Central

Semiconductor Corp.

145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com

PROCESS

CPD74

Switching Diode

Monolithic Isolated Quad Switching Diode Chip

PRINCIPAL DEVICE TYPES

CMEDA-6i

GEOMETRY

PROCESS DETAILS

R0 (1-November 2004)

Die Size

25 x 25 MILS

Die Thickness

6.0 MILS

Anode 1, 2, 3, 4 Bonding Pad Area

3.5 x 4.0 MILS

Cathode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS

Top Side Metalization

Al - 12,000�

Back Side Metalization

Au - 5,000�

GROSS DIE PER 3 INCH WAFER