LA363B5

Technical

METAL CASE, CASE-MOUNTED
SEMICONDUCTORS

LA363B5

Natural Conv. (

C/W): 11.1

Forced Air (

C/W): 3.9

Mounting Envelope: 1.63" x 1.29" x 1.25"

DESCRIPTION OF CURVES

C.
D.
E.

N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.

Thermal Resistance Case to Sink is 1.0-1.4

C/W w/Joint Compound.

Derate 0.7

C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Unplated

Comm'l. Black

Anodize

Mil. Black

Anodize

Semiconductor

Accommodated

Hole patt.

ref. no.

Max. Weight

(Grams)

LA363B5U

LA363B5CB

LA363B5B

Any TO-3 can

12.6

HOLE PATTERNS

3. Hole pattern no. 363 accommodates T0-3s or T0-3 ICs.
Available in LA-B series heat dissipators only.

CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872

Rev. 03-04-03