CYStech Electronics Corp.
Spec. No. : C303C2
Issued Date : 2004.02.11
Revised Date :
Page No. : 1/3
1SS400C2
CYStek Product Specification
High Speed Switching diode
1SS400C2
Features
Extremely small surface mounting type.(SC-79/SOD523)
High speed switching applications
Low reverse current
Symbol Outline
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature Tstg .................................................................................................... -55~+150
C
Junction Temperature Tj .............................................................................................................. +150
C
Maximum Voltages and Currents (Ta=25
C)
DC Reverse Voltage V
R
.................................................................................................................... 100 V
Mean Rectifying Current I
F
................................................................................................... 200mA
Peak Forward Surge Current I
FSM.........................................
.............................................. 500mA
Thermal Characteristics
Total Device Dissipation @ T
A
=25C (
Note
) P
D
.......................................................200mW
Thermal Resistance, Junction to Ambient R
JA
...................................................625C/W
Note: FR-5 board minimum pad.
CYStech Electronics Corp.
Spec. No. : C303C2
Issued Date : 2004.02.11
Revised Date :
Page No. : 2/3
1SS400C2
CYStek Product Specification
Characteristics
(Ta=25
C)
Characteristic Symbol Condition Min.
Max.
Unit
Forward Voltage
V
F
I
F
=100mA -
1.2
V
Reverse Leakage Current
I
R
V
R
=80V -
0.1
A
Diode Capacitance
C
D
V
R
=0.5V, f=1MHz
-
3
pF
Reverse Recovery Time
trr
I
F
=I
R
=10mA -
4
ns
Characteristic Curves
Forward Current Derating Curve
0
20
40
60
80
100
120
0
25
50
75
100
125
150
175
200
Ambient Temperature---T
A
()
Percentage of Rated Forward Current---(%)
M ounting on glass
epoxy PCBs
Forward Current vs Forward Voltage
0.1
1
10
100
0.2
0.4
0.6
0.8
1
1.2
Forward Voltage---V
F
(V)
Forward Current---I
F
(mA)
- 40
25
85
Reverse Leakage Current vs Reverse Voltage
0.001
0.01
0.1
1
10
0
10
20
30
40
50
Reverse Voltage---VR(V)
Reverse Leakage Current---I
R(A)
T a= 85
T a= 25
T a= 125
Capacitance vs Reverse Voltage
0.52
0.56
0.6
0.64
0.68
0
2
4
6
8
Reverse Voltage---V
R
(V)
Capacitance between terminals---C
T
(pF)
f=1MHz
Ta=25
CYStech Electronics Corp.
Spec. No. : C303C2
Issued Date : 2004.02.11
Revised Date :
Page No. : 3/3
1SS400C2
CYStek Product Specification
SOD-523 Dimension
*: Typical
Millimeters Millimeters
DIM
Min .Max.
DIM
Min. Max.
A 0.5
0.7 E 0.7
0.9
b
p
0.25
0.35 H
E
1.5
1.7
c 0.1
0.2 V
0.15(typ)
D 1.1
1.3
Notes:
1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Marking Code :
A
2-lead SOD-523 Plastic Package
CYStek Package Code : C2
Style : Pin 1. Cathode 2. Anode
2
1
2
1
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