Chipcon
Chipcon
Chipcon
Chipcon
SmartRF
SmartRF
SmartRF
SmartRF
CC1010
This document contains information on a preproduction product. Specifications and information herein are subject to
change without notice.
Chipcon AS
SmartRF
CC1010 PRELIMINARY Datasheet (rev. 1.2) 2003-05-19
Page 1 of 141
CC1010
Single Chip Very Low Power RF Transceiver with
8051-Compatible Microcontroller
Applications
Very low power UHF wireless data
transmitters and receivers
315 / 433 / 868 and 915 MHz ISM/SRD
band systems
Home automation and security
AMR Automatic Meter Reading
RKE Remote Keyless Entry with
acknowledgement
Low power telemetry
Toys
Product Description
The
CC1010
is a true single-chip UHF
transceiver with an integrated high
performance 8051 microcontroller with 32
kB of Flash program memory. The RF
transceiver can be programmed for
operation in the 300 1000 MHz range,
and is designed for very low power
wireless applications.
The
CC1010
together with a few external
passive components constitutes a
powerful embedded system with wireless
communication capabilities.
CC1010
is based on Chipcon's SmartRF
02
technology in 0.35
m CMOS.
Key Features
300-1000 MHz RF Transceiver
Very low current consumption (9.1
mA in RX)
High sensitivity (typically -107 dBm)
Programmable output power up to
+10 dBm
Data rate up to 76.8 kbit/s
Very few external components
Fast PLL settling allowing frequency
hopping protocols
RSSI
EN 300 220 and FCC CFR47 part
15 compliant
8051-Compatible Microcontroller
Typically 2.5 times the performance
of a standard 8051
32 kB Flash, 2048 + 128 Byte SRAM
3 channel 10 bit ADC, 4 timers / 2
PWMs, 2 UARTs, RTC, Watchdog,
SPI, DES encryption, 26 general I/O
pins
In-circuit interactive debugging is
supported for the Keil
Vision2 IDE
through a simple serial interface.
2.7 - 3.6 V supply voltage
64-lead TQFP
Chipcon
Chipcon
Chipcon
Chipcon
SmartRF
SmartRF
SmartRF
SmartRF
CC1010
Chipcon AS
SmartRF
CC1010 PRELIMINARY Datasheet (rev. 1.2) 2003-05-19
Page 2 of 141
Table Of Contents
FEATURES ............................................................................................................................................ 4
ABSOLUTE MAXIMUM RATINGS .................................................................................................. 5
RECOMMENDED OPERATING CONDITIONS............................................................................. 5
DC CHARACTERISTICS.................................................................................................................... 6
ELECTRICAL SPECIFICATIONS .................................................................................................... 7
PIN CONFIGURATION..................................................................................................................... 11
PIN DESCRIPTION............................................................................................................................ 13
BLOCK DIAGRAM ............................................................................................................................ 16
8051 CORE........................................................................................................................................... 17
G
ENERAL DESCRIPTION
...................................................................................................................... 17
R
ESET
................................................................................................................................................. 17
M
EMORY
M
AP
.................................................................................................................................... 18
CPU R
EGISTERS
................................................................................................................................. 21
I
NSTRUCTION
S
ET
S
UMMARY
............................................................................................................. 22
I
NTERRUPTS
........................................................................................................................................ 26
E
XTERNAL INTERRUPTS
...................................................................................................................... 30
M
AIN
C
RYSTAL
O
SCILLATOR
............................................................................................................. 30
P
OWER AND
C
LOCK
M
ODES
............................................................................................................... 32
F
LASH
P
ROGRAM
M
EMORY
................................................................................................................ 35
SPI F
LASH
P
ROGRAMMING
................................................................................................................. 35
S
ERIAL PROGRAMMING ALGORITHM
:.................................................................................................. 35
8051 F
LASH
P
ROGRAMMING
.............................................................................................................. 40
F
LASH
P
OWER
C
ONTROL
.................................................................................................................... 41
I
N
C
IRCUIT
D
EBUGGING
..................................................................................................................... 42
C
HIP
V
ERSION
/ R
EVISION
.................................................................................................................. 43
8051 PERIPHERALS .......................................................................................................................... 44
G
ENERAL
P
URPOSE
I/O....................................................................................................................... 44
T
IMER
0 / T
IMER
1.............................................................................................................................. 49
T
IMER
2 / 3
WITH
PWM ..................................................................................................................... 56
P
OWER
O
N
R
ESET
(B
ROWN
-O
UT
D
ETECTION
) ................................................................................... 59
W
ATCHDOG
T
IMER
............................................................................................................................. 60
R
EAL
-
TIME
C
LOCK
............................................................................................................................. 62
S
ERIAL
P
ORT
0
AND
1......................................................................................................................... 63
SPI M
ASTER
....................................................................................................................................... 68
DES E
NCRYPTION
/ D
ECRYPTION
....................................................................................................... 72
R
ANDOM
B
IT
G
ENERATION
................................................................................................................ 76
ADC................................................................................................................................................... 77
RF TRANSCEIVER ............................................................................................................................ 81
G
ENERAL DESCRIPTION
...................................................................................................................... 81
RF T
RANSCEIVER
B
LOCK
D
IAGRAM
.................................................................................................. 81
RF A
PPLICATION
C
IRCUIT
.................................................................................................................. 83
T
RANSCEIVER
C
ONFIGURATION
O
VERVIEW
....................................................................................... 86
RF T
RANSCEIVER
RX/TX
CONTROL AND POWER MANAGEMENT
....................................................... 87
D
ATA
M
ODEM AND
D
ATA
M
ODES
...................................................................................................... 89
B
AUD RATES
....................................................................................................................................... 92
T
RANSMITTING AND RECEIVING DATA
................................................................................................ 93
D
EMODULATION AND DATA DECISION
................................................................................................ 95
S
YNCHRONIZATION AND PREAMBLE DETECTION
.............................................................................. 100
R
ECEIVER SENSITIVITY VERSUS DATA RATE AND FREQUENCY SEPARATION
..................................... 103
F
REQUENCY PROGRAMMING
............................................................................................................. 105
L
OCK
I
NDICATION
............................................................................................................................ 108
Chipcon
Chipcon
Chipcon
Chipcon
SmartRF
SmartRF
SmartRF
SmartRF
CC1010
Chipcon AS
SmartRF
CC1010 PRELIMINARY Datasheet (rev. 1.2) 2003-05-19
Page 3 of 141
R
ECOMMENDED
S
ETTINGS FOR
ISM F
REQUENCIES
.......................................................................... 109
VCO................................................................................................................................................. 111
VCO
AND
PLL
SELF
-
CALIBRATION
.................................................................................................. 111
VCO, LNA
AND BUFFER CURRENT CONTROL
................................................................................... 116
I
NPUT
/ O
UTPUT
M
ATCHING
............................................................................................................. 118
O
UTPUT
P
OWER
P
ROGRAMMING
...................................................................................................... 119
RSSI O
UTPUT
................................................................................................................................... 122
IF
OUTPUT
........................................................................................................................................ 123
O
PTIONAL
LC F
ILTER
....................................................................................................................... 124
R
ESERVED REGISTERS AND TEST REGISTERS
..................................................................................... 125
S
YSTEM
C
ONSIDERATIONS AND
G
UIDELINES
.................................................................................... 127
PCB L
AYOUT
R
ECOMMENDATIONS
.................................................................................................. 129
A
NTENNA
C
ONSIDERATIONS
............................................................................................................ 129
PACKAGE DESCRIPTION (TQFP-64) ......................................................................................... 131
SOLDERING INFORMATION....................................................................................................... 132
PACKAGE THERMAL COEFFICIENTS ..................................................................................... 132
TRAY SPECIFICATION ................................................................................................................. 132
CARRIER TAPE AND REEL SPECIFICATION ......................................................................... 132
LIST OF ABBREVIATIONS ........................................................................................................... 133
SFR SUMMARY................................................................................................................................ 134
ALPHABETIC REGISTER INDEX................................................................................................ 138
ORDERING INFORMATION......................................................................................................... 141
Chipcon
Chipcon
Chipcon
Chipcon
SmartRF
SmartRF
SmartRF
SmartRF
CC1010
Chipcon AS
SmartRF
CC1010 PRELIMINARY Datasheet (rev. 1.2) 2003-05-19
Page 4 of 141
Features
Fully Integrated UHF RF Transceiver
Programmable frequency in the
range 300 1000 MHz
High sensitivity (typically -107 dBm
at 2.4 kBaud)
Programmable output power 20 to
+10 dBm
Very low current consumption (RX:
9.1 mA)
Very few external components
required and no external RF switch
or IF filter required
Single port antenna connection
Fast PLL settling allows frequency
hopping protocols
FSK modulation with a data rate of
up to 76.8 kBaud
Manchester or NRZ coding and
decoding of data performed in
hardware. Byte delineation of data
can be performed in hardware to
lessen the processor burden
RSSI output which can be sampled
by on-chip ADC
Complies with EN 300 220 and FCC
CFR47 part 15
High-Performance and Low-Power
8051-Compatible Microcontroller
Optimised 8051-core which typically
gives 2.5x the performance of a
standard 8051
Dual data pointers
Idle and sleep modes
In-circuit interactive debugging is
supported for the Keil
Vision IDE
through a simple serial interface
Data and Non-volatile Program Memory
32 kB of non-volatile Flash memory
in-system programmable through a
simple SPI interface or by the 8051
core.
Typical Flash memory endurance:
20 000 write/erase cycles
Programmable read and write lock of
portions of Flash memory for software
security
2048 + 128 Byte of internal SRAM
Hardware DES Encryption / Decryption
DES supported in hardware
Output Feedback Mode or Cipher
Feedback Mode DES to avoid the
requirement that data length must
be a multiple of eight bytes
Peripheral Features
Power On Reset / Brown-Out
Detection
Three channel, max 23 kSample/s,
10 bit ADC
Programmable watchdog timer.
Real time clock with 32 kHz crystal
oscillator
Two timers / pulse counters and two
timers / pulse width modulators
Two programmable serial UARTs.
Master SPI interface
26 configurable general-purpose
I/O-pins
Random bit generator in hardware
Low Power
8051 core and peripherals can use
the RTC's 32 kHz clock
Idle and sleep modes for reduced
power consumption. System can
wake up on interrupt or when ADC
input exceeds a set threshold
Low-power fully static CMOS design
Operating Conditions
2.7 - 3.6 V supply voltage
-40 - 85 C operational temperature
3 - 24 MHz crystal (up to 50 ppm)
for the main crystal oscillator
Packaging
64-lead TQFP
Chipcon
Chipcon
Chipcon
Chipcon
SmartRF
SmartRF
SmartRF
SmartRF
CC1010
Chipcon AS
SmartRF
CC1010 PRELIMINARY Datasheet (rev. 1.2) 2003-05-19
Page 5 of 141
Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings given in Table 1 be violated.
Stress exceeding one or more of the limiting values may cause permanent damage to the
device.
Table 1. Absolute Maximum Ratings
Parameter
Min.
Max.
Units
Condition
Supply voltage, VDD
-0.3
5.0
V
Voltage on any pin
-0.3
VDD+0.3,
max 5.0
V
Input RF level
10
dBm
Storage temperature range
-50
150
C
Un-programmed device
Storage temperature range
-40
125
C
Programmed device, data
retention > 0.49 years at
125
C
Lead temperature
260
C
T = 10 s
Caution! ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
Recommended Operating Conditions
Table 2. Recommended Operating Conditions
Tc = -40 to 85
C, VDD = 2.7 to 3.6 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
Supply voltage, DVDD, AVDD
2.7 3.3
3.6 V
Supply voltage during
normal operation
Supply voltage, DVDD, AVDD
2.7
3.6
V
Supply voltage during
program/erase Flash
memory
Operating temperature, free-air
-40 85 C
Main oscillator frequency
3
24
MHz
RTC oscillator frequency
32768
Hz
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