3.0
TL19 1.0 3.0
TL10 1.0 4.0
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10542EJ02V0DS
7
NE55410GR
EVALUATION CIRCUIT (f = 840 to 960 MHz, V
DS
= 28 V, I
Dset
= 120 mA)
6.8 k
0.22 F
1 k
(Valiable)
2.2 k
15
47 pF
47 pF
12 pF
3 pF
2.2 nH
18
1 k
(Valiable)
10
6.8 k
0.047 F
9 pF
47 pF
2 pF
2 pF
6 pF
0.22 F
47 F
V
GS (Q2)
, +28 V
RF out
RF in
V
DS (Q1)
, +28 V
V
DS (Q2)
, +28 V
V
GS (Q1)
, +28 V
55410
4 pF
1.5 pF
15 pF
56 nH
0.001 F
Data Sheet PU10542EJ02V0DS
8
NE55410GR
EVALUATION CIRCUIT (f = 2 090 to 2 190 MHz, V
DS
= 28 V, I
Dset
= 120 mA)
Q1
Q2
S
S
2
3
4
5
1 6 8 9 11 13 16
(Back side)
14
15
S S S S S S S S
NE55410GR
7
10
12
12 nH
10
TL14
TL12
TL13
0.75 pF
1 pF
1 k
10
6.8 k
TL15
TL17 TL18
TL20
3 pF
1 pF
TL16
0.22 F
A
15 pF
TL21
RFout
B
A
TL7
TL10
TL11
1 pF
33 pF
TL8
0.22 F
B
22 F
+
V
DS
(+28 V)
1 k
10
6.8 k
TL1
TL2
0.22 F
47 pF
RFin
0.22 F
TL3
TL4
TL5
8.5 pF
2 pF
TL6
(open)
TL9
TL19
Symbol
Width (mm) Length (mm)
Symbol
Width (mm) Length (mm)
TL1 1.0 17.0
TL12 1.0 4.0
TL2 1.0 4.0
TL13 1.0 4.5
TL3 1.0 24.5
TL14 1.0 25.0
TL4 1.0 2.5
TL15 2.5 2.5
TL5 1.0 3.0
TL16 1.0 27.0
TL6 0.5 2.5
TL17 1.0 2.0
TL7 0.5 4.5
TL18 5.0 4.0
TL8 1.0 25.5
TL19 5.0 2.0
TL9 1.0 2.5
TL20 1.0 12.5
TL10 4.5 4.5
TL21 1.0 5.5
TL11 1.0 3.5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10542EJ02V0DS
9
NE55410GR
EVALUATION CIRCUIT (f = 2 090 to 2 190 MHz, V
DS
= 28 V, I
Dset
= 120 mA)
V
GS (Q2)
, +28 V
V
DS (Q1)
, +28 V
V
DS (Q2)
, +28 V
55410
V
GS (Q1)
, +28 V
0.22 F
6.8 k
RF out
RF in
0.5 pF
15 pF
2 pF
33 pF
1.0 pF
0.22 F
10
12 nH
0.75 pF
10
1 pF
0.22 F
6.8 k
15 pF
1 pF
3 pF
0.22 F
22 F
10
1 k
(Valiable)
1 k
(Valiable)
Data Sheet PU10542EJ02V0DS
10
NE55410GR
PACKAGE DIMENSIONS
16-PIN PLASTIC HTSSOP (UNIT: mm)
(1.5)
0.90.2
0.200.10
(0.4)
(2.7)
(0.5)
(1.8)
(0.1)
(2.5)
5.20.2
5.50.3
6.40.3
0.650.1
0.200.10
16
9
1
8
NEC
55410
Remark ( ): Reference value
LAND PATTERN (UNIT: mm)
6.40
5.20
0.10
0.50
1.50
4.00
0.48
5.50
1.50
0.20
0.65
0.40
0.20
1.00
1.15
0.28
0.50
0.24
0.24
0.50
0.28
0.28

Remarks1.
Via holes : 158 holes
2. Hole size :
0.25 mm
3. Min. spacing : 0.354 mm
4. : Solder resist or etching
Data Sheet PU10542EJ02V0DS
11
NE55410GR
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions Condition
Symbol
Infrared Reflow
Peak temperature (package surface temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220
C or higher
: 60 seconds or less
Preheating time at 120 to 180
C :
120
30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120
C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
: 350
C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PU10542EJ02V0DS
12
NE55410GR
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279








Subject: Compliance with EU Directives


CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.

CEL Pb-free products have the same base part number with a suffix added. The suffix A indicates
that the device is Pb-free. The AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.

This status is based on CEL's understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A -AZ
Lead (Pb)
< 1000 PPM
Not Detected
(*)
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance
content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL
suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.