CYStech Electronics Corp.
Spec. No. : C334N3
Issued Date : 2003.05.22
Revised Date :
Page No. : 1/3
BZ5239CAN3/BZ5239CCN3
CYStek Product Specification
Dual zener diodes
BZ5239CAN3/BZ5239CCN3
Description
Two ZD5239 diodes are encapsulated in a SOT-23 small plastic SMD package. Two different pinnings
are available.
Pinning Outline
Description
Pin
BZ5239CA BZ5239CC
1 K1
A1
2 K2
A2
3 A1,A2
K1,K2
Thermal Characteristics
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -55~+150
C
Junction Temperature Tj ............................................................................................................. +150
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) Ptot
..
................................................................................ 230 mW
Thermal Resistance, Junction to Ambient
JA
......................................................543 /W
SOT-23
1
2
3
(1)BZ5239CA (2)BZ5239CC
Diode configuration and symbol
Marking:
Type Marking
Code
BZ5239CAN3 29A
BZ5239CCN3 29C
CYStech Electronics Corp.
Spec. No. : C334N3
Issued Date : 2003.05.22
Revised Date :
Page No. : 2/3
BZ5239CAN3/BZ5239CCN3
CYStek Product Specification
Electrical Characteristic
(V
F
=0.9V Max @I
F
=10mA.)
Maximum Reverse Current
Test Current
I
ZT
(mA)
Zener Voltage
V
Z
(V)
Z
ZK
I
Z
=0.25mA
(, max)
Z
ZT
I
Z
=I
ZT
(, max)
I
R
(A)
V
R
(V)
20
9.1 5%
600 10 3.0 7.0
Characteristic Curves
Power Derating Curve
0
50
100
150
200
250
0
50
100
150
200
Ambient Temperature --- Ta( )
Power Dissipation---PD(mW)
Forward Current vs Forward Voltage
0
50
100
150
200
250
300
0
200
400
600
800
1000
1200
Forward Voltage (mV)
F
o
r
w
ar
d C
u
r
r
ent (
m
A
)
Reverse Current vs Reverse Voltage
0
20
40
60
80
100
4000
5000
6000
7000
8000
9000
10000
Reverse Voltage (mV)
R
e
v
e
rs
e
C
u
rre
n
t
(m
A
)
CYStech Electronics Corp.
Spec. No. : C334N3
Issued Date : 2003.05.22
Revised Date :
Page No. : 3/3
BZ5239CAN3/BZ5239CCN3
CYStek Product Specification
SOT-23 Dimension
BZ5239CAN3: Common Anode. (Marking Code : 29A )
BZ5239CCN3: Common Cathode. (Marking Code : 29C )
*: Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1102
0.1204 2.80 3.04 J 0.0034
0.0070 0.85 0.177
B 0.0472
0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335
0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118
0.0197 0.30 0.50 S 0.0830
0.1083 2.10 2.75
G 0.0669
0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Marking:
L4_
Diagram:
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
29X
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