High Speed
CDSU4148
Features
Designed for mounting on small surface.
Extremely thin/leadless package.
High mounting capability, strong surge
withstand, high reliability.
Mechanical data
Case: 0603 (1608) standard package,
molded plastic.
Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
Polarity: Indicated by cathode band.
Mounting position: Any.
Weight: 0.003 gram (approximately)
SMD Switching Diode
SMD Switching Diode
Parameter
Repetitive peak reverse voltage
Reverse voltage
Average forward current
Forward current , surge peak
Power Dissipation
Storage temperature
Junction temperature
Conditions
Symbol
V
RRM
V
R
I
O
I
FSM
P
D
T
STG
T j
Min
-40
-40
Max
100
75
150
150
+125
+125
Typ
4
1
Unit
V
V
mA
A
mW
www.comchip.com.tw
COMCHIP
COMCHIP
Maximum Rating
( at T
A
= 25 C unless otherwise noted )
Electrical Characteristics
( at T
A
= 25 C unless otherwise noted )
C
C
tp=1uS
tp=1mS
Preliminary
Unit
V
nA
uA
pF
nS
Parameter
Forward voltage
Reverse current
Capacitance between terminals
Reverse recovery time
Conditions
I
F
= 50 mA D C
V
R
= 20 V
V
R
= 75 V
f = 1MHz, and 0 VDC reverse voltage
I
F
= I
R
= 10 mA, R
L
=100 ohms, i
rr
= 1mA
Symbol
V
F
I
R
C
T
Trr
Min
Typ
Max
1.0
25
2.5
4
4
RDS0301003-B
0.071(1.80)
0.063(1.60)
0.010(0.25) Typ.
0.039(1.00)
0.031(0.80)
0.033 (0.85)
0.027 (0.70)
Dimensions in inches and (millimeter)
0603(1608)
0.012 (0.30) Typ.
0.014(0.35) Typ.
(Lead-free Device)
RATING AND CHARACTERISTIC CURVES (CDSU4148)
SMD Switching Diode
SMD Switching Diode
www.comchip.com.tw
COMCHIP
COMCHIP
F
o
r
w
a
r
d
c
u
r
r
e
n
t
(
m
A
)
Reverse voltage (V)
R
e
v
e
r
s
e
c
u
r
r
e
n
t
(
A
)
0.2
0.4
0.8
1.4
0
1.0
0.6
100n
0.1n
1000
10
100
1u
10u
10n
1n
1.2
1
0.1
0.01
0
10
90 100
20
30
40
50
60
70
80
1.8
1.6
Reverse voltage : (V)
C
a
p
a
c
i
t
a
n
c
e
b
e
t
w
e
e
n
t
e
r
m
i
n
a
l
s
:
(
p
F
)
0
5
10
15
20
25
30
35
0
1.0
2.0
3.0
4.0
5.0
f=1MHz
Ta = 25 C
Ambient temperature ( C)
Forward voltage (V)
A
v
e
r
a
g
e
f
o
r
w
a
r
d
c
u
r
r
e
n
t
(
%
)
-2
5
C
7
5
C
1
2
5
C
2
5
C
-25 C
25 C
75 C
125 C
RDS0301003-B
0
20
40
60
80
100
0
25
50
75
100
125
150
Mounting on glass epoxy PCBs
Fig. 1 - Forward characteristics
Fig. 2 - Reverse characteristics
Fig. 4 - Current derating curve
Fig. 3 - Capacitance between
terminals characteristics