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Электронный компонент: CPC1150N

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1
www.clare.com
DS-CPC1150N-R1.0
CPC1150N
4 Pin SOP OptoMOS
Relays
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket
Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Small 4 Pin SOP Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
1500V
RMS
Input/Output Isolation
FCC Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Tape & Reel Version Available
Applications
Features
Description
Approvals
Ordering Information
CPC1150N
Units
Load Voltage
350
V
Load Current
100
mA
Max R
ON
50
Pin Configuration
Part #
Description
CPC1150N
4 Pin SOP (100/tube)
CPC1150NTR
4 Pin SOP (2,000/reel)
* For other packaging options, consult factory.
1
2
3
4
+ Control
Control
Load
Load
CPC1150N Pinout
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
10%
90%
90%
+
+
T
ON
T
OFF
+
The CPC1150N is a miniature 1-Form-B solid state
relay which uses optically coupled MOSFET technol-
ogy to provide 1500V of input to output isolation. The
efficient MOSFET switches and photovoltaic die use
Clare's patented OptoMOS
architecture. The opti-
cally-coupled input is controlled by a highly efficient
GaAIAs infrared LED. The CPC1150N uses Clare's
state of the art double molded vertical construction
packaging to produce the world's smallest 4 pin SOP
package. The CPC1150N offers board space savings
of at least 20% over the competitor's larger 4 Pin
SOP relay.
UL / C-UL Recognized Component: File #E76270
BSI Certified - Certificate #: 8416
Electrical Characteristics
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics @ 25C
Load Voltage (Peak)
-
V
L
-
-
350
V
Load Current (Continuous)
AC Peak
1
I
L
-
-
120
mA
Peak Load Current
10ms
I
LPK
-
-
350
mA
On-Resistance
I
L
=90mA
R
ON
-
-
50
Off-State Leakage Current
V
L
=350V, I
F
=2mA
I
LEAK
-
-
5
A
Switching Speeds
Turn-On
I
F
=5mA, V
L
=10V
T
ON
-
-
1.0
ms
Turn-Off
I
F
=5mA, V
L
=10V
T
OFF
-
2
ms
Output Capacitance
50V; f=1MHz
C
OUT
-
25
-
pF
Capacitance
Input to Output
-
-
-
1
-
pF
Input Characteristics @ 25C
Input Control Current
2
I
L
=90mA
I
F
2
-
50
mA
Input Dropout Current
-
I
F
0.3
0.9
-
mA
Input Voltage Drop
I
F
=5mA
V
F
0.9
1.2
1.4
V
Reverse Input Voltage
-
V
R
-
-
5
V
Reverse Input Current
V
R
=5V
I
R
-
-
10
A
1
Load current derates linearly from 90mA @ 25
o
C to 70mA @ 85
o
C.
2
For applications requiring high temperature operation (greater than 60
o
C) an LED drive current of 10mA is recommended.
www.clare.com
CPC1150N
Rev. 1.0
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an extend-
ed period may degrade the device and effect its reliability.
2
Absolute Maximum Ratings (@ 25 C)
Parameter
Min
Typ Max Units
Input Power Dissipation
-
-
150 mW
Input Control Current
-
-
50
mA
Peak (10ms)
-
-
1
A
Reverse Input Voltage
-
-
5
V
Total Power Dissipation
-
-
400
1
mW
Isolation Voltage
Input to Output
1500
-
-
V
RMS
Operational Temperature
-40
-
+85
C
Storage Temperature
-40
-
+125
C
Soldering Temperature
-
-
+220
C
(10 Seconds Max.)
1
Derate Linearly 3.33 mw / C
CPC1150N
www.clare.com
Rev. 1.0
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
3
CPC1150N
Typical LED Forward Voltage Drop
(Ambient Temperature = 25 C)
I
F
= 5mADC
35
30
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
o
CPC1150N
Typical On-Resistance Distribution
(Ambient Temperature = 25 C)
(Load Current = 90mA)
35
30
25
20
15
10
5
0
38.5
39.5
40.5
41.5
39
40
41
On-Resistance (
)
Device Count (N)
o
CPC1150N
Typical Blocking Voltage Distribution
(Ambient Temperature = 25 C)
35
30
25
20
15
10
5
0
377.5
399.5
421.5
443.5
388.5
410.5
432.5
Blocking Voltage (V)
Device Count (N)
o
CPC1150N
Typical I
F
for Switch Operation
(Ambient Temperature = 25 C)
(Load Current = 90mA)
0.50
0.60
0.70
0.45
0.55
0.65
0.75
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
o
CPC1150N
Typical I
F
for Switch Dropout
(Ambient Temperature = 25 C)
(Load Current = 90mA)
25
20
15
10
5
0
0.50
0.60
0.70
0.45
0.55
0.65
0.75
LED Current (mA)
Device Count (N)
o
CPC1150N
Typical Turn-On Time
(Ambient Temperature = 25 C)
(Load Current = 90mA; I
F
= 5mA)
0.21
0.23
0.25
0.27
0.22
0.24
0.26
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
o
CPC1150N
Typical Turn-Off Time
(Ambient Temperature = 25 C)
(Load Current = 90mA; I
F
= 5mA)
0.50
0.70
0.90
1.10
1.00
0.80
0.60
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
o
CPC1150N
Typical Load Current vs. Temperature
(I
F
=0, I
L
=AC Peak)
Temperature ( C)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
120
100
o
CPC1150N
Typical Leakage vs. Temperature
(Measured across Pins 3 & 4) I
L
= max rated
Temperature ( C)
Leakage (
A)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20
0
20
40
60
80
100
o
CPC1150N
Typical Blocking Voltage
vs. Temperature
Temperature ( C)
Blocking Voltage (V
RMS
)
-40
430
425
420
415
410
405
400
395
-20
0
20
40
60
80
100
o
CPC1150N
Typical Turn-On vs. Temperature
(Load Current = 50mA)
Temperature ( C)
Turn-Off (ms)
-40
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0
-20
0
20
40
60
80
100
5mA
10mA
o
CPC1150N
Typical Turn-Off vs. Temperature
(Load Current = 50mA)
Temperature ( C)
5mA
10mA
Turn-On (ms)
-40
5.000
4.500
4.000
3.500
3.000
2.500
2.000
1.500
1.000
0.500
0
-20
0
20
40
60
80
100
o
www.clare.com
4
CPC1150N
Rev. 1.0
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
CPC1150N
Typical LED Forward Voltage Drop
vs. Temperature
Temperature ( C)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
120
100
50mA
30mA
20mA
10mA
5mA
o
CPC1150N
Typical Turn-On vs. LED Forward Current
(Load Current = 100mA)
LED Forward Current (mA)
(ms)
0
5
10
15
20
25
30
35
40
45
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
CPC1150N
Typical Turn-Off vs. LED Forward Current
(Load Current = 100mA)
LED Forward Current (mA)
(ms)
0
5
10
15
20
25
30
35
40
45
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
CPC1150N
Typical On-Resistance vs. Temperature
(Load Current = max rated; I
F
= 10mA)
Temperature ( C)
On-Resistance (
)
-40
60
50
40
30
20
10
0
-20
0
20
40
60
80
100
o
CPC1150N
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25 C)
I
F
= 5mA
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-6
-4
-2
0
2
4
6
o
CPC1150N
Energy Rating Curve
Time
Load Current (A)
10
s
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms
100
s
100ms
1s
10ms
10s
100s
CPC1150N
Typical I
F
for Switch Operation
vs. Temperature
(Load Current = 50mA)
Temperature ( C)
LED Current (mA)
-40
3.000
2.500
2.000
1.500
1.000
0.500
0
-20
0
20
40
60
80
100
o
CPC1150N
Typical I
F
for Switch Turn-on
vs. Temperature
(Load Current = 50mA)
Temperature ( C)
LED Current (mA)
-40
3.000
2.500
2.000
1.500
1.000
0.500
0
-20
0
20
40
60
80
100
o
CPC1150N
www.clare.com
5
Rev. 1.0
Dimensions
mm
(inches)
MECHANICAL DIMENSIONS
4 Pin SOIC Narrow ("N" Suffix)
PC Board Pattern (Top View)
.20 .025
(.008 .001)
2.54 TYP.
(.100 TYP.)
2.16 MAX.
(.085)
1.02 .025
(.040 .001)
3.81 .08
(.150 .003)
6.096 .102
(.240 .004)
.38 x 45
(.015 x 45 )
.38 TYP.
(.015 TYP.)
4.09 0.20
(0.161 0.008)
.432 .127
(.017 .005)
2.54
0.127
(0.100
0.005)
5.66
0.14
(0.223
0.005)
1.448
(0.057)
0.889
(0.035)
4.70 0.15
3.0 R
1.50
1.60
A
A
8.00
2.00 .05
+
_
4.00 .10
+
_
1.5 dia
5.50 .10
+
_
12.00
1.75
.30
.3 R MAX
TYP
2.30 0.15
SECTION A-A
Tape and Reel Packaging for 4 pin SOIC package
330.2 DiA
(13.00")
Top Cover
Tape Thickness
0.102 MAX
(0.004)
3.8
TYP
+
_
4.2
+
_
2.7 0.15
+
_
Embossment
Embossed
Carrier
6.50
0.15
+
_
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to sup-
port or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or
make changes to its products at any time without notice.
Specification: DS-CPC1150N-R1.0
Copyright 2001, Clare, Inc.
OptoMOS
is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
10/11/01
For additional information please visit our website at: www.clare.com