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Электронный компонент: BTP2907A3

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CYStech Electronics Corp.

Spec. No. : C317A3-H
Issued Date : 2002.06.11
Revised Date : 2005.06.29
Page No. : 1/5
BTP2907A3
CYStek Product Specification

General Purpose PNP Epitaxial Planar Transistor
BTP2907A3
Description
The BTP2907A3 is designed for general purpose amplifier and high-speed switching, medium power
applications.
Low collector saturation voltage
High speed switching.
Complementary to BTN2222A3
Pb-free package
Symbol Outline


Absolute Maximum Ratings
(Ta=25
C)
Parameter Symbol Limits
Unit
Collector-Base Voltage
V
CBO
-60 V
Collector-Emitter Voltage
V
CEO
-60 V
Emitter-Base Voltage
V
EBO
-5 V
Collector Current
I
C
-600 mA
Power Dissipation
Pd
625
mW
Junction Temperature
Tj
150
C
Storage Temperature
Tstg
-55~+150
C
BTP2907A3
TO-92
BBase
CCollector
EEmitter
E B C
CYStech Electronics Corp.

Spec. No. : C317A3-H
Issued Date : 2002.06.11
Revised Date : 2005.06.29
Page No. : 2/5
BTP2907A3
CYStek Product Specification

Characteristics
(Ta=25
C)
Symbol Min.
Typ.
Max.
Unit
Test
Conditions
BV
CBO
-60 -
- V
I
C
=-10A
BV
CEO
-60 -
- V
I
C
=-10mA
BV
EBO
-5 - - V
I
E
=-10A
I
CBO
- - -10
nA
V
CB
=-50V
I
CEX
- - -50
nA
V
CE
=-30V, V
BE(OFF)
=-0.5V
*V
CE(sat)
- -0.2 -0.4 V
I
C
=-150mA, I
B
=-15mA
*V
CE(sat)
- -0.5 -1.6 V
I
C
=-500mA, I
B
=-50mA
*V
BE(sat)
- - -1.3 V
I
C
=-150mA, I
B
=-15mA
*V
BE(sat)
- - -2.6 V
I
C
=-500mA, I
B
=-50mA
*h
FE
1
75 - - -
V
CE
=-10V, I
C
=-100A
*h
FE
2
100
- - -
V
CE
=-10V, I
C
=-1mA
*h
FE
3
100
- - -
V
CE
=-10V, I
C
=-10mA
*h
FE
4
100 - 300 -
V
CE
=-10V, I
C
=-150mA
*h
FE
5
50 - - -
V
CE
=-10V, I
C
=-500mA
f
T
200 -
MHz
V
CE
=-20V, I
C
=-50mA, f=100MHz
Cob - - 8 pF
V
CB
=-30V, I
E
=0A,f=1MHz
*Pulse Test: Pulse Width
380s, Duty Cycle
2%

Classification Of h
FE
4
Rank A
N
B
Range 100~180 120~270 180~300


Ordering Information
Device Package
Shipping
BTP2907A3
TO-92
(Pb-free)
2000 pcs / Tape & Box






CYStech Electronics Corp.

Spec. No. : C317A3-H
Issued Date : 2002.06.11
Revised Date : 2005.06.29
Page No. : 3/5
BTP2907A3
CYStek Product Specification

Characteristic Curves
Current Gain vs Collector Current
10
100
1000
0.1
1
10
100
1000
Collector Current---IC(mA)
Current G
ain---H
FE
VCE=10V
Saturation Voltage vs Collector Current
0.01
0.1
1
10
0.1
1
10
100
1000
Collector Current---IC(mA)
Saturation Voltage---(m
V)
VCE(sat)@IC=10IB
Saturation Voltage vs Collector Current
0.01
0.1
1
10
0.1
1
10
100
1000
Collector Current---IC(mA)
Saturation Voltage---(m
V)
VCE(sat)@IC=20IB
Saturation Voltage vs Collector Current
0.1
1
10
0.1
1
10
100
1000
Collector Current---IC(mA)
Saturation Voltage---(m
V)
VBE(sat)@IC=10IB
On Voltage vs Collector Current
0.4
0.6
0.8
1
1.2
0.1
1
10
100
1000
Collector Current---IC(mA)
On Voltage (V)
VBE(on)@VCE=1V
Power Derating Curve
0
100
200
300
400
500
600
700
0
50
100
150
Ambient Tempurature---Ta ( )
Power Disspation---PD (m
W)
CYStech Electronics Corp.

Spec. No. : C317A3-H
Issued Date : 2002.06.11
Revised Date : 2005.06.29
Page No. : 4/5
BTP2907A3
CYStek Product Specification

TO-92 Taping Outline

Millimeters
DIM Item
Min. Max.
A
Component body height
4.33
4.83
D
Tape Feed Diameter
3.80
4.20
D1 Lead
Diameter
0.36
0.53
D2
Component Body Diameter
4.33
4.83
F1,F2
Component Lead Pitch
2.40
2.90
F1,F2 F1-F2
-
0.3
H
Height Of Seating Plane
15.50
16.50
H1
Feed Hole Location
8.50
9.50
H2
Front To Rear Deflection
-
1
H2A
Deflection Left Or Right
-
1
H3 Component
Height
-
27
H4
Feed Hole To Bottom Of Component
-
21
L
Lead Length After Component Removal
-
11
L1
Lead Wire Enclosure
2.50
-
P
Feed Hole Pitch
12.50
12.90
P1
Center Of Seating Plane Location
5.95
6.75
P2
4 Feed Hole Pitch
50.30
51.30
T
Over All Tape Thickness
-
0.55
T1
Total Taped Package Thickness
-
1.42
T2
Carrier Tape Thickness
0.36
0.68
W Tape
Width
17.50
19.00
W1 Adhesive
Tape
Width
5.00
7.00
-
20 pcs Pitch
253
255
H2A
H2A
H2
H2
D2
A
H
W
W1
H3
H4
H1
L1
L
P2
P
P1
F1F2
D1
D
T2
T
T1
CYStech Electronics Corp.

Spec. No. : C317A3-H
Issued Date : 2002.06.11
Revised Date : 2005.06.29
Page No. : 5/5
BTP2907A3
CYStek Product Specification

TO-92 Dimension
*: Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1704
0.1902 4.33 4.83 G 0.0142
0.0220 0.36 0.56
B 0.1704
0.1902 4.33 4.83 H
-
*
0.1000 -
*
2.54
C 0.5000 - 12.70 -
I
-
*
0.0500 -
*
1.27
D 0.0142
0.0220 0.36 0.56
1
-
*
5
-
*
5
E -
*
0.0500 -
*
1.27
2
-
*
2
-
*
2
F 0.1323
0.1480 3.36 3.76
3
-
*
2
-
*
2
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy ; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:
3
1
A
D
B
C
I
1
E
F
2
3
G
H
2
Style: Pin 1.Emitter 2.Base 3.Collector
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
2907