Preliminary
TBF-2012-190-T1 THIN FILM BAND PASS FILTER
1. Feature:
1. PHS Low Profile Thin Film Band Pass Filter
2. Lead Free
2. Part Number
TBF 2012
-- 190 --T1
--
XX
(1) (2) (3)
(4) (5)
Where
(1) TBF : Thin Film Band Pass Filter
(2)
Size
:
4 digits of number 2012 = 2.001.25 mm
(3) Center Frequency :
190 = 1.90 GHz
(4)
Type
Refer to Table 3-1
(5)
XX
Internal Code
3. Ratings
3-1 Specifications
Part Number
TBF-2012-190-T1
Nominal Characteristics Impedance
50
Nominal Center Frequency
1906.5MHz
Bandwidth
1893 ~ 1920MHz
Insertion Loss
2.7 dB Max. at +25 deg. C
3.0 dB max. at 40 ~ +85 deg. C
Ripple in BW
0.5 dB max.
Attenuation
30.0dB min. at 1420MHz
30.0dB min. at 1660MHz
12.0dB min. at 2128MHz
30.0dB min. at 3814MHz
10.0dB min. at 5721MHz
VSWR in BW
2.0 Max.
Power Capacity
500mW Max.
3-2 Operation Temperature:
-40 to +85
3-3 Storage Temperature: +15 to +35
PAGE 1 OF 1
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
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APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Preliminary
4. Outline Dimension
Code Dimension
a
0.075 + 0.02
b 0.45
+ 0.1
c 0.25
+ 0.1
d 0.40
+ 0.1
e 0.40
+ 0.1
Unit : mm
T
erminal Configuration:
Terminal No.
Terminal Name
(1) Input
(2) Output
(3) GND
(4) GND
5. Electrical Performance
PAGE 2 OF 2
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
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APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Preliminary
4. Recommended Land Pattern
a 0.2
mm
b 0.15
mm
c 0.3
mm
d 0.35
mm
e 0.3
mm
PAGE 3 OF 3
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
DOCUMENT
NO.
PAGE
REV.
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UNLESS OTHERWISE SPECIFIED
TOLERANCES ON
X =
X.X =
X.XX =
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HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Preliminary
5. Reliability Test
7.1 Electrical
ITEM
Specification and Requirement
Test Method
Temperature Characteristics Satisfy electrical characteristics
Solder the sample on PCB.
Exposure at each temperature,
-40, -20, 0, +25, +50,
+85 for 30minutes
7.2 Mechanical
ITEM
Specification and Requirement
Test Method
Solderability
The Surface of terminal immersed shall
be minimum of 95% covered with a new
coating of solder
Solder bath :
After immersing in flux, dip in245
+ 5 molten solder bath for 2 +
0.5 seconds
Resistance to solder Heat Satisfy electrical characteristics without
distinct deformation in appearance
A. Pre-heat : 100 ~ 110 for 30
seconds
B. Immersed at solder bath of 270
+ 5 for 20 + 1 seconds
Vibration
Satisfy electrical characteristics without
Mechanical damage such as break
Vibrate as apply 20 to 2,000Hz,
186m/s
2
(19G) acceleration 1.5mm
amplitude for 2 hours in each of
three (X, Y, Z) axis (total 6 hours).
Shock
Satisfy electrical characteristics without
mechanical damaged such as break
(1) Break value : 490 N
(2) Duration of pulse : 11ms
(3) 3 times in each positive and
negative direction of 3 mutual
perpendicular directions.
Bending Test
Satisfy electrical characteristics without
mechanical damage such as break
Bending value : 3mm for 30 + 1
seconds
Solvent
Resistant
Marking should be legible without
mechanical and distinct damage in
appearance
(1) Solvent : Trichloroethane or
Isopropyl alcohol.
(2) Immersed in solvent at room
temperature for 90 seconds
Drop Test
Satisfy electrical characteristics without
mechanical damage
Drop the sample from a height of
1m to concrete ground for 10 times
PAGE 4 OF 4
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
DOCUMENT
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REV.
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TOLERANCES ON
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SCALE
X
UNIT
X
APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Preliminary
7.3 Load Life
ITEM
Specification and Requirement
Test Method
Rapid change of temperature Satisfy Electrical Characteristics.
Without distinct damage.
Perform 5 cycles as follows :
-55 for 30minutes room
temperature for 3 minutes
+125 for 30minutes room
temperature for 3 minutes.
(Dwell time : 5 to 8 minutes)
Humidity Resistance Test
Satisfy Electrical Characteristics.
Without distinct damage.
Precondition at +25 for 1hour.
Let stand at temperature +40
3
, 90~95% relative humidity for
1,000 hours before taking final
measurements.
Low Temperature Store
Satisfy Electrical Characteristics.
Without distinct damage.
Solder the sample on PCB.
Exposure at
-55 3 for 1,000
hours.
1~2 hours exposure at room
temperature and humidity, prior to
measurement.
High Temperature Store
Satisfy Electrical Characteristics.
Without distinct damage.
Solder the sample on PCB.
Exposure at +85
3 for 1,000
hours.
1~2 hours exposure at room
temperature and humidity, prior to
measurement.
Load Life
Satisfy Electrical Characteristics.
Without distinct damage.
Apply 16 Volt voltage at 702
ambient
PAGE 5 OF 5
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
DOCUMENT
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PAGE
REV.
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UNLESS OTHERWISE SPECIFIED
TOLERANCES ON
X =
X.X =
X.XX =
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HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Preliminary
6. Packaging
8-1 Material : Paper Carrier Tape
8-2 Dimensions
8-2-1 Tape packaging dimensions
Direction mark
Carries cavity
A
0.65 0.10
B
A = 2.28 0.10
B = 2.74 0.10
P(PITCH) = 4.00 0.10
+
1.5
-
P
1.75 0.10
8.00 0.30
P
Unit : mm
Sprocket hole
0.60 0.10
2.00 0.10
3.50 0.10
0.1
8-2-2 Setting Direction
8-2-3 Reel dimensions
Unit : mm
10.0 1.5
0.8 0.2
2.0 0.5
21 0.8
13.
0 0
.
5
60
5.0
178
2
PAGE 6 OF 6
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
DOCUMENT
NO.
PAGE
REV.
A0
UNLESS OTHERWISE SPECIFIED
TOLERANCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Preliminary
8-3 Peel force of top cover tape
The peel speed shall be about 300 mm/minute
The peel force of top cover tape shall be between 10 to 70g
8-4 Numbers of taping
4,000 pieces/reel
8-5 Label marking
The following items shall be marked on the production and shipping
Label on the reel.
8-5-1 Production Label
(1) Part No.
(2) Description
(3) Quantity
(4) Taping No.
8-5-2 Shipping Label
(1) *Customer's name
(2) *Customer's part No.
(3) Manufacturer's part No.
(4) Manufacturer's name
(5) Manufacturer's country
*Note : Item (1) and (2) are listed by request
PAGE 7 OF 7
TITLE :
The Engineering Spec. for TBF-2012-190-T1 Band Pass Filter
DOCUMENT
NO.
PAGE
REV.
A0
UNLESS OTHERWISE SPECIFIED
TOLERANCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
Kevin-Wang
RELEASED BY
Steven-Tseng
DESIGNED BY
Steven-Tseng
CHECKED BY
Steven-Tseng
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
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