FEATURES
UPB1513TU
NEC's 13 GHz INPUT
DIVIDE BY 4 PRESCALER IC
FOR SATELLITE COMMUNICATIONS
OPERATING FREQUENCY:
f
in
= 5 to 13 GHz
LOW CURRENT CONSUMPTION:
I
CC
= 48 mA @ V
CC
= 5.0 V
HIGH-DENSITY SURFACE MOUNTING:
8-pin lead-less minimold
SUPPLY VOLTAGE:
V
CC
= 4.5 to 5.5 V
DIVISION RATIO:
4
APPLICATIONS
POINT-TO-POINT/ MULTI-POINT RADIOS
VSAT RADIOS
DESCRIPTION
PRELIMINARY DATA SHEET
California Eastern Laboratories
NEC's UPB1513TU is a silicon germanium (SiGe) monolithic
integrated circuit designed as a divide by 4 prescaler IC
for satellite communications and point-to-point/multi-point
radios.
The package is 8-pin lead-less minimold suitable for surface
mount.
This IC is manufactured using our 50 GHz fmax UHS2 (Ultra
High Speed Process) silicon bipolar process.
ORDERING INFORMATION
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby
sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPB1513TU
PART NUMBER ORDER NUMBER
PACKAGE
MARKING
SUPPLYING FORM
UPB1513TU-E2
UPB1513TU-E2-A 8-pin lead-less minimold
(Pb-Free)
Note
1513
8 mm wide embossed taping
Pin 5, 6, 7, 8 indicates pull-out direction of tape
Qty 5 kpcs/reel
UPB1513TU
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
SYSTEM APPLICATION EXAMPLE
PIN NO.
PIN NAME
1
V
CC
1
2
IN
3
GND
4
IN
5
OUT
6
GND
7
OUT
8
V
CC
2
(Top View)
2
3
4
1
7
6
5
8
Regulator
1/2
1/2
PLL
13 GHz Prescaler
1/4
PB1513TU
LNA
Down-Converter
Up-Converter
PA
Diplexer
UPB1513TU
PIN EXPLANATION
PIN NO.
PIN NAME
APPLIED VOLTAGE
(V)
FUNCTION AND APPLICATIONS
1
V
CC
1
5
Power supply pin.
This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to
minimize ground impedance.
2
IN
-
Signal input pin.
This pin should be coupled to signal source with capasitor (example : 100 pF) for
DC cut.
3
GND
0
Ground pin.
Ground pattern on the board should be formed as widely as possible to minimize
ground impedance.
4
IN
-
Signal input bypass pin.
This pin must be equipped with bypass capacitor (example : 100 pF) to minimize
ground impedance.
5
OUT
-
Divided frequency output pin.
This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC
cut.
6
GND
0
Ground pin.
Ground pattern on the board should be formed as widely as possible to minimize
ground impedance.
7
OUT
-
Divided frequency output pin.
This pin should be coupled to load device with capasitor (example : 100 pF) for DC
cut.
8
V
CC
2
5
Power supply pin.
This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to
minimize ground impedance.
UPB1513TU
PARAMETER
SYMBOL
TEST CONDITIONS
RATINGS
UNIT
Supply Voltage
V
CC
T
A
= +25C
6
V
Total Power Dissipation
P
D
T
A
= +85C
Note
867
mW
Thermal Resistance
(junction to ground paddle)
R
th(j-c)
T
A
= +85C
Note
75
C/W
Operating Ambient Temperature
T
A
-
40 to +85
C
Storage Temperature
T
stg
-
55 to +150
C
ABSOLUTE MAXIMUM RATINGS
Note Mounted on 33 21 0.4 mm polyimide PCB, with copper patterning on both sides.
RECOMMENDED OPERATING RANGE
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply Voltage
V
CC
4.5
5.0
5.5
V
Operating Ambient Temperature
T
A
-
40
+25
+85
C
ELECTRICAL CHARACTERISTICS
(V
CC
= 4.5 to 5.5 V, T
A
= -40 to +85C, Z
S
= Z
L
= 50 )
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Circuit Current
I
CC
No Signals
-
48
75
mA
Input Sensitibity
P
in1
f
in
= 5 to 6 GHz
-
8
-
-
5
dBm
P
in2
f
in
= 6 to 12 GHz
-
8
-
0
dBm
P
in3
f
in
= 12 to 13 GHz
-
5
-
0
dBm
Output Power
P
out
f
in
= 5 to 13 GHz, single ended,
P
in
= -5 dBm
-
11
-
4
2
dBm
UPB1513TU
TYPICAL CHARACTERISTICS
(T
A
= +25C, unless otherwise specified)
Output Power
P
out
(dBm)
Frequency f (GHz)
Input Sensitivity
P
in
(dBm)
Frequency f (GHz)
INPUT SENSITIVITY vs. FREQUENCY
OUTPUT POWER vs. FREQUENCY
15
10
5
0
-5
-10
-15
-20
-25
-30
-35
0
5
10
15
20
Guaranteed
operating
range
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-120
5
10
15
20
P
in
= -5 dBm
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
Guaranteed
operating range
Input Sensitivity
P
in
(dBm)
Frequency f (GHz)
INPUT SENSITIVITY vs. FREQUENCY
15
10
5
0
-5
-10
-15
-20
-25
-30
-35
0
5
10
15
20
Guaranteed
operating
range
V
CC
= 3.0 V
T
A
= -40C
T
A
= +25C
T
A
= +85C
Output Power
P
out
(dBm)
Frequency f (GHz)
OUTPUT POWER vs. FREQUENCY
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-120
5
10
15
20
Guaranteed
operating range
T
A
= -40C
T
A
= +25C
T
A
= +85C
V
CC
= 3.0 V
P
in
= -5 dBm
Remark The graphs indicate nominal characteristics.
UPB1513TU
MEASUREMENT CIRCUITS
The application circuits and their parameters are for reference only and are not intended for actual design-ins.
IN
GND
IN
V
CC
1
2
3
4
1
7
6
5
8
100 pF
50
Spectrum Analyzer
100 pF
51
100 pF
51
100 pF
Signal Generator
50
OUT
GND
OUT
V
CC
2
5 V
Power Supply
100 pF
10 nF
UPB1513TU
ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD
Remarks 1. 33 21 0.4 mm double-sided copper-clad polyimide PCB
2. Back side: GND pattern
3. Solder plated on pattern
4. represents cutout
5.
: Through holes
51
51
100 pF
10 nF
100 pF
100 pF
100 pF
100 pF
1
2
3
4
8
7
6
5
UPB1513TU
PACKAGE DIMENSIONS
8-PIN LEAD-LESS MINIMOLD (UNIT:mm)
1
2
3 4
8
7
6
5
2.20.05
2.00.1
(Top View)
0.50.03
4
3 2
1
5
6
7
8
0
.
4
0
.
1
0
.
4
0
.
1
(1.4)
(0.75)
(0.75)
(0.25) (0.25)
0.160.05
(Bottom View)
2.00.1
(
0
.
3
5
)
(
0
.
3
5
)
(
0
.
3
5
)
(
0
.
3
5
)
(0.5)
(0.5)
(0.6)
(0.6)
(0.65)
(0.65)
(0.6)
(0.3)
0.125
+0.1
-0.0
5
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
01/04/05
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
UPB1513TU
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution
Do not use different soldering methods together (except for partial heating).
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
(3) Keep the track length of the ground terminals as short as possible.
(4) Bypass capacitance must be attached to V
CC
line.
(5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground.
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix A indicates
that the device is Pb-free. The AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL's understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
-AZ
Lead (Pb)
< 1000 PPM
Not Detected
(*)
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate
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suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.
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